1. AAEON COM Express General Introduction
Presenter :
Division :
Date :

2. Business Opportunity – Market Trend
COM estimate growing : 14.1%
Biggest Market:
Industrial Automation
Medical
Gaming
Source: IHS December 2014

3. OK, but what is it exactly?
Back to Basic– What is
Computer on Module
OK, but what is it exactly?
Types:
There are total 7 different types of COM Express (Type 1/10/2/3/4/5/6).
Luckily, we only have to remember four of the most popular types 1/10/2/6
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.

4. Back to Basic– What is Computer on Module
Plan & Design
Type 6 & 10: No IDE & PCI support
Type 6: 4 x USB3.0 & 3 x DDI (HD display integration such as HDMI, DP)
Type 2: No more native SDVO nor PCI support from later chipsets

5. Appearance: What does it look like?
Back to Basic– What is
Computer on Module
Appearance: What does it look like?
mini
55 × 84 mm
Compact
95 × 95 mm
Basic
125 × 95 mm
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.

6. Appearance: From the back
Back to Basic– What is
Computer on Module
Appearance: From the back
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.
Type 2 and 6 are with two rows (Row A/B, Row C/D)
Type 1 and 10 are with one row only (Row A/B)

7. Back to Basic– What is Computer on Module
OK, we started to have ideas. BUT, what about the I/Os. Where can I find interface like VGA, HDMI, USB and LAN? How do I power it on?
COM Express I/Os are usually located on the carrier board. For connectivity, always plug your COM Express module with carrier.
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.

8. Why Computer On Modules?
Small to large size to fit various applications
Scalability: Entry Level to High Performance CPU/Platform
Standard Specification: PICMG maintain COM Express standards
Faster time to market
Minimize design efforts
Everything is possible through carrier board!
Old/Legacy Device support
Special connector
Special shape
Proprietary circuitries
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.

9. Selection Guide Form Factor Type Solution Platform Model Name
Plan & Design
Form Factor
Type
Solution
Platform
Model Name
Product Position
Carrier Board
Estimated EOL
Basic Size (125mm x 95mm)
Type 6
Intel
Skylake
COM-SKHB6
Performance
ECB-920A
2022
Haswell
COM-QM87
2020
Ivy Bridge
COM-QM77
2019
COM-HM76
Rich I/O Specific
Compact Size (95mm x 95mm)
COM-SKUC6
AMD
Kabini
COM-KB
BayTrail
COM-BT
Entry level
2021
Cedar View
COM-CV-B10
Type 2
COM-BYTC2
ECB-916M
COM-CV-A11
Luna Pier
COM-LN-B10
2017 (ICHM8 EOL 2015)
Mini Size (84mm x 55mm)
Type 10
NanoCOM-BT
NanoCOM-CV-B10
Type 1
NanoCOM-CV-A10

10. Selection Guide XTX (114mm x 95mm ) N/A Intel Braswell XTX-BSW
Plan & Design
Form Factor
Type
Solution
Platform
Model Name
Product Position
Carrier Board
Estimated EOL
XTX (114mm x 95mm )
N/A
Intel
Braswell
XTX-BSW
Entry level
ECB-910M
2022
Cedar View
XTX-CV
2019
ETX (114mm x 95mm )
AMD
eOntario
ETX-A55E
ECB-902M
2021
Luna Pier
ETX-LN
2017 (ICHM8 EOL 2015)
LX800
ETX-701
2017 (DIMM Socket EOL)
Q7 (70mm x 70mm)
Qseven Rev. 2.0
Freescale
iMX6
AQ7-IMX6
ECB-970
2025
BayTrail
AQ7-BT
SMARC (82mm x 50mm)
SMARC Spec v1.1
uCOM-BT
ECB-960T

