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Characterization of Circuit Components Using S-Parameters

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Presentation on theme: "Characterization of Circuit Components Using S-Parameters"— Presentation transcript:

1 Characterization of Circuit Components Using S-Parameters
Chapter 1

2 Topic S-Parameters S1P S2P Y-Parameters Components Wires Inductors
Resistors Capacitors S-parameter Extraction

3 One-Port S-Parameter Incident wave (V1+) is Vin/2 (as if Zin=RS)
Voltage at the input of the receiver is Zin/(Zin+RS)Vin Vin=V1-+V1+ V1-=Vin -V1+ V1-= Zin/(Zin+RS)Vin- Vin/2 =(Zin-RS)/[2(Zin+RS)]Vin V1-/ V1+ =(Zin-RS)/(Zin+RS)

4 One-Port S-Parameter Series RLC with resonant frequency at
Resistance at resonant frequency: RL

5 Design a Series RLC Resonant Circuit
L1=2.4 mH RS=50 Ω fres=1 MHz What is C1?

6 Design a Series RLC Resonant Circuit
L1=2.4 mH RS=50 Ω fres=1 MHz What is C1? C1=1/(Lω2res)

7 One-Port S-parameter Power reflected to the source Power delivered
to the load

8 Two-Port S-parameter Actual voltage measured at
Incident Wave generated by Vin Incident wave into the output port or wave reflected from RL Reflected wave Actual voltage measured at the input of the two-port network: V1++V1- the output of the two-port network: V2++V2-

9 S11

10 S11

11 S12

12 S12

13 S22

14 S22

15 S21

16 S21

17 Y-Parameters Yo=1/Zo

18 Calculate Y-Parameters Using ADS

19 Wires In the AWG system, the diameter of a wire will roughly double every six wire gauges. E.g.

20 Skin Effect (Eddy Current)

21 Skin Depth The skin depth is thus defined as the depth below the surface of the conductor at which the current density has fallen to about 37% of its surface current density.

22 Inductance of a Straight Wire
breadboard wire: 22 AWG or 25.3 mils in diameter. Each mil =25.4 um or cm. 5 cm of a No. 22 copper wire produce about 50 nH of inductance.

23 Resistors Carbon-composition resistor Wirewound resistor
Carbon-film resistor

24 Carbon-Composition Resistors
Carbon composition resistors consist of a solid cylindrical resistive element with embedded wire leads. The resistive element is made from a mixture of finely ground (powdered) carbon and an insulating material (usually ceramic). The resistance is determined by the ratio of the fill material (the powdered ceramic) to the carbon. Higher concentrations of carbon, a good conductor, result in lower resistance. The parasitic capacitance arises out small capacitance between carbon fill. More expensive than carbon film resistor.

25 Wirewound Resistors Wirewound resistors are commonly made by winding a metal wire around a ceramic core. The inductance is much larger than a carbon composition resistor Poor temperature drift coefficient Too much L and C to be useable at high frequencies

26 Carbon Film Resistor Less expensive than carbon-composition resistors
Can drift with temperature and vibration A carbon film is deposited on an insulating substrate, and a helix is cut in it to create a long, narrow resistive path. (Partially exposed)

27 Generic Resistor Model

28 Example 8.7 nH 8.7 nH 10K 0.3 pF Impedance associated
inductor is negligible At 200 MHz A 10 Kohm resistor looks like a resistor at 200 MHz.

29 Insert an Equation in ADS

30 Impedance at 200 MHz 10 Kohm At DC

31 Extract Resistance from Y11
=10 KΩ

32 Extract Capacitance (1)
Slope is constant!

33 Extract Capacitance (2)
C=Y11imag_deriv/2/π=1.88 pF/2/3.1416= pF

34 Generic Equivalent Circuit for a Capacitor
L: inductance of the leads Rp: account for leakage current

35 Quality Factor of a Simplified Capacitance Model
Quality factor= Im[Z]/Re[Z] =1/(ωRC)

36 Generic Equivalent Circuit for an Inductor
Series resistance +skin resistance

37 Extraction Example

38 Parasitic Resistance of an Inductor

39 Inductance Extraction
L=R/(2πfL) =29.73 nH

40 Parasitic Capacitance of an Inductor
Capacitance: fF

41 Quality Factor of a Simplified Inductor Circuit Model
Q=Quality factor= Im[Z]/Re[Z] = (ωL) /(R) Larger Q, better inductor

42 Additional Slides

43 Metal Film Resistor

44 Thin-Film Chip Resistor

45 Impedance Transformation

46 Topics Quality Factor Series to parallel conversion Low-pass RC
High-pass RL Bandpass Loaded Q Impedance Transformation Coupled Resonant Circuit Recent implementation, if time permits

