1. I/UCRC CBSS New Proposal Presentation – April 2012Update on FY2007 programs NSF REU in Integrated Nanomanufacturing – an Introduction to Professor Bishop’s Laboratory and Atomic Scale 3D Printing Allisen Goncalves Western New England University David Bishop Materials Science Engineering

2. 2 Brief overview of presentation  Introducing myself  Background – high school to college  Previous research experience  This summer’s research laboratory  Expectations for summer research accomplishments  Positive and negative experiences so far Presentation OverviewNSF REU INM Introductory Day for RET Participants - July 5, 2016

3. Introducing myself  Ludlow High School  Ludlow, MA  Applied to many different colleges  Western New England University  Biomedical Engineering  Graduating May 2017  Graduate School for PhD  Need undergraduate research experience  REU programs  Eventually want to work in industry 3 IntroductionNSF REU INM Introductory Day for RET Participants - July 5, 2016

4. 4 Influencing Factors for choosing your field  Family influence  Father  Older sisters  Medical field + engineering = Biomedical engineering  Options for PhD  Biomedical engineering  Mechanical engineering  Electrical engineering InfluencesNSF REU INM Introductory Day for RET Participants - July 5, 2016

5. 5 Previous Research Experience – Summer 2015 National Institutes of Health (NIH) Laboratory for Integrative Neuroscience Dr. Veronica A. Alvarez Research Goals Study the effects of drugs (cocaine, ethanol) on synapses and neural connectivity in the brain Develop a mathematical model to simulate dopamine concentrations over time to fit to lab data Presentations  NIH Summer Poster Day Research ExperienceNSF REU INM Introductory Day for RET Participants - July 5, 2016

6. Professor Bishop’s Lab  Atomic Calligraphy  Writing with atoms  MEMS  Microelectromechanical systems 6 Summer ResearchNSF REU INM Introductory Day for RET Participants - July 5, 2016 Imboden, M. et al. “Atomic Calligraphy: The Direct Writing of Nanoscale Structures Using a Microelectromechanical System”. Nano Letters 2013 13 (7), 3379-3384.

7. 1 μm 7 Atomic Calligraphy Evaporation Source Nano Positioner FIB Milled Aperture MEMS Substrate Atomic Calligraphy – Top Side – 150 μm plate – ± ~ 10 μm range – ~130 μm writing area – Write on silicon nitride

8. Project Goals  Enhance throughput  Increase writing speed  Increase writing area  Multiple writers in parallel  Summer Project  Optimal bridge wire design  Consistent comb drive performance

9. PolyMUMPS Process  Layers of polysilicon  Oxide layers are eventually removed to separate layers 9 Summer Research GoalsNSF REU INM Introductory Day for RET Participants - July 5, 2016 NitridePoly 01st OxidePoly 12nd OxidePoly 2Metal

10. PolyMUMPS Process  Submerge device in 49% HF solution  removes oxide layers  Releases the moveable mechanical parts

11. Summer Project 11 NSF REU INM Introductory Day for RET Participants - July 5, 2016Summer Research Goals

12. Summer Project  Optical microscope image  SEM image

13. Comb drive actuators 13 NSF REU INM Introductory Day for RET Participants - July 5, 2016

14. Characterization of comb drives 14 Summer Research GoalsNSF REU INM Introductory Day for RET Participants - July 5, 2016

15. 4 terminal resistance measurements 15 NSF REU INM Introductory Day for RET Participants - July 5, 2016 Device Resistance Before Release Resistance After Release 210.63 Ω134 kΩ 315.75 Ω127 kΩ 624.02 Ω128 kΩ 7397.12 Ω124 kΩ

16. Galvanic corrosion Before releaseAfter release 16 NSF REU INM Introductory Day for RET Participants - July 5, 2016 Corrosion

17.  Great lab atmosphere  Great REU community  Working with MEMS  Getting to know the equipment 17 After 4 weeks, what are the highlights (positives) and the lowlights? Positives and Negatives NSF REU INM Introductory Day for RET Participants - July 5, 2016