1. LengthWire Length Bond Wire Diameter 0.8 mil1.0 mil1.2 mil1.3 mil Resistance (Ohm) 5 mm0.3830.2570.1980.180 2 mm0.1540.1030.0790.072 Inductance (nH) 5 mm6.1035.8695.6685.576 2 mm2.0891.9961.9151.879 Capacitance (pF) 5 mm0.2020.2420.2790.299 2 mm0.1040.1220.1400.149 Mutual Inductance (nH) 5 mm3.3203.3183.3143.311 2 mm0.97980.97870.97700.9758 Mutual capacitance (pF) 5 mm-0.0374-0.0488-0.0602-0.0698 2 mm-0.0204-0.0261-0.0327-0.0364 MOSIS packaging vendors use 1 mil gold wire by default. Other bond wire diameters (smaller 0.8 mil or larger 1.2 or 1.3 mil) may be used in special cases. See Electrical Package Characterization. Under "Additional Information" select Plastic Packages' Electrical Performance: Reduced Bond Wire Diameter (PDF).Electrical Package Characterization Powersupply Decoupling Mosis IC Package Electrical Parasitics

3. TI AN-1205 Electrical Performance of Packages – RLC Values for lead-frame based packages and micro SMD packages

4. TI RLC Data for CSP Packages

5. TI RLC Data for BGAs without planes

6. TI IC Package Wirebond Inductance

7. Intel Multilayer Package Lead Electrical Characteristics

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9. Intel Crosstalk Package Electrical Characteristics (continued) Capacitive Coupling

10. Intel PQFP Package Electrical Parasitics

11. Intel QFP Package Electrical Parasitics Intel SQFP/TQFP Package Electrical Parasitics

12. Intel Package I/O Lead Electrical Parasitics for TCP Packages

13. Intel Package Core Power Loop Electrical Characteristics

14. Intel CQFP Electrical Data (a mature package)

15. Intel MM Electrical Data (a mature package)

16. Intel PQFP Electrical Data (a mature package)

17. Intel PLCC Electrical Data (a mature package)

18. Intel QFP Electrical Data (a mature package)

19. Intel SQFP/TQFP Electrical Data (a mature package)

20. Intel SOP Electrical Data (a mature package)