47 Quality Factor

48 Quality Factor Q is dimensionless

49 Quality factor of an inductor
(Imax) 𝑃𝑑𝑖𝑠𝑠= 𝐼 𝑚𝑎𝑥 2 𝑅 2 ω= 2π 𝑇 →𝑇 = 2π ω 𝐸𝑑𝑖𝑠𝑠=𝑃𝑑𝑖𝑠𝑠𝑇= 𝐼 𝑚𝑎𝑥 2 𝑅 2 2π ω = 𝐼 𝑚𝑎𝑥 2 𝑅π ω 𝐿 𝑑𝐼 𝑑𝑡 𝐼 𝑑𝑡= 𝐿𝐼 𝑑𝐼= 𝐿𝐼 𝑚𝑎𝑥 2 2 Please note that Q is also equal to Q=Im(Z)/Re(Z) Q=(ωL)/R

50 Quality factor of Parallel RL circuit
Q=Im(Z)/Re(Z) Z= 𝑅𝑃||𝑠𝐿 𝑅𝑝+𝑠𝐿 = 𝑅𝑝𝑗ω𝐿 𝑅𝑝+𝑗ω𝐿 = 𝑅𝑝𝑗ω𝐿(𝑅𝑝−𝑗ω𝐿) 𝑅𝑝 2+ ω𝐿 2 Q=ωL(Rp)2/(ω2L2Rp)=Rp/ωL

51 Quality factor of a Capacitor
𝑃𝑑𝑖𝑠𝑠= 𝑣 𝑚𝑎𝑥 2 2𝑅 ω= 2π 𝑇 →𝑇 = 2π ω 𝐸𝑑𝑖𝑠𝑠=𝑃𝑑𝑖𝑠𝑠𝑇= 𝑣 𝑚𝑎𝑥 2 2𝑅 2π ω = 𝑣 𝑚𝑎𝑥 2 π ω𝑅 𝐶 𝑑𝑣 𝑑𝑡 𝑣 𝑑𝑡= 𝐶𝑣 𝑑𝑣= 𝐶𝑣 𝑚𝑎𝑥 2 2 Z is the impedance of parallel RC Please note that Q is also equal to Q=Im(Z)/Re(Z) Q=ωCR

52 Quality factor of a Capacitor in Series with a Resistor
Z is the impedance of series RC Please note that Q is also equal to Q=Im(Z)/Re(Z) Q=1/(ωCRS)

53 Low-Pass RC Filter

54 High-Pass Filter ωlpf=ωhpf 𝐿=𝑅2𝐶

55 LPF+HPF ωlpf=ωhpf

56 LPF+HPF (Magnified)

57 Resistor Removed

58 Design Intuition

59 Circuit Quality Factor

60 Mathematical Analysis

61 Transfer Function of a Bandpass Filter
Resonant frequency

62 Cutoff Frequency

63 Bandwidth Calculation
𝑄=ω𝑜𝑅𝐶

64 Equivalent Circuit Approach
At resonant frequency, XP=1/(ωoCp)

65 Effect of the Source Resistance
Q=3.162/(0.664)=4.76

66 Effect of the Load Resistor
6 dB drop at resonance due to the resistive divider. Q=3.162/( )=0.49 The loading will reduce the circuit Q.

67 Summary Q=0.99 𝑄=ω𝑜𝑅𝐶 Q=4.79 Q=0.49

68 Design Constraints Specs List Q, C & L Resonant Frequency: 2.4 GHz
RS=50 Ohms RL=Infinity List Q, C & L 𝑄=ω𝑜𝑅𝐶

69 Values Q C L 0.5 0.663 pF 6.63 nH 1 1.326 pF 3.315 nH 10 13.26 pF 331.5 pH Specs: Resonant Frequency: 2.4 GHz RS=50 Ohms RL=Infinity

70 Design Example Q=2.4/( )=10.12 BW=237 MHz

71 Implement the Inductor

72

73 Resistance of Inductor
R=Rsh(L/W) Rsh is the sheet resistance Rsh is 22 mOhms per square for W=6um. If the outer diameter is 135 um, the length is approximately 135um x4=540 um. R=22 mOhms x (540/6)=1.98 Ohms Q=(ωL)/R=(2π2.4G0.336 nH)/1.98 Ω=2.56

74 Include Resistor In the Tank Circuitry
Q=2.427/( )=2.04 Inclusion of parasitic resistance reduces the circuit Q from 10.

75 Series to Parallel Conversion

76 Series to Parallel Conversion
We have an open at DC! We have resistor RP at DC! It is NOT POSSIBLE to make these two circuits Identical at all frequencies, but we can make these to exhibit approximate behavior at certain frequencies.

