1. AIDA organization WP1: Project management and communication Laurent Serin, LAL-CNRS (scientific coordinator) Ties Benhke, DESY & Paul Soler, Glasgow university, (scientific deputy coordinators) Svet Stavrev, CERN (administrative coordinator) NetworkingTransnational accessJoint research WP2: Common software tools (Frank Gaede, DESY, Pere Mato, CERN) WP3: Microelectronics and interconnection technology (Hans-Gunter Moser, MPG, Valerio Re, UNIBG) WP4: Relation with industry (Jean Marie Le Goff, CERN) WP5: Transnational access DESY (Ingrid Gregor, DESY) WP6: Transnational access CERN (Horst Breuker, CERN) WP7: Transnational access European irradiation facilities (Marko Mikuz, JSI) WP8: Improvement and equipment of irradiation and test beamlines (Michael Moll, CERN) WP9: Advanced infrastructure for detector R&D (Marcel Vos, IFIC Valencia, Vincent Boudry, LLR-CNRS) Monthly meeting to follow projects and solve issues (technical/administrative) User Selection Panel meeting in Sept 2011 : refined procedures + I. Vila, Governing Board chairman Meeting every three months : monitor WP scientific activities : milestones, deliverables, reports….

2. WP3 Objectives Task 3.1: Coordination and communication To coordinate and schedule the execution of the WP tasks To monitor the work progress and inform the project management and the participants within the WP To follow-up the WP resource utilization To prepare the internal and Deliverable Reports Task 3.2: 3D Interconnection Creation and coordination of a framework to make 3D interconnection technology available for HEP detectors Organisation of a network of contacts with industry to enable fabrication of sensors and electronics optimized for 3D interconnection Assess 3D vertical integration techniques enabling the HEP community to advance the state of the art of particle detectors Task 3.3. Shareable IP Blocks for HEP Creation and coordination of a framework for the design of low and medium complexity microelectronics libraries and blocks in advanced submicron technologies to be made available to the community of users in HEP Organization of the design and qualification of a set of blocks using selected and qualified technologies Distribution and documentation of the library of functional blocks Organisation of regular Microelectronics Users Group meetings to exchange information, plan and coordinate actions related to the creation of a shared library of macro blocks. Participants: CERN, CEA, CNRS, MPG-MPP, UBONN, INFN, AGH-UST, CISC, UB, UU, STFC Associates: IPASCR, NTUA, UNIGLA, UNILIV, FOM 2 AIDA meeting 30.3.2012 DESY, Hamburg

3. 3D Interconnection How to integrate good sensors and good electronic circuits? 3D Interconnection: Two or more layers (=“tiers”) of thinned semiconductor devices interconnected to form a “monolithic” circuit. Many ways to do it Si pixel sensor BiCMOS analogue CMOS digital 3 AIDA meeting 30.3.2012 DESY, Hamburg

4. WP3 strategy We agreed upon a “via last ” approach to 3D integration to build a 2-layer device in heterogeneous technologies, where the two layers are fabricated independently, and TSVs and interconnections are made as the last steps of the process. The “via last” approach could be applied to different device structures A more conservative approach can be based on “mature” technologies, with ~50 µm pitch for bonding and (peripheral) TSVs. This seems to be already commercially available, as confirmed by several R&D activities in our community A more aggressive approach could go for real fine pitch and small TSV. This will target very future sensors (ILC, CLIC) and interconnections of individual pixels (like in 3D CMOS or SOI sensors). This has certainly higher profile and potential, higher costs and need of special ASICs. We may agree to follow both approaches, closely monitoring the evolution and the availability of 3D technology in industry. Of course, this cannot be done with AIDA resources only; WP3 could support other R&D projects and contribute to the dissemination of results and know-how We asked the participating institutes to propose projects In a series of meetings we discussed and evaluated the proposals (including their funding) One aspect was to merge similar proposals or ask participants to partner, in order to focus the resources 4 AIDA meeting 30.3.2012 DESY, Hamburg

5. Bonn/CPPM AIDA meeting 30.3.2012 DESY, Hamburg 5 TSVs in ATLAS FEI4 chips and bump bonding to sensor Large tapered vias by IZM. Successfully tested with FEI3 ‘mature’ technology FEI4 ASICs exists on wafers (3 reserved for project) Run with IZM will start soon => results end of 2012 Run with LETI is planned => on schedule

6. Sub-task Leader:Davide Boscherini (INFN Bologna) Participants:Bulgaria: INRNE; Greece: NTUA, AUTh, Demokritos, NCUA; Israel: Weizmann, Technion; Italy: INFN-Bari, -Bologna, -LNF, -Naples, -Rome2 Deliverable: Infrastructure for the GIF++ Facility Needed: Construction of GIF++ Facility !! (SPS H4 beamline) Task 8.5: General infrastructure for test beam and irradiation lines 8.5.3. GIF++ user infrastructure 6 Presentation: G.Mikenberg, Weizmann

7. GIF++ Specifications Source – 137 Cs, ~7-10 TBq – Up to ~2 Gy/h at a distance of 50 cm – 662 keV photons – 30 y isotope half-life Particle Beam – EHN1 location in the SPS H4 beam – 100 GeV muons – 10 4 particles per spill traversing 10x10 cm 2 – available ~6-8 weeks/y (in 2-week periods) Max. expected doses at sLHC Equivalent time at GIF++ (~ 50 cm from source) Si-trackers: ~ MGy/y>> years Calorimeters: ~ 20 kGy/y< 1 year Muon systems: ~ 0.1 Gy/y~ minutes Lateral view of Source and Beam Top view of Source and Beam

8. AIDA 1st Annual Meeting, Otilia Militaru, UCL Belgium 2011: During the first year of AIDA, one project has been submitted to our task for neutron irradiation (15 hours) Karlsruhe: Irradiation of two sCVD diamonds to quantify radiation damage of energetic neutrons to diamond detectors. - Measurement of leakage current during irradiation with a readout system similar to the used system in CMS Beam Condition Monitor.

9. AIDA 1st Annual Meeting, Otilia Militaru, UCL Belgium High Flux Proton beam line (HF-PIF) 22-65 MeV protons Copper Diffuser 0.2 mm thick. Beam dump I FC 148 cm Sample support, the active surface 3.4 cm diameter I coli Both the beam dump (FC) and the collimator are cooled with room T water

10. AIDA 1st Annual Meeting, Otilia Militaru, UCL Belgium High Flux Proton beam line (HF-PIF) Dosimetry: On-line monitoring of the current on both beam dump and collimator; For a maximum current of 5 µA measured on the beam dump: To reach 10 17 p/cm 2 ~ 8 hours For silicon samples we use the proton induced displacement damage coefficient to evaluate the fluence in 1 MeV eq. n/cm 2

11. https://indico.cern.ch/getFile.py/access?contribId=58&sessionId=5&resId=0&materialId=slides&confId=158341