Presentation is loading. Please wait.

Presentation is loading. Please wait.

Piero Belforte, HDT 1999 DYNAMIC MODELING Emmanuel Leroux, Sergio G. Rocco THOMSON-DASSAULT MODELING MEETING DAY 25.

Similar presentations


Presentation on theme: "Piero Belforte, HDT 1999 DYNAMIC MODELING Emmanuel Leroux, Sergio G. Rocco THOMSON-DASSAULT MODELING MEETING DAY 25."— Presentation transcript:

1 Z U K E N R E D A C ZUKEN-REDAC ACTIVE COMPONENTS’ DYNAMIC MODELING APPROACH Emmanuel Leroux, Sergio G. Rocco THOMSON-DASSAULT MODELING MEETING DAY 25 January 1999

2 Z U K E N R E D A C ZUKEN-REDAC HDT Founded in 1990 to develop and market high-performance EDA tools Focused on: –signal integrity –hardware modeling –design & validation of digital systems –EMC/EMI issue

3 Z U K E N R E D A C ZUKEN-REDAC The STRATEGY SPRINTfast algorithm SIGHTSfriendly waveform viewer TDRinstrumentation interfaces MOD_ENVaccurate modeling

4 Z U K E N R E D A C ZUKEN-REDAC Modeling Stages SPICEIC oriented IBISBehavior oriented SPRINTDynamically measured

5 Z U K E N R E D A C ZUKEN-REDAC USERS ’ REQUIREMENTS QUALITYExperimental measurements DELAYAutomated process COSTPartnership commitments

6 Z U K E N R E D A C ZUKEN-REDAC CONTENTS INTRODUCTION DISPERSION OF ELECTRICAL PARAMETERS OF COMPONENTS A MODELLING METHOD BASED ON TDR A MORE COMPLETE MODEL CONCLUSION, A METHODOLOGY IS PROPOSED

7 Z U K E N R E D A C ZUKEN-REDAC INTRODUCTION To simulate Printed Circuit Boards There is a need for realistic components’ models You have: SPICE, IBIS But: Components suffer from dispersion of their electrical parameters Solution: A modeling methodology well adapted to EMC & high speed designs

8 Z U K E N R E D A C ZUKEN-REDAC DISPERSION OF COMPONENTS’ ELECTRICAL PARAMETERS Unloaded output voltage Rise & fall times Clamping diodes Input threshold Input or output capacitance

9 Z U K E N R E D A C ZUKEN-REDAC A MODELLING METHOD BASED ON TDR: description

10 Z U K E N R E D A C ZUKEN-REDAC A MODELING METHOD BASED ON TDR: CMOS input

11 Z U K E N R E D A C ZUKEN-REDAC A MODELING METHOD BASED ON TDR: CMOS input

12 Z U K E N R E D A C ZUKEN-REDAC A MODELING METHOD BASED ON TDR: CMOS output

13 Z U K E N R E D A C ZUKEN-REDAC 0.010.110.210.310.410.510.600.700.800.901.00 FREQ[GHz] -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 10.00 dBV IBIS-like model Enhanced model measured Validity limit for IBIS-like model Validity limit for Enhanced model Comparison between an IBIS-like and an enhanced model

14 Z U K E N R E D A C ZUKEN-REDAC A MORE COMPLETE MODEL

15 Z U K E N R E D A C ZUKEN-REDAC Example of special component model AC02 (four NOR): 1 2 3 45 67 gnd vcc standard receiver model 8 9 1011 12 13 14 R 1V 0V Delay 2 3 1 Single NOR model Four NOR models A B OUT 0 0 1 1 0 0 0 1 0 1 1 0 standard driver model pin crosstalk model.. timing/logic core

16 Z U K E N R E D A C ZUKEN-REDAC CONCLUSION & PROPOSAL FOR AN INDUSTRIAL USE OF THE METHODOLOGY A modeling method permits to avoid the dispersion of certain electrical parameters of components and can be used by all HDT tools and THRIS environment But it can not be applied to all components placed on an industrial board Solution: a methodology that uses standard libraries with SPICE or IBIS models for most of the board ’s components builds enhanced models for critical components (for example improving existing IBIS models) using Models provider (for instance HDT)


Download ppt "Piero Belforte, HDT 1999 DYNAMIC MODELING Emmanuel Leroux, Sergio G. Rocco THOMSON-DASSAULT MODELING MEETING DAY 25."

Similar presentations


Ads by Google