77 Derivation QS=QP

78 RP QS=1/(ωCSRS)

79 Cp QS=1/(ωCSRS)

80 Summary

81 Series to Parallel Conversion for RL Circuits

82 Resistance of Inductor
R=Rsh(L/W) Rsh is the sheet resistance Rsh is 22 mOhms per square for W=6um. If the outer diameter is 135 um, the length is approximately 135um x4=540 um. R=22 mOhms x (540/6)=1.98 Ohms Q=(ωL)/R=(2π2.4G0.336 nH)/1.98 Ω=2.56 Rp=RS(1+QSQS)=1.98 Ohms(1+2.56x2.56)=14.96 Ohms Lp=LS(1+1/(QSQS))=331.5 pH(1+1/2.56/2.56)= nH

83 Insertion Loss Due to Inductor Resistance
At resonant frequency, voltage divider ratio is 14.96Ω/(14.96 Ω+50 Ω)=0.2303 Convert to loss in dB, 20log10(0.23)= dB

84 Use Tapped-C Circuit to Fool the Tank into Thinking It Has High RS

85 Derivation

86 Previous Design Values
Q C L 0.5 0.663 pF 6.63 nH 1 1.326 pF 3.315 nH 10 13.26 pF 331.5 pH Specs: Resonant Frequency: 2.4 GHz RS=50 Ohms RL=Infinity

87 Design Problem Knowns & Unknowns Knowns: RS=50 Ohms CT=13.26 pF
C1/C2 R’S

88 Calculations CT=C1/(1+C1/C2) C1=CT(1+C1/C2) C1/C2 R’S C1 C2 1 200 Ω
26.52 pF 2 450Ω 39.78 pF 19.89 pF 3 800Ω 53.04 pF 17.68 pF

89

90 Include the Effect of Parasitic Resistor

91 Filter Design (1) Jack Ou ES590

92 Outline Butterworth LPF Design Example LPF to HPF Conversion
LPF to BPF Conversion LPF to BRF Conversion

93 Butterworth Filter (Attenuation of the Butterworth filter)
Avoid ripples in the passband. As n increases, the responses assumes a sharper transition. The 3dB bandwidth remains independent of n.

94 Low Pass Filter Design Requirement
fc=1 MHz Attenuation of 9 dB at 2 MHz.

95 Determine the number of elements in the filter
9 dB of attenuation at f/fc of 2.

96 Low Pass Filter

97 Frequency and Impedance Scaling

98 Impedance Scaling

99 Simulation Results

100 Design Requirement for a Butterworth Low Pass Filter
The cut-off frequency is not known in this design specification.

101 Design Process Since f2=2f1, then n=3. (fo=1.45 MHz)

102 Elementary Prototype Value

103 Calculation of Component Values

104 Simulation Results

105 LPF to HPF Conversion

106 High Pass Filter Design Requirement
fc=1 MHz Attenuation of 9 dB at 0.5 MHz.

107 Determine the number of elements in the filter
(fc/f) 9 dB of attenuation at fc/f of 2.

108 Low Pass Filter

109 LPF to HPF Transformation
Swap L with C, and C with L. 2. Use the reciprocal value.

110 Frequency and Impedance Scaling
(same as before)

111 Impedance Scaling

112 HPF

113 LPF to BPF Conversion

114 LPF TO BPF Conversion

115 Determine f3

116 Typical Bandpass Specifications
When a low-pass design is transformed into a bandpass design, the attenuation bandwidth ratios remain the same.

117 Determine n using f/fc

118 Transformation from LPF to BPF
The Actual Transformation from LPF to BPF is accomplished by resonating each low-pass element with an element of the opposite type and of the same value. All shunt elements of the low-pass prototype circuit becomes parallel resonant circuits, and all series elements become series-resonant circuits.

119 Transformation Example
Resonate each low-pass element with an element of the opposite type and of the same value.

120 Calculate Component Values

121 Fourth Order Butterworth Filter

122 Transformation

123 Component Calculation

124 Schematic

125 Av on Log(f)

126 Av on Linear f

127 Band Rejection Filter

128 LPF to BRF Conversion Substitute BWC/BW for fc/f
on the normalized frequency axis.

129 Design Example f1=2472.5 MHz f2=2472.72 f3=2494.28 f4=2494.5 MHz
(22)/(21.56)=1.0204 Center Freq: MHz

130 Determine # of Stages Hmm…. not enough suppression.

131 Design Example f1=27 MHz f2=45 MHz f3=75 MHz f4=125 MHz
(98)/(45)=2.1778 Thus fc/f=2 Center Freq: 58.1 MHz

132 Determine # of Stages fc/f

133 Transformation from LPF
Replace each shunt element with a shunt series resonant circuit. Replace each series element with a series parallel resonant circuit. Both elements in each of the resonant circuits have the same normalized value.

