1. CMS Phase 2 Tracker R&D R. Lipton 2/27/2014
Both CMS and US CMS are trying to understand and manage phase 2 R&D. Duccio has prepared a summary of work and countries – US has nominal involvement in many areas, most are fairly marginal. The only area where the US has a central role is in L1 track finding.
R. Lipton

2. 1.1) R&D on planar silicon sensors
Strip sensors for 2S module. Pixel and strip sensors for PS module.
MS Tender 2017/2018. Finalize details. Try 8”. Qualify vendors. 1 MCHF.
2.1) FE ASICs
CBC for 2S module, MPA and Ssa for PS module. Concentrator.
: finalize specs. 2016: final version of CBC, first full-size proto of MPA, SSA and concentrator. 2018: full chipset MCHF.
2.2) ASICs for auxiliary electronics
lp_GBT, DC-DC converter ASIC, small-size optical link
2.3) Hybrids
FE hybrids and Service Hybrids for 2S and PS. Same technology.
MS open. 2014: establish flex demonstrator. Close MS. Tender for dvelopment Finalize and select vendors for production MCHF
2.4) Macro-Pixel Sub-Assembly
Just started MCHF.
2.5) TSVs – generic R&D
Option. Could be used in the MPA – implement full connectivity along z, improve chip design (powering)
R. Lipton

3. 3.1) Module design and assembly
Thermal performance, CTE match, assembly precsion....
Concepts defined : optimize and validate with full size realistic prototypes. Qualify for radiation and cold. Evolve adapting to development of active components MCHF
3.2) Module prototyping and testing
Test module/system functionality. Develop test systems.
2S mini-module tested and validated : full-size 2S module, PS mini-module. Keep up with developments MCHF.
4.1) Support structures - ??
Develop concept for support structures. Module mounting, services, cooling segmentation and cooling contacts.
Concepts defined. For TOB and TEC, two alternatives for TIB : choose TIB concept. Study PS module mounting, arrangement of services and cooling segmentation : finalize and prototypes where needed MCHF
4.2) CO2 cooling
Develop concept for ~100 kW CO2 cooling system
Mostly design work. May require some dedicated studies / lab tests. In common with ATLAS. Up to 0.5 MCHF.
5.1) prototype DAQ
DAQ chain based on uTCA, compaible with GBT.
GLIB-based proto developed and used in DESY test beam. 2014: deploy in hybrid and module test systems, evolve to large-size modules : adapt to evolving hardware; migrate to FC7.
5.2) L1 track finding
Demonstrate performance and build demontrator.
Two concepts under study. At least one demonstrator for TDR. 0.5 MCHF each.
5.3) Advanced AM chips – generic R&D so far
Would be needed for the AM-based concept. Baseline not yet defined MCHF.
R. Lipton

4. TSVs
We had originally planned to collaborate with CERN on the TSV work based on the 3T chip. The vendor doubled his price and we had to drop out of that phase. I hope to keep this work going in the US, funds are still allocated. An obvious possibility is to demonstrate insertion of TSVs in the PSI46 chip – which can then be bonded to sensors and tested. This is synergistic with the TSV interests of the phase 2 pixels. I have written to Jorgen Christianson, Roland Horisberger, Gino Bolla so far with no response…
R. Lipton

5. “Ideally like to do”
In the context of the Long Barrel (LB) design we worked on the chip design, rod supports, thermal modeling and testing, module structure, and off-detector track finding. Currently in the Barrel-Endcap (BE) we are working on:
Thermal tests of materials and interfaces
Fabrication of bump bonded dummy structures
Off-detector tracklet-based track finding
It is clear that we will not have the breath of involvement in the BE design that we had in the LB. In the outer tracker we could additionally contribute to:
PS Module design – this appears limited by the CERN design of chip, hybrids, and overall structure
TSV implementation
Rod support design and fabrication
More direct design work on the scale of the Long Barrel seems difficult at this point.
R. Lipton

6. Pixels
The forward pixels are more open as they are not a historically CERN project. We could begin to contribute in a more general way to:
Forward disk extension mechanical design
Module design
Thermal design
TSV implementation
Power delivery
Chip design (via RD53)
Sensor design and fabrication (depending on vendors)
+ R&D on active edge/3D devices and large area arrays
R. Lipton