11. What information is needed?
Plan & Design
What information is needed?
Customer Name, Application
Target Production Date and Price
Does customer have Carrier board
If yes, what type (Type 1/10/2/6, Q7/SMARC/ETX/XTX…).
Does customer carrier board has any Super IO? If yes, please specify the model name. This will have influence toward the type of BIOS used (legacy or legacy free)
If there is no existing carrier board, will AAEON have the opportunity to build for them
Any particular circuitry or devices that require AAEON to modify the BIOS?
What OS customer will use?
Customer Name
Application
EAU
Have existing carrier?
If yes, Type 1/10/2/6
ETX/XTX/Q7/SMARC OS
Target Price?
Target Production date?
Save Back & Forth Communicate Time

12. What information is needed?
Plan & Design
What information is needed?

13. What information is needed?
Plan & Design
What information is needed?
Customer Name, Application
Target Production Date and Price
Does customer have Carrier board
If yes, what type (Type 1/10/2/6, Q7/SMARC/ETX/XTX…).
Does customer carrier board has any Super IO? If yes, please specify the model name. This will have influence toward the type of BIOS used (legacy or legacy free)
If there is no existing carrier board, will AAEON have the opportunity to build for them
Any particular circuitry or devices that require AAEON to modify the BIOS?
What OS customer will use?
Customer Name
Application
EAU
Have existing carrier?
If yes, Type 1/10/2/6
ETX/XTX/Q7/SMARC OS
Target Price?
Target Production date?
Save Back & Forth Communicate Time

14. NEXT STEP Share the AAEON carrier board design guide
Plan & Design
NEXT STEP
Share the AAEON carrier board design guide
Acquire customer’s schematic for
Compatibility check
Debug/troubleshoot
Suggestions from AAEON’s design engineers

15. What should we prepare for the first sample order
Plan & Design
What should we prepare for the first sample order
COM Express Module
Corresponding carrier board (please refer to selection guide)
Heatspreader
Heatsink
Possible Memory Modules and Storage etc

16. Plan & Design
Some might ask
What is heatspreader and what does it do? Basically heatspreader is piece of metal heat dissipation tray that conducts heat from COM express module to heatsink. It is required to be used with heatsink and apply thermal paste in between to achieve higher heat dissipation efficiency.

17. Plan & Design
Some might ask
What is heatsink and what does it do? Heatsink is with metal fins and sometimes equipped with CPU fan. The main purpose is to absorb all heat generated from COM Express module through spreader. The CPU fan can help reduce thermal by active cooling

18. Plan & Design
You might ask
What if my customer needs one piece thermal solution? In AAEON, we have very good experience and knowledge in thermal design. We can develop a complete thermal solution tailored made for all customer request. Giving an example:

19. Short Demo for Assembly
A Short demonstration
Install your COM express module and carrier board
Assemble heatspreader and heatsink
Plug in the power supply and power on
Connect all the device you need
The system is now working
For SBC, the cost and develop time between generation and generation are basically constant.
For COM, the cost and develop time will getting lower from generation to generation. Also, after the carrier board is done, it can easily change COM module to meet customer’s performance and power consumption requirements.
While the base/carrier board is fully custom and flexible to the size and features, it is easier to work with uncommon and proprietary signals and connectors.

20. Plan & Design
What does Q-service do?
Purpose of Q-Service is to provide Quick and Quality service below
Quick Schematic Review (for new and existing carrier board):
Initial feedback in 2 business days. Full feedback within 5 business days (dedicate ESS team support)
Develop custom BIOS:
In 3-5 business day with all required info from customer
Quick Debug/Troubleshoot Results
Initial feedback within 72 hours.

21. General Information: Row Define
Plan & Design

22. General Information: Row Define
Plan & Design

23. COM Sizes and latest products
General Information:
COM Sizes and latest products
Plan & Design
Basic COM
COMPACT COM
ETX/XTX Q7
SMARC
NANO COM
95 mm
82 mm
115 mm
125 mm
70 mm
84 mm
55 mm
50 mm
Latest Products in COM
COM-SKHB6
COM-QM87
COM-QM77
COM-HM76
ETX-LN, ETX-A55E
XTX-BSW, ETX-CV
COM-SKUC6
COM-BT
COM-CV
COM-KB
NANOCOM-BT
NANOCOM-CV
AQ7-iMX6, AQ7-BT
uCOM-BT