134 Component Calculations

135 Band Rejection Filter

136 LPF Elementary Prototype

137 BRF Transformation

138 Band Rejection Filter f1=27 MHz f2=45 MHz f3=75 MHz f4=125 MHz

139 Filter Design (2) Jack Ou ES590

140 Last Time Outline Butterworth LPF Design General Cases Other Filters
LPF to HPF Conversion LPF to BPF Conversion LPF to BRF Conversion General Cases Dual Networks RL≠RS Other Filters Chebyshev filter Bandpass Design Example Bessel filter Filter Synthesis via Genesis

141 Low Pass Filter Design Requirement
fc=1 MHz Attenuation of 9 dB at 2 MHz. RS=50 Ohms RL=25 Ohms

142 Determine the number of elements in the filter
(Same as before) 9 dB of attenuation at f/fc of 2.

143 Use a Low Pass Prototype Value for RS≠RL

144 Comparison: RS=RL

145 Frequency and Impedance Scaling

146 Matlab Calculation

147 Low Frequency Response

148 Comments about Butterworth Filter
A medium –Q filter that is used in designs that require the amplitude response of the filter to be as flat as possible. The Butterworth response is the flattest passband response available and contains no ripples.

149 Chebyshev Response Chebyshev filter is a high-Q filter that is used when : (1) a steeper initial descent into the passband is required (2) the passband response is no longer required to be flat

150 Comparison of a third order Passband Filter
3 dB of passband ripples and 10 dB improvement in attenuation

151 Design Methodology Even though attenuation can be calculated analytically, we will use the graphical method. Even order Chebyshev filters can not have equal termination (RS≠RL)

152 Low Pass Filter Design Requirement
fc=1 MHz Attenuation of 9 dB at 2 MHz. RS=50 Ohms RL=25 Ohms Less than 0.1 dB of Ripple Design it with a Chebychev Filter

153 0.1 dB Attenuation Chart

154 0.1 dB, n=2, Chebyshev

155 Matlab Calculation

156 Chbysehv, 0.1 dB Ripple, LPF ripple

157 Typical Bandpass Specifications
When a low-pass design is transformed into a bandpass design, the attenuation bandwidth ratios remain the same.

158 Butterworth Vs. Chebyshev
Butterworth: n=4, 40 dB Chebyshev: n=4, 48 dB, but RS≠RL We have to settle for n=5, 62 dB.

159 Chebyshev, 5th Order, 0.1 dB Ripple

160

161 Effect of Limited Inductor Quality Factor
Assume each inductor has a quality factor of 10.

162 Minimum Required Q

163 Phase of Chebyshev Bandpass Filter
Phase is not very linear during the passband! You can get a lot of distortion!

164 Bessel Filter Bessel Filter is designed to achieve linear phase at the expense of limited selectivity!

165 Low Pass Filter Design Requirement
fc=1 MHz Attenuation of 9 dB at 2 MHz. RS=50 Ohms RL=25 Ohms

166 Attenuation Possible to achieve 9dB

167 Bessel LPF Prototype Elementary Value

168 Matlab Calculation

169 Bessel LPF 6.8 dB of attenuation at f/fc=2

170 Phase of Bessel LPF (n=2)

171 Genesys BPF Design Example

172 Typical Bandpass Specifications
When a low-pass design is transformed into a bandpass design, the attenuation bandwidth ratios remain the same.

173 Butterworth Vs. Chebyshev
Butterworth: n=4, 40 dB Chebyshev: n=4, 48 dB, but RS≠RL We have to settle for n=5, 62 dB.

174 Start Geneysis Select Passive Filter Start Genesys

175 Filter Properties

176 Comparison Synthesized Via Genesis Synthesized using Charts

177 Change Settings

178 QL=50, QC=100

179 QL=10, QC=100

180 Export Schematic to ADS
(Not sure. ADS project is open)

181 Tune You can also fine-tune the value of a component and see how it changes the filter response

182 Impedance Matching (1)

183 Maximum Power Transfer
Choose an RL in order to maximize power delivered to RL.

184 Power Delivered to the Load

185 Numerical Example VTH=1 V RTH=50 Ω

186 Conclusion! Maximum power is delivered to the load resistor when RL is equal to RTH.

187 Max Power Transfer for Complex Source Impedance
At resonant frequency, the series impedance of the inductor and capacitor is zero.

188 Summary RL>RS RS>RL

189 L Network Different L netowrk Difference bewteen highpass and low pass
Examine butterworth filter from the point of view of matching….

190 Resistance Transformation
RP must be larger than RS (See derivation in the handout)

191 Matlab Calculation

192 Simulation Results

193 High Pass Match Note: There is not a DC path to ZL.
RS must be larger than RL! See derivation! QS=sqrt(RS/RL-1) QS=1/(ωRLC) QS=RS/(ωL)

194 Matlab Calculation

195 ADS Simulation

196 Dealing With Complex Load
Absorption Approach Resonance Technique

197 Match Via Absorption Approach
Ignore stray component Match the load resistance to the source resistance with an L-match Subtract the stray component from the L-match value

198 Absorption Example

199 Calculation Neglecting Stray Components

200 Account for Stray Components
This technique will not work if the stray components is much larger than L match components. E.g. if 2pF is replaced by 6 pF, then this technique will not work.

