1. Wafer Dicing and Final Report Cutting the antenna wafer into individual antenna

2. Pointed Hair Boss Gives a Pep Talk

3. Dilbert and Wally Deal with Highly Talented Co-Worker

4. Wafer Dicing

5. Wafer Dicing uses a Microautomation 1100 dicing saw

6. The wafer is mounted on blue wafer tape This keeps the cut antenna from flying off the tool during the cutting process

7. A video camera shows the location of the saw cut

8. A water cooled diamond blade is used to cut the silicon wafer

9. When complete, the wafer will be cut into individual antenna

10. Final Report One per team Must be done in PowerPoint format Must be submitted electronically Must include a statement verifying it is original work

14. Now is the time to start working on your PowerPoint presentation slides

15. PowerPoint Presentation Go to Engr 1202 ECE web site to view an example of PowerPoint presentation There are also examples posted outside the Cameron clean room Final report is due to me by 5:00 pm on –Group C Tuesday 2/16 –Group B Tuesday 3/29 –Group A Tuesday 5/2