24. General Information: Carrier Boards
It is strongly suggested for customer to own AAEON carrier board
ECB-920A (supports type 1/6/10) to reduce development cost, save
production test time, function cross check and avoid evaluation hassles.
ECB-920A Type 1/6/10
ECB-917 Type 6
ECB-951D Type 1
ECB-920A Type 1/6/10
ECB-917 Type 10

25. COM- ABCDE- FGH- IJKL-M General Information: Naming Rule
Platform Name
Name by Silicon Platform Abbreviation
AB = Platform, e.g. SK for “Skylake”
C = U for ULT
D = Size, C for Compact (95mm x 95mm), or B for Basic (125mm x 95mm)
E: Pin Type, 6 for type 6, 2 for type 2.
Revision Control: Start from A10
A10 A1x: Same features, no main component change.
A10A2xA3X: Same features, main component change.
A10 B10C10: Different features use the same platform.
Features Different
Start from no word, then 0001, 0002, 0003…
ex: A10 or A
M: Special Features: E for ECC
Ex1: COM-SKHB6-A E
Ex2: COM-SKUC6-A

26. Product Highlights

27. COM Products Roadmap Summary
New Product Plan
NANOCOM-SKU
COM-APLC6
NANOCOM-APL
Schedule Change
XTX-BSW revised to Sep 2016
COM-BYTC2 revised to July 2016
EOL Products
NanoCOM-TC series (EOL by March )
AQ7-LN-D10 series (EOL by May )
COM-KB-A10 Series (EOL by Dec )
Others
AQ7-BT Rev.2.0 support 4GB DDR3L
uCOM-BT Rev.2.0 support 4GB DDR3L and remove USB Client function.
COM-SKHB6 and COM-SKUC6 are in MP stage.

28. COM-SKHB6 - Intel® Core™ i3/i5/i7 Processor with PCH QM170
- DDR4 SODIMM x 2, up to 32 GB, ECC Support
- Gigabit Ethernet x 1
- 18/24-bit Dual Channel LVDS LCD/eDP, DDI x 2 (Default DP Signal),
- VGA, High Definition Audio Interface
- SATA x 4
- USB2.0 x 8, USB3.0 x 4, GPIO 8-bit, PCI-Express [x1] x 8, PCIe[x16] x 1
- COM Express Type 6 Basic Size 125mm x 95mm

29. COM-SKUC6 - Intel® Core™ i3/i5/i7 U-series SoC
- DDR3L SODIMM x 1, up to 8 GB, non-ECC only
- Gigabit Ethernet x 1
- 18/24-bit Dual-Channel LVDS, LCD/eDP, DDI x 2 (1 Sharded to VGA),
- High Definition Audio Interface
- SATA x 3
- USB2.0 x 8, USB3.0 x 4, GPIO 8-bit, PCI-Express [x1] x 8
- COM Express Type 6 Compact Size 95mm x 95mm

30. Side-by-Side Comparison
COM-SKHB6
COM-SKUC6
COM Express Type
Type 6
CPU
Skylake-H. from i3-Xeon.
Skylake-U from Celeron to i7
Memory
2x DDR4, ECC support (option), 32 GB max
DDR3L x1, 8GB max
Display
VGA, LVDS/eDP, DDIx2*, PEG
VGA, LVDS/eDP, DDIx1*
Storage
SATA x4
SATA x3
USB3.0/USB2.0
4/8
Expansion
PCIe[x16], PCIe[x1] x8
PCIe[x1] up to 4 devices
Power
12V
TPM
option

31. NANOCOM-SKU - Intel® Core™ iX-6xxxU series SOC Onboard
- 4GB DDR4 memory
- Gigabit Ethernet x 1
- 18/24-bit Single-Channel LVDS LCDs/eDP, DDIx1
- High Definition Audio Interface
- SATA x 2
- USB3.0 x2, USB2.0 x8
- PCI-Express [x1] x 3
- GPIO x8, SMbus, I2C, LPC

32. Overall Performance Benchmark

33. Overall Performance Benchmark

34. Overall Performance Benchmark

35. Thank you