1. System Test Assembly 20th Oct 2009 M. Kurosawa

2. Current Status Performed system test with new FEM and software. Visit VICRISE on 13th Oct. 2-L and 8-R bus were shipped to VICRISE from Tokai. 1 set of bus was delivered on 16th Oct. Delamination blisters of left side bus.  Report to Tokai. Pt resistance thermometers were missing. Agency has gone bankrupt. Unclear delivery date.  Konno-san Visit assembly company (Hayashi-Seimitsu) on 19th Oct (Stephen, Konno, Takebe, Kurosawa). Found short between some bonding pads of readout chips and guard ring.

3. System Test FEM SPIRO Ladder 2 Right LV Left LV HV

4. System Test Sr 90 Can’t connect via JTAG. Optical Fiber? Swap the left / right optical cables.

5. VICRISE micro focus X-ray tv system Readout BUS (via hole) Look from an angle. plus or minus 60 degrees.

6. VICRISE BGA Defect BGA Reflow

7. VICRISE Mask Mounter Reflow Soldering Machine

8. Left Side BUS Ver 3.6 Delamination blisters after mounting

9. Extender Test Board DMM Set Up Measure resistance probe needle Measurement of resistance between test board pin and bonding pad with probe needle.

10. 55  53  53  54  1DATA_A21 54  2DATA_A19 53  3DATA_A16 53  4FAST_OR_A0 55  1 2 3 4 No disconnection

11. 70  68  60  70  88  1CLK 70  2NEVER_A 88  3STROBE 68  4DATA_RESET 60  5GTL_REF_A 70  1 3 4 5 2 No disconnection

12. Hayashi-Seimitsu Stephen, Konno-san, Takebe-san, Kurosawa visit Hayashi-Seimitsu. The gluing of sensor modules will be start today. Assembly of next ladder (Ladder5) will be complete in early November. Assembly of Ladder6 will be start after delivering of Pt resistance. Haki-kun and Kurosawa will visit Hayashi-Seimitsu. Wire bonding checker. Measurement of resistance of readout bus. Improvement of alignment software for sensor modules.

13. Hayashi-Seimitsu (Sensor Module #45)

14. Hayashi-Seimitsu (Sensor Module #33)

15. Hayashi-Seimitsu (Sensor Module #32)

16. Hayashi-Seimitsu (Sensor Module #15) Measure the resistance after wire bonding. If short was found, remove it with manipulator.

17. Summary Performed system test with new FEM and software. 1 set of bus was delivered on 16th Oct. Unclear delivery date for remained bus. Visit assembly company (Hayashi-Seimitsu) on 19th Oct (Stephen, Konno, Takebe, Kurosawa). Assembly of next ladder (Ladder5) will be complete in early November. Assembly of Ladder6 will be start after delivering of Pt resistance. Found short between some bonding pads of readout chips and guard ring. Haki-kun and Kurosawa will visit Hayashi-Seimitsu.