1. Stave Emulator for sLHC Prototyping L. Gonella, A. Eyring, F. Hügging, H. Krüger Physikalisches Institut, Uni Bonn

2. Stave Emulator Test Bench  The stave emulator is a test system which allows to evaluate system aspects and custom developed hardware for the ATLAS Pixel Detector for sLHC, such as  physical layer data transmission: LVDS drivers/receivers, cables, connectors, …  data coding schemes: raw, 8B/10B, 64B/66B, …  powering concepts: serial, dc-dc, switched cap, …  DCS concepts: voltage monitoring, control of bypass switch, reset, …  data management of the End-Of-Stave controller,...  …  It uses  FPGAs to emulate the modules and the end-of-stave controller  interconnection boards to provide support for different cable and connector options, LVDS transceiver chips, power supply options (parallel, DC/DC or SP), AC-coupling  a DCS test board (COBOLT) developed in Wuppertal providing multi-channel ADC and GPIO to test DCS functionalities 2L. Gonella - ATLAS Upgrade Week - Nov. 2009 → flexible and realistic test bench

3. Stave Emulator End-Of-Stave emulator unitModule emulator unit 3L. Gonella - ATLAS Upgrade Week - Nov. 2009

4. Hardware  FPGA Boards  Module  Spartan 3E FPGA  Commercial FPGA board (Trenz TEO300B)  Spartan XC3S1600E, 64 Mbyte DDR RAM, 32 Mbit Flash, USB interface  Approx. size of a 2x2 FE-I4 module  End-Of-Stave Controller  Virtex4 FPGA  FPGA board developed in Bonn for read-out of DEPFET modules  XILINX Virtex 4 LX40-1148, 288Mbit RLDRAM – Should be able to handle >14.4Gbit/s, µC-based system monitor (ADM1062), USB 2.0 connector, 16Mbit async. SRAM, EUDET TLU connection, Multiple high speed connectors  Interconnection boards  Custom developed  Tailor different test wishes (data transmission, powering option, …)  Define successive stave emulator versions  Iterate the design of interconnection boards to add more functionalities and custom developed hardware when available 4L. Gonella - ATLAS Upgrade Week - Nov. 2009 VIRTEX4 board Spartan 3E board

5. Firmware and Software L. Gonella - ATLAS Upgrade Week - Nov. 20095  Firmware for data transmission tests  PRBS of different length, 8b10b encoded data  Bit Error Rate firmware for Virtex4  uses PRBS;  clock frequency synthesized with Digital Clock Manager;  compares data out with data in;  delay adjustment between data out and data in done in 2 steps: coarse delay = 1clk period, fine delay = 75ps  Adapted FE-I4 data output code for Spartan3E data out data in error  Software  Application developed with C++ and Qt (GUI) allows to download firmware on the FPGA, read/write data from/to FPGA

6. Baseline Design L. Gonella - ATLAS Upgrade Week - Nov. 20096  “6 modules-stave”  Connection EoS - module using Type 0 cable  Powering  parallel  serial using commercial shunt regulator  commercial bypass transistor on modules to test protection option  DC-coupled data transmission with different LVDS transceiver chips  on End-Of-Stave side: commercial FIN1104MTC transceiver chip  on module side: commercial FIN1104MTC or IBM 130nm transceiver chip (i.e. FE-I4 LVDS TX and RX)  NTC to measure module temperature V4 FPGA board FPGA V4 DCS card ADC GPIO PWR Spartan3E FPGA board FPGA S3 NTC power … … shunt/bypass 6 modules Type 0 FIN1104MTC IBM 130nm TxRx chip

7. Tests with Baseline Design L. Gonella - ATLAS Upgrade Week - Nov. 20097  Bit Error Rate Tests  study the performance of the LVDS TX and RX for FE-I4  Comparison with commercial transceiver chip  V dd = 1.2-1.5V  I bias higher than nominal  parallel powering, DC coupled data transmission, PRBS8-16-24, 160Mbps  IBM 130nm transceiver chip runs error free with PRBS24 at 160Mbps with V dd = 1.2V(38 e 12 bits transmitted) Nominal1.2V1.5V RXI bn -35uA-100uA-150uA I bp 35uA60uA90uA TXI bp 60uA 90uA U bias 600mV (1.2V) 750mV (1.5V) 600mV750mV  Tests with COBOLT  Serial powering chain  Tested DCS functionalities  module temperature measuring with NTC  control of bypass transistor  monitoring of module voltage through bypass control line

8. Next Stave Emulator Version L. Gonella - ATLAS Upgrade Week - Nov. 20098  Second version of interconnection board for module emulator unit available using more custom-developed hardware  IBM 130nm LVDS transceiver chip  External biasing circuitry for RX inputs (  AC-coupled data transmission)  IBM 130nm LVDS tri-state driver  Shunt-LDO regulator  Test plan  AC-coupling at TX/RX level  Multiplexing of data out of different FEs  Test of Shunt-LDO regulator in a real serially powered system  Test of Shunt-LDO pure LDO regulator operation with shunt capability switched-off possible RX inputs self-biasing integrated circuit for FE-I4  Goal  Set up a serially powered stave with AC-coupled data transmission and FE data output multiplexing, using real FE-I4 components  FE-I4 data output block code in Spartan3E, Shunt-LDO regulator, LVDS TX and RX

9. Towards sLHC Stave Prototyping L. Gonella - ATLAS Upgrade Week - Nov. 20099  Before FE-I4  Implement more FE-I4 code in the Spartan3E  next step: command decoder  useful also for debugging/developing FE-I4 test systems  Start working on End-Of-Stave controller  Try to implement GBT functionalities (?)  Keep qualifying custom developed hardware in a pixel stave environment  Module Protection Chip for serial powering, cables/flex and connectors, …  After FE-I4  The End-Of-Stave emulator unit can be used as lab DAQ system for real FE-I4 modules/stave

10. Flex for sLHC outer layers L. Gonella - ATLAS Upgrade Week - Nov. 200910  Double sided stave  32 modules/stave  4-chip FE-I4 modules  I/O  40MHz clock and CMD in go in parallel to all 4 chips  Each line has a single termination resistor on the module  There is single power input and a single return for the module, which must carry 2.5A in the case of serial power or 1.25A in the case of DC-DC converter  One output per module at 320Mbps

11. Flex on Module Option L. Gonella - ATLAS Upgrade Week - Nov. 200911 35.9 42.6 38.0 Active 33.9 x 40.6 10.0 15.0 Flex pigtail (connector plugs into page)‏ Pixel orientation Flex down to chip w-bonds (vertical inter-chip gap 0.1mm)‏ Maurice

12. Module Flex Option: Loaded Modules L. Gonella - ATLAS Upgrade Week - Nov. 200912 glue chips sensor flex connector Compressed scale 1.0 mm stiffener passives Maurice

13. Flex Along the Stave Option L. Gonella - ATLAS Upgrade Week - Nov. 200913  Example of possible design considering serial powering  1 flex/half stave (i.e. 4 flex/stave)  Each flex is made of 4 flexes  1 bottom flex (blue): power lines  3 top flexes (red) glued on the power flex:  data (x2) at the sides  NTC, HV, bypass in the middle  Space in between top flexes allows to wire bond to power lines Bonn

14. Flex Along the Stave Option: Loaded Modules L. Gonella - ATLAS Upgrade Week - Nov. 200914 module flex Bonn