1. Rashesh Naik – 130410119045 Sujit Nakrani – 130410119046 Sachin Pal – 130410119047 Dhananjay Panchal - 130410119048 Structure – Properties- Performance Correlation

2. Structure – Property – Performance Relation Properties of a particular material are formed due to the internal structure It is basically related to the specific arrangement of the atoms

3. Structure – Performance – Performance Relation Property is a specific response which is offered by the material against the imposed external environment Apart from structures and properties, the other important components are processing and performance Structure of a material mainly depends on how the material is processed So the relation between structure,properties and performance are corelated

6. The material selection process The interrelationship between structure, properties and performance plays a very crucial role in the selection of the material Hence in order to select the proper material it is important to study and understand the relation The procedure in selecting the material is given as follows

7. The material Selection process Pick Application - Determine required properties Properties : mechanical, electrical, thermal, optical, magnetic. Properties – Identify the suitable material Material : structure, composition Material – Identify required processing Processing : changes the structure and overall shape Example – casting, sintering, forming, joining

8. (a) 30  m (b) 30  m (c) 4 m4 m (d) 30  m 00 6 2 3 4 5 0.010.11101001000 Hardness (BHN) Cooling Rate (ºC/s) The properties of a material depends upon a structure(strenght or hardness) The processing can change the structure of the material. It is evident from the graph above

9. Properties Some of the basic properties of a materials are as follows

10. Electrical Properties (of Copper): T (°C) -200-1000 Cu + 3.32 at%Ni Cu + 2.16 at%Ni deformed Cu + 1.12 at%Ni 1 2 3 4 5 6 Resistivity,  (10 -8 Ohm-m) 0 Cu + 1.12 at%Ni “Pure” Cu Electrical Resistivity of Copper is affected by: Contaminate level Degree of deformation Operating temperature

11. THERMAL Properties Space Shuttle Tiles: --Silica fiber insulation offers low heat conduction. Thermal Conductivity of Copper: --It decreases when you add zinc! Composition (wt% Zinc) Thermal Conductivity (W/m-K) 400 300 200 100 0 010203040 100  m

12. MAGNETIC Properties Magnetic Permeability vs. Composition: --Adding 3 atomic % Si makes Fe a better recording medium! Magnetic Storage: --Recording medium is magnetized by recording head. Magnetic Field Magnetization Fe+3%Si Fe

13. Optical Properties of Ceramic are controlled by “Grain Structure” Grain Structure is a function of “Solidification” processing! :

14. The end