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Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB.

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Presentation on theme: "Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB."— Presentation transcript:

1 Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB

2 TK Module design parameters from Nov 2009 TUPO presentation by Hans Postema 2.5 cm strip length Sensor glued on 2 TPG strips TPG strips on the backplane side TPG strips connected to cooling block on cooling pipe Hybrid with apv’s glued on sensor, strip side, above the TPG strip DC-DC converter glued on the TPG strip of the sensor. One DC-DC converter powers 2 hybrids 2/8/2010Susanne Kyre UCSB2

3 Dimensions and Materials PartMaterialArea [mm 2] Thickness [mm] thermal conductivity [W/mK]Power [mW] SensorSilicon84.5 x 100.30.2148310 ChipSilicon10 x 120.2148125 DC-DC coilSilicon12 x 129148225 HybridG10 and copper 85 x 14 107 x 30 (ears)0.8 30.8 in plane; 0.37 out of plane Support stripTPG116 x 141 1500 in plane; 20 out of plane Epoxy thermally conductive epoxyall glue joints.051.5 Cooling BlockBeryllium Oxide 13.5 x 14 1.7mm cooling tube dia.4248 2/8/20103Susanne Kyre UCSB

4 Module FEA 2/8/2010Susanne Kyre UCSB4

5 Result of steady state thermal analysis Maximum Temperature: -27.0°C (at center readout chips on hybrid #2) 2/8/2010Susanne Kyre UCSB5

6 Result of steady state thermal analysis Maximum Sensor temperature: -28.3°C 2/8/2010Susanne Kyre UCSB6

7 TK Rod design parameters 12 Modules per rod (6 facing up, 6 facing down) One cooling loop per rod Cooling block temperature at inlet: -30°C Cooling block temperature at outlet: -25°C Sensor, DC-DC and Readout chip power as in Module analysis 2/8/2010Susanne Kyre UCSB7

8 Cooling block temperatures From Module analysis: Heat flux through cooling block-pipe interface differs with cooling block location Assume: ΔT between cooling blocks is proportional to difference in heat flux between cooling blocks 2/8/2010Susanne Kyre UCSB8

9 Rod FEA 2/8/2010Susanne Kyre UCSB9

10 Result of steady state thermal analysis Maximum Temperature: -24.0°C at hybrid #2 on module closet to inlet/outlet 2/8/2010Susanne Kyre UCSB10 Max. Temp

11 Result of steady state thermal analysis Maximum Sensor temperature: -25.1°C at sensor closest to inlet/outlet This sensor also has the largest temperature gradient: 3.0°C across the sensor 2/8/2010Susanne Kyre UCSB11

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