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Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 1 Cryolab Cooling of electrically insulated.

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Presentation on theme: "Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 1 Cryolab Cooling of electrically insulated."— Presentation transcript:

1 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 1 Cryolab Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements Eisel T., Bremer J., Burghart G., Feigl S., Haug F., Koettig T. CERN, 1211 Geneva 23, Switzerland thomas.eisel@cern.ch

2 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 2 Cryolab Electrodes integrated in AEgIS Cooling source: Dilution Refrigerator (DR) Cooling design: Sandwich Theory of dynamic measurements Simulation Results of dynamic measurements Discussion/ conclusion Content Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements

3 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 3 Cryolab AEgIS 1 experiment at CERN Scientific goal: influence of g upon antimatter Penning trap at 100 mK  deceleration of particles AEgIS Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements DRMC 1 http://aegis.web.cern.ch/aegis/home.html

4 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 4 Cryolab Standard cooling source: DR 1 – (0.002 to ~ 0.5) K – Continuous operation – Dilution of 3 He in 4 He – 0.0001W @ 0.05 K Dilution Refrigerator Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements 1 http://cdms.berkeley.edu

5 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 5 Cryolab Sandwich Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements 1 G. Frossati. Experimental Techniques: Methods for Cooling Below 300 mK. Journal of Low Temperature Physics, Vol. 87, Nos. 3/4, 1992

6 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 6 Cryolab Antimatter creation/ annihilation (Illuminati) is periodically (200 s) Dynamic measurements – Information on how fast inserted heat can be transferred – Key property which determines the propagation-speed of a heat wave in an homogeneous material: material’s thermal diffusivity a ( m 2 / s )... thermal conductivity ρ... density c p... specific heat capacity Theory of dyn. meas. Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements Sandwich’s thermal diffusivity a*

7 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 7 Cryolab Theory of dyn. meas. Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements Semi-infinite rod (one dimensional) One end imposed temp. function T H =f(t) (sin, pulse ) T C =f(t) at certain distance  Alteration of the original function (phase shift, attenuation ) material’s thermal diffusivity a can be analytically solved

8 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 8 Cryolab Simulation Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements Sandwich is not a semi-infinite rod (T MC =const) Imposed temp. function T H is not sinusoidal (square heat wave)  Simulation (MATLAB ®,pdepe): – T H (t)=T H,meas (t) – T MC =T MC,meas – x S =x Sapphire – T C,sim =T C,meas x therm Sandwich’s thermal diffusivity a*

9 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 9 Cryolab Results Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements

10 Studies of the Cryogenic Part with Load Lock System T. Eisel, CERN TE-CRG-CI AEgIS November 11 th, 2010 Page 10 Cryolab For temperatures > 30 mK an indium deposition improves the diffusivity significantly (about a factor of 2) The surface roughness influences the diffusivity only minor  contrary to static measurements 1 ; conclusion: heat transfer mechanisms of dynamic and static measurements are different Discussion/ conclusion Cooling of electrically insulated high voltage electrodes down to 30 mK – Dynamic measurements 1 Eisel T., Bremer J., Burghart G., Feigl S., Haug F., Koettig T., Cooling of electrically insulated high voltage electrodes down to 30 mK. Proceedings of the twenty third cryogenic engineering conference, Poland; 2010. Sandwich’s thermal diffusivity is more than 6 orders of magnitude smaller than the thermal diffusivity of copper or sapphire  thermal boundary resistance The diffusivity is not constant, it diminishes with reduced temperature  thermal boundary resistance  The fastest heat propagation could be achieved along a Sandwich using indium deposited and polished sapphire plates

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