201 Resonant Approach Resonate any stray reactance with an equal and opposite reactance at the frequency of interest!

202 Example Resonate the 40 pF with a parallel L.

203 Parallel Resonant Network

204 Determine the Matching Network

205 Resonant Approach Example

206 Series to Parallel Conversion for RC Circuits

207 Series to Parallel Conversion for RL Circuits

208 Intuition If the Q is sufficiently large, LS≈LP and CS ≈CP.
RP is Q2 times RS.

209 Summary RL>RS RS>RL

210 Smith Chart Derivation

211 Smith Chart Derivation (2)

212 Smith Chart Construction
(+) (-) (The center line represents an axis where X=0.)

213 zL=1±j

214 Adding a Series Capacitance to an Impedance

215 Use Smith Chart Matching

216 SmithChartMatch

217 Smith Chart Utility 1. Select Smith Chart Match
Click on Tools, then select Smith chart utility 3. Select first option

218 Change the Load Impedance to 75 Ohms

219 Lock Load/Source Impedance

220 Add a Shunt Capacitance

221 Negative Capacitance! Negative capacitance

222 Add a Series Inductor (1) (2)
Double click on the smith chart to drop the component

223 Build ADS Circuit

224 Comparison with Matlab Vs. ADS
Shunt Cap 1.511 pF 1.5 pF Series L 5.72 nH 5.627 nH

225 Adding an Inductor in Series
Insertion of a series inductor to an impedance moves the impedance upward, causing a rotation clockwise along a constant circle of resistance

226 Series Inductance Low L High L Neg L fixed frequency
Insertion of a series inductor to an impedance moves the impedance upward, causing a rotation clockwise along a constant circle of resistance

227 Adding a Capacitor in Series
Insertion of a series capacitor to an impedance move impedance downward, causes a rotation counter clockwise along a constant circle of resistance

228 Series Capacitance Neg C High C Low L fixed frequency Insertion of a series capacitor to an impedance move impedance downward, causes a rotation counter clockwise along a constant circle of resistance

229 Admittance

230 Admittance Example

231 Method 1

232 Method 2 1. Find the Z. 2. Rotate Smith Chart 180 degrees

233 Smith Chart Construction
Inductive susceptance (-) Conductance circle (+) Rotate the impedance chart by 180 degrees (The center line represents an axis where X=0.) Capacitive susceptance

234 Enable Admittance Chart

235 Adding a Shunt Capacitance
Insertion of a shunt capacitor causes a rotation clockwise along a constant circle of admittance

236 Adding a Shunt Capacitance
Neg C High C Low C fixed frequency Insertion of a shunt capacitor causes a rotation clockwise along a constant circle of admittance

237 Adding a Shunt Inductance
Insertion of a shunt inductor causes a rotation counter clockwise along a constant circle of admittance

238 Shunt Inductance Low L High L Neg Ind fixed frequency Insertion of a shunt inductor causes a rotation counter clockwise along a constant circle of admittance

239 Next Class Pi Network T Network Smith Chart Genesis

240 The Pi Network The virtual resistance must be less than RS and RL.

241 Impedance Matching (2)

242 Outline Three Element Matching Motivation Pi Network T Network
Low Q or Wideband Matching Network Impedance Matching on Smith Chart Two-Element Three-Element Matching Multi-Element Matching Genesis

243

244 RV=4.424 Ohms Component Q=4.73

245 Circuit Q Q of Vin/VS=102.2/(125.4-83.1)=2.416
Circuit Q is different from component Q! Q of Vout/VS=98/( )=2.21

246 Four Combinations of L-Match
RL>RS RS>RL

247 Split a Pi Network into Two L Networks

248 Virtual Resistor Virtual Resistance must be
smaller than source resistance! (Blocks DC) RL>RS RS>RL

249 Design a Pi-Match RS=100 Ohms RL=1000 Ohms Resonant Frequency: 100 MHz
R2/R=(Q22+1)/(Q12+1) (See attached) Q1 Q2

250 Calculation Design Sequence: Q1, Q2 RV L2, C2 L1, C1

251 Pi-Match Schematic

252 Use Pi-Match to Produce Matching at 100 MHz

253 T-Match

254 T-Match RL>RS RS>RL

255 Calculation in Matlab

256 Schematic Q1=10 Q2=4.472 RV=1050 Ohms

257 Vin/VS

258 Review of Smith Chart Adding an inductor in series
Adding a capacitor in series Adding a capacitor in parallel Adding an inductor in parallel

259 Adding an Inductor in Series
Insertion of a series inductor to an impedance moves the impedance upward, causing a rotation clockwise along a constant circle of resistance

260 Adding a Capacitor in Series
Insertion of a series capacitor to an impedance move impedance downward, causes a rotation counter clockwise along a constant circle of resistance

261 Adding a Shunt Capacitance
Insertion of a shunt capacitor causes a rotation clockwise along a constant circle of admittance

262 Adding a Shunt Inductance
Insertion of a shunt inductor causes a rotation counter clockwise along a constant circle of admittance

263 Example Design a matching network with a source impedance of
25+15j Ohm and output impedance of j Ohms. (We need to have match the source and load to their complex conjugates)

