1. Modeling All Needed Components Y PRESTO models come from: Ý Layout extraction Ý PRESTO libraries: active devices and packages Ý 20 and 3D field solvers Ý Vendor data, data sheets, IBIS Ý Spice analysis Ý Measurement of actual devices 20 of 52

2. Complex Passive Device Models From Field Solvers Y The package: 2 power, 3 ground planes, 299 pins, POA package Y The modal. 16.700 R's end L's, 38 drivers Y The simulation: 2,500 time points; took 23 minutes on an HP 750 workstation 21 of 52

3. Active Device Models Y Models taken from PRESTO library - behavioral models for common logIc families. Y Models based on vendor-supplied data: Ý Datasheets Ý IBIS Ý Spice Y Models based on TDR/TDT measurements: Ý Distributed input/output RC, not lumped Ý True clamp diode behavior 22 of 52

4. Active Device Measurement: CMOS TDR Input Response 23 of 52

5. TDR Measurement Setup for Active Devices 24 of 52

6. CMOS Input Model 25 of 52

7. ECL Output Model 26 of 52

8. Pin Bouncing Effect 27 of 52

9. Measurements of True Clamp Diode Behavior ACT Power and Ground Clamps 28 of 52

10. Effect of Slow Clamping on Signal Integrity 29 of 52

11. Ground Plane Modeling Y Power and ground planes can be represented by a mash of lossy transmission lines for SPRINT simulation. 30 of 52

12. TDR Curve Measuring Behavior of the Ground Plane 31 of 52

13. Ground Plane Modeling Y Fitting the Model to the TDR Measurement 32 of 52

14. Ground Plane Modeling Y Comparison of Simulation and Measurement 33 of 52

15. Point-to-Point ATM Interconnects 34 of 52