1. Wire Pull Test The wire pull test is performed using a Pull Tester (BT-14, DAGE 2400 PC, DAGE 4000) and a Pull Hook (performed by placing the hook 90° beneath the wire). The test is consistent with the following methodology: 1. Measure the Loop height in [mil] or [um]. 2. Fix Hook low limit according to loop height and package. 3. Perform Pull test. The Pull force (F) is measured in [gr.]. 4. The force value obtained is compared to the BL (Breaking Load) of the wire in [gr.]. 5. The Pull test is performed in 3 optional methods: a. Stitch pull test (the hook is placed close to the 2nd bond) b. Midspan pull test (the hook is usually placed 1/3 of the way between the 1st and 2nd bonds) c. Neck pull test (the hook is placed right above the 1st bond)

2. Wire Pull Test - Failure Mode Grading Method The failure modes used in the wire pull test help to evaluate the bonding results and assess the bonding process. GradeBroken atReasonQuality 1Ball liftBad processPoor 2Ball neckH.A.ZGood 3WireDepends on conditionsVery good 4WeldWeld deformationGood 5Stitch liftBad processPoor Factors affecting the F: Wire diameter Wire length Loop height Pad to lead plane gap Process Hook location Tester calibration, accuracy and vacuum

3. Ball Shear Test The ball shear test is performed using a Shear Tester (BT-24, BT-2400 PC, DAGE 4000) and a Shear Tool. The test is consistent with the following methodology: 1. Measure ball diameter (D) and ball height (H), and then calculate the "bonded area" (S). S = [(D^2)/4]*p in [mil]^2 or [um]^2. 2. Fix shear height according to ball height and passivation thickness. 3. Perform Shear force test. The Shear force (F) is measured in [gr.]. 4. The force value obtained is calculated as follows: S/u_a (Shear per unit area)= Shear /[pD2/4]. Reasonable strength range = 5.5 and above [gr.]/[mil]2

4. Ball Shear Test - Failure Mode Grading Method The failure modes used in the ball shear test help to evaluate the bonding results and assess the bonding process. Failure Modes: Ball lift indicates bad results (low F) Gold remain indicates good results ( high F) Pad peeling or cratering indicates a flow that should be investigated Factors affecting the F: Bonded area (D) Process Shear height (5 um) Tool size (min 2X D) Ball tool centering Cleanliness Tester calibration, accuracy and vacuum