264 Starting Smith Chart (source) (load)

265 Four Combinations of L-Match
(Series L causes clockwise Movement on constant R on smith chart… …) (The only one) RL>RS RS>RL

266 C=39.46 pF; L= nH

267 Constant Q Q of series impedance=ratio of reactance to resistance

268 Constant Q Circle

269 Example 4-4 Constant Q of 15 Q=15 The end of large terminating resistor will determine the Q.

270 Example 4-4 (Adding a Series L)
Get the admittance circuit with a series L

271 Example 4.4 Get back with the center of chart with a shunt cap.

272 Example 4-4 (Q=15)

273 Compare the Smith Chart Design with Calculation in Matlab
C2 (matlab) C2(Smith Chart) L1+L2 (matlab) L1+L2 (Smith chart) C1 (matlab) C1 (Smith chart) 23.87 pF 22.36 pF nH 147.9 nH 68.55 pF 75.49 pF

274 Example 4.8 Design a T network to match Z=15+15j Ohm source to a 225 Ohm load at 30 MHz with a loaded Q of 5.

275 Example 4.8 Get on Constant Q=5 curve

276 CMOS Transistors

277 Outline Qualitative Description of CMOS Transistor gm/ID Design
Biasing a transistor Using gm/ID Approach Design Using Cadence

278 A Crude Metal Oxide Semiconductor (MOS) Device
V2 causes movement of negative charges, thus current. V1 can control the resistivity of the channel. Positive charge attract negative charges to interface between insulator and silicon. A conductive path is created If the density of electrons is sufficiently high. Q=CV. P-Type Silicon is slightly conductive. The gate draws no current!

279 An Improved MOS Transistor
(provide electrons) (drain electrons) n+ diffusion allows electrons move through silicon.

280 Typical Dimensions of MOSFETs
These diode must be reversed biased. tox is made really thin to increase C, therefore, create a strong control of Q by V.

281 A Closer Look at the Channel Formulation
Need to tie substrate to GND to avoid current through PN diode. VTH=300mV to 500 mV (OFF) (ON) Positive charges repel the holes creating a depletion region, a region free of holes. Free electrons appear at VG=VTH.

282 Channel Resistance As VG increases, the density of electrons increases, the value of channel resistance changes with gate voltage.

283 Drain Current as a function of Drain Voltage
Resistance determined by VG.

284 Drain Current as a function of Gate Voltage
Higher VG leads to a lower channel resistance, therefore larger slope.

285 Length Dependence The resistance of a conductor is proportional to the length.

286 Dependence on Oxide Thickness
Q=CV C is inversely proportional to 1/tox. Lower Q implies higher channel resitsance.

287 Width Dependence The resistance of a conductor is inversely proportional to the cross section area. A larger device also has a larger capacitance!

288 Channel Pinch Off Q=CV V=VG-VOXIDE-Silicon VOXIDE-Silicon can change along the channel! Low VOXIDE-Silicon implies less Q.

289 VG-VD is sufficiently large
to produce a channel VG-VD is NOT sufficiently large to produce a channel No channel Electrons are swept by E to drain. Drain can no longer affect the drain current!

290 Regions (No Dependence on VDS) No channel

291 Determination of Region
How do you know whether a transistor is in the linear region or saturation region? If VDS>(VGS-VTH) and VGS>VTH, then the device is in the saturation region. If VDS<(VGS-VTH) and VGS>VTH, then the device is in the linear region.

292 Graphical Illustration

293 Limited VDS Dependence During Saturation
As VDS increase, effective L decreases, therefore, ID increases.

294 Pronounced Channel Length Modulation in small L

295 Transconductance As a voltage-controlled current source, a MOS transistor can be characterized by its transconductance: It is important to know that

296 What Happens to gm/ID when W and ID are doubled?

297 Body Effect The threshold voltage will change when VSB=0!

298 Experimental Data of Body Effect
The threshold voltage will increase when VSB increases.

299 Small Signal Model for NMOS Transistor

300 PMOS Transistor

301 IV Characteristics of a PMOS

302 Small Signal Model of PMOS

303 Small Signal Model of NMOS

304 gm/ID Design Approach

305 gm/ID Design Optimization
gm/ID Design Flow Specs Design Equations (Analytical) gm/Id Data Set (Emprical) The gmoverid design flow is a technique that allows engineers to size up transistors quickly and accurately without using complicated transistor models. It was published by Silveira and his colleagues back in 1996. A typical gmoverid design flow goes like this: You start with the specs. You express your specs in terms of a set of design equations, you then use query the gmoverid data base to obtain optimum W/L that satisfy the constraints. gm/ID Design Optimization (F. Silveira, JSSC, 1996.) W/L Ratios

