1. NOC keyhaneh kia – 94/1

2. increasing the number of cores on chip 3D NOC. 3D NOCinter net., intra net.

3. Sub title  Topology  Floor planning

4. Topology  Mesh: simplicity, scalability.  Ring: simplicity, low delay.  BFT: high speed, load balancing.  Torus  Hierarchical models  new models

5. Communication link  Wired bus based solder balls through silicon via: tsv  wireless capacitive coupling inductive coupling optical links

6. Weird net. -Lack of scalability and flexibility. -TSV clustering - power consumption & area

7. Wireless net. -inductive coupling clustering -optical net. waveguide crossing O/E centralized controller

8. END