306 Intuition gm gds gm/ID gm/gds 2gm 2gds gm/ID gm/gds 2gm 2gds gm/ID
How does it work? This figures shows a transistor which has a transconductance (gm), a drain-to-source conductance (gds), and a current (I) when biased at a gate-to-source voltage (VGS) and a drain-to-source (VDS). If an identical device is connected in parallel so that both devices are biased at the same VGS and VDS, both devices have the the same gm, gds and the same ID. Since the devices are connected in parallel, they can be treated as one device with an aspect ratio of 2W=L. The effective transconductance over current ratio is gm/ID for both the merged device as well as the stand alone device because gm and ID are doubled. The drain-to-source transconductance is also doubled for the merged device. As a result, the intrinsic gain (gm/gds) is identical for both the stand alone device and the merged device. It can therefore be stated that as long as transistors are biased at the same gm/ID, they will have the same gm/gds. This observation is true for two small signal parameters whose ratio depend solely on the gm/ID and not on the width of a transistor. Once a transistor of a given width (W) is characterized over a range of gm/ID, the gm/ID based parameters can be generalized to a transistor of an arbitrary width. gm/ID methodology will hold as long as a parameter of interest scales with W. gm gds gm/ID gm/gds 2gm 2gds gm/ID gm/gds 2gm 2gds gm/ID gm/gds

307 gm/ID Data Set gm/gds gm/gmbs ID/W Cgd/Cgg Cgs/Cgg ….more
(F. Silveira, JSSC, 1996.) What we have on this slide is a list of most commonly used gmoverid based parameters. gmovergds, for example, is the self-gain of a transistor. ID/W is the current density. The list goes on and on. How do we obtain the gmoverid data set? The gmoverid data set is not part of the standard design kit. You have to create it yourself by running DC simulation. You only have to generate the database once when you start a new design kit. We have shown in a previous paper that we can include additional parameters to enable gmoverid based noise simulation. We would like to add distortion parameters to enable nonlinear analysis.

308 Design Example

309 Calculation Initially assume that gmro is large! (gm is determined)

310 gm/gds (50)

311 Current Density

312 Biasing an MOS Transistor Using gm/ID technique
Section 7.1 J.Ou Sonoma State Univeristy

313 Basic Analysis Use 1.2 V (Modified Ex 7.1)

314 Design Equations

315 Assumption: VDD=1.2 V Transistor Information: Type: 120 nm Specify VDS Note var1_1 is ‘vsd’ if pmos is used Note var2_1 is ‘vns’ if nmos is used. In this example, is initially unknown, so we will assume that it is 0.0

316 Interpolation Since the database base can not be so large as to keep
all possible values of vds/vsb, we have to interpolate based on existing values, which are available On 0.1 V interval. Current release: need to enter inBias <= the minVar1 and maxVar1. minVar=maxVar-0.1

317 Browse Database dBrowse2D(25, 'pfet', '15.0u', 'vsd', 0.3, 0.4, 0.353, 'vns', 0.5, 0.6, 0.577, 'vth') Variable name=dBrowse2D(gmoverid, type, length, var1, minVar1, maxVar1,inBias1, var2, minVar2, maxVar2,inBias2, ‘parameter’ ) Valid parameters: gmovergds, gmovergmbs, vth, ft, gmoveridft, idoverw, vod, region, fndbderiv cgdovercgg,cddovercgg, cgsovercgg, csbovercgg, cdbovercgg, ron, vdsat, rseff, rdeff type: nfet, pfet length: {'120n' '180n' '250n' '350n' '600n' '800n' '1.0u' '2.0u' '3.0u' '4.0u' '5.0u' '6.0u' '7.0u' '8.0u' '9.0u' '10.0u' '15.0u' '20.0u'} (text string)

318 Iteration Start with Calculate length=‘120nm’ gmoverid=20
VDS=VDD/2, VSB=0 Calculate vod_1 vth_ vgs_1 vx (gate voltage) vs (source voltage) ID Idoverw W RD Vd Vds=Vd-Vs

319 Iteration Example

320 Design Iterations Iteration VS IDS W RD Vds 0.1 V 392uA 53.06 um
0.1 V 392uA 53.06 um 1.529Kohms 0.207 V 1 0.321 322 uA 45.16 um 1.89 Kohms 0.278 V 2 0.340 340.4 uA 46.86 um 1.762 Kohms 0.259 3 0.335 335 uA 46.44 1.788 Kohms 0.265

321 Matlab & Simulation Parameters Matlab Cadence W 46.56 um 46 um Vx
ids 336.8 uA 339 uA gm 6.7 mS 6.80 mS gm/ids 19.94 20.05 Vs 0.336 V 0.339 V Vd 0.6 V 0.593 V Vds 0.263 V 0.257V Vth 0.5 V 0.497 V

322 Circuit Design Using Cadence
J.Ou

323 Start Cadence Start Cadence

324 Create New Cellview

325 Add Instance

326 Add a Resistor

327 Add Ground

328 Add Power

329 Add Wire

330 Done!

331 Start ADE L

332 Start DC Analysis

333 Netlist and Run

334 Annotate DC Node Voltages

335 Model Library Setup

336 DC Voltage Annotated

337 Component Display

338 Display DC Operating Point
Click on the device to display values!

339 Save State

340 Low Noise Amplifier

341 DSB/SC-AM Modulation (Review)

342 Frequency Shift Property (Review)

343 Frequency Spectrum of DSB/SC-AM Signal (Review)

344 If the Receiver Uses a Different Frequency to Demodulate
(Keep by using with LPF)

345 Use an LNA Circuit to Reduce Noise
(11/20) (11/27) (12/4)

346 Design of a Low Noise Amplifier
1. Transistor Biasing 2. Add L1 (Ls) and Lg 3. Add Ls 4. Adjust Lg 5. Generate gate bias voltage 6. Add M2 7. Design the output resonant network 8. Reduce the quality of output tank!

347 Design of a Low Noise Amplifier
Source Resistance (RS) is 50 Ω Assume a bias current of 1 mA Assumed: gm/ID=20 mS/mA

348 Determine M1 Initial assumptions: VDS1=0.3 V VSB=0 V (DC)
gm/ID=20 mS/mA ID=1 mA

349 gm/ID Calculation

350 Device Simulation

351 Add L1& Lg

352 Impedance Measurement
Our initial L1 and Lg does not produce a perfect match!

353 Increase Ls to Increase Real Impedance
(Increase Ls (or L1) to compensate For CGD)

354 (Ls=270 pH) (Ls=398 pH) (The resonant frequency is still off!)

355 Adjust Lg (fix at 3.5 GHz ) (Reduce Lg to increase the resonant freq)

356 Generate the Gate Voltage
Insulate the DC The resistor RB and CB isolate the signal path from the noise of IB and MB. Generate VGS of M1 (449.8 mV)

357 Find the width of MB

358 Determine RB RB must be much larger than RP, the parallel equivalent resistance Of RS. Otherwise, RB will load the input match network!

359 Input Bias Network!

360 Lg=14.85 nH, Ls=398 pH After adding the bias MB
Before adding the bias MB

361 Determine M2 (Choose M2 to be Identical to M1, for simplicity)
Also connect the gate of M2 to VDD.

362 Determine the Output Impedance
Use large L to provide DC bias and open at 3.5 GHz. Use an artificially large C to provide DC isolation and a short at 3.5 GHz. Use the port to calculate the S22 and output impedance.

363 Output Admittance Goal: to cancel the imaginary admittance with an inductor! An effective output capacitance of 135 fF An effective output resistance of 1/1.107mS=900 Ohms Since we know fo, and Ceff, we can calculate Leff: 15.3 nH

364 Adding Output Capacitance
A 15.3 nH inductor is too large to implement on silicon. We will add a 1 pF capacitor in parallel to reduce the required inductance to 1.82 nH

365 Schematic (A port is used to calculate the output impedance)
903~1/1.107 mS

366 Comparison of Smith Chart
Location of 3.5 GHz! After adding the bias MB After the output load The input resonant frequency also shifted.

367 Input Resonant Frequency Shifted to 3.15 GHz
We probably have to reduce Lg.

368 Real and Imaginary Part of Output Impedance

369 Adjust Lg to Move the Resonant Frequency to 3. 5GHz

370 S11 Using Lg of 10 nH

371 Input S11 Reflection coefficient larger than 1!
May have to adjust reduce the quality factor of the output tank!

372 Adjust Output Resistance

373 RL of 900 Ω

374 Transient Simulation

375 Trasient Simulation Vout=1.225-1.1745=50.5 mV
Vin= =1.67 mV Av=30.23, dB

376 Misc.

377 Determine Parameters Using Matlab

378 DC Bias Simulation Purpose: Verify gm/ID DC parameters through simulation.

379 Design of a Low Noise Amplifier
Source Resistance (RS) is 50 Ω Assume a bias current of 1 mA Assumed: gm/ID=20 mS/mA

380 Mixer

381 Performance Parameters
Gain (convolution analysis) Port-to-Port Feedthrough (Noise) (Linearity)

382 Feedthrough Mechanism in a Mixer
(LO re-radiation)

383 Single Ended Pasive RF Mixer

384 Frequency Spectrum LO RF

385 LO-RF Feedthrough

386 Differential Mixer

387 Waveform

388 Voutp-Voutn

389 Frequency Spectrum

390 Comparison Reduced RF Feedthrough Reduced DC Offset

391 Double Balanced Passive Mixer

392 Waveforms

393 Frequency Spectrum No DC, RF, and LO Feedthrough

394 Output Waveform

395 Sampling Mixer

396 Sampling Mixer Rf: 100 Hz, LO: 400 Hz

397 Waveform of Sampling Mixer

398 DFT of the Output Spectrum

399 Use PMOS to Improve Sampling

400 Improved Sampling Due to PMOS

401 Output Spectrum of CMOS Switch


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