1. MSE 206-Materials Characterization I
INTRODUCTION
MSE 206-Materials Characterization I

2. Course Syllabus
Aim:
The aim of this course is to familiarize the students with the fundamentals of microstructural characterization, basics of geometric optics and light microscopy. Both theoretically and practically, the students will have the chance to learn how to work on an optical microscope and determine typical microstructures of ferrous as well as nonferrous metallic materials.
Methods of Instruction
Theor.
Appl.
Lab.
Total
Credit
ECTS Credit 42 -
(2 4 4) 6
Semester
Spring 2016 – 2017
Instructor
Assoc Prof. Dr. Ziya Esen, Materials Science and Engineering Dept.
Room: NB-16,
Assistant
Ezgi Bütev, Materials Science and Engineering Dept., NC-09;
Emre Yılmaz, Materials Science and Engineering Dept., NC-08;
Schedule
Lecture Hours : Wednesday :20-11:10
Laboratory Hours : Wednesday :20-17:10 (section 01)
Friday :20-13:10 (section 02)
Friday :20-17:10 (section 03)

3. Textbook
Textbook:
There is no recommended specific textbook in metallography in the English language. For this reason the students are asked to attend the lectures regularly and take notes. Relevant class material will be posted on
Book
Author
Pub. Inf.
Introduction to Optical Microscopy
Jerome Mertz
Roberts and Company Publishers, 2009
Metallography Principles and Practice
George F. Vander Voort
ASM International, 1999
Optics
Eugene Hecht
Addison Wesley, 4th Edition 2002.
Encyclopedia of Materials Characterization
R. Brundle, C. Evans, S. Wilson
Butterworth-Heinemann, 1992
Experimental Techniques in Materials and Mechanics
C. Suryanarayana
CRC Press, Taylor and Francis Group, 2011
Optical Techniques for Solid State Materials Characterization
Rofit P. Prasankumar and Antoinette J. Taylor
CRC Pres, Taylor and Francis Group, 2011
Fundamentals of Light Microscopy and Electronic Imaging
Douglas B. Murphy
Wiley-Liss; 1st edition, 2001
Microstructural Characterization of Materials
David Brandon, Wayne D. Kaplan
Wiley, 2008
Physical Principles of Electron Microscopy: An Introduction to TEM, SEM, and AEM
R.F. Egerton
Springer, 2010
Fractography: Observing, Measuring and Interpreting Fracture Surface Topography
Derek Hull
Cambridge University Press, 1999

4. Laboratory
In the metallography lab, each student is assigned to a microscope and she/he will be held responsible to look after it well. Lab schedule is handed out in the class. Pop quizzes will be given in each lab hour. In addition to this, students are required to complete lab reports each week.
Term Project:
Each student will be given a metallic sample of unknown composition and microstructure. Using the necessary characterization tools available in our department the student will try to determine the alloy composition, microstructure, hardness etc. of the unknown sample. Based on the obtained information the student will comment on the processing as well as possible heat treatment history of the sample and typical applications of the alloy with the determined properties.
The term projects are due the last day of classes.

5. Attendance&Grading Attendance
70% attendance of all lecture hours and 80% attendance of all laboratory hours is required by the university’s regulations. Absence from a quiz, lab. or an examination will result in zero grade.
Grading Policy
Laboratory work(Quiz+ HW) & Lab exam …
20%
Term Project……………………………… ……….
10%
Midterm s (I&II) …………… …………......
40%
Final……………………………………… ………...
30%

6. Tentative Course Outline

7. Weekly Lab Topics Metallographic Specimen Preperation
Optical Microscopes
Macro-examination, Inclusions and Solidification Structures
Equilubrium cooled Fe-C Structures
Isothermal Transformation Fe-C Structures
Non-Equilubrium Structures
Cast Irons
Plastically Deformed and Surface Treated Structures
Nonferrous Metallography
Scanning Electron Microscopy
Transmission Electron Microscopy
Quantitative Metallography

8. Introduction to Materials Characterization techniques

9. Materials Optimization Loop
Material science is the investigation of the relationship among processing, structure, properties, and performance of materials.

10. Structure
1) Sub atomic – electrons and nuclei (protons and neutrons)
2) Atomic – organization of atoms or molecules
3) Microscopic – groups of atoms that are normally agglomerated together
4) Macroscopic – viewable with the un-aided eye
1 Ao = m
1 nm = 10-9 m
1 m = 10-6 m
1 mm = 10-3 m
1 cm = 10-2 m

12. Property
- A material trait expressed in terms of the measured response to a specific imposed stimulus
Hardness
Strength
Ductility, etc.
Resistivity
Conductivity
Mag. permeability
Index of refraction
Reflectivity
Ther. conductivity
Heat capacity
+ Deteriorative Properties: Relate to the chemical reactivity of materials

13. (mechanical, electrical&magnetic, optical, thermal) of materials
Why Materials Characterization is Necessary ?
Properties
(mechanical, electrical&magnetic, optical, thermal) of materials
depend on
internal structure
(in microscopic and atomic level ; bonding, crystal structure and composition)
Characterization is needed to identify the material and predict material properties, as well as processing conditions
Some characterization techniques are qualitative, such as providing an image of a surface, others yield quantitative information such as the relative concentrations of atoms that comprise the material.
Qualitative – what is present?
Quantitative – how much is present?

14. Categories of Materials Characterization Techniques
1) Image 2) Surface 3) Structural 4) Organic 5) Elemental

15. SPM – Scanning Probe Microscopy AFM – Atomic Force Microscopy
1)Image Analysis
Optical microscopy
Confocal microscopy
SEM/EDX – Scanning Electron Microscopy with Energy Dispersive X-Ray detector
SPM – Scanning Probe Microscopy
AFM – Atomic Force Microscopy
TEM – Transmission Electron Microscopy

16. 1)Image Analysis
p-n ZnO nanowires by SEM

17. AES – Auger Electron Spectroscopy
Surface Analysis
AES – Auger Electron Spectroscopy
XPS – X-Ray Photoelectron Spectroscopy
TOF-SSIMS – Time of Flight Static Secondary Ion Mass Spectroscopy
LEED – Low Energy Electron Diffraction

18. Surface Analysis
XPS – X-Ray Photoelectron Spectroscopy: gives information from 1-10 nm depth.
XPS results of Titanium surface
Binding Energies (eV)
Sample

19. XRD – X-Ray Diffraction
Structural Analysis
XRD – X-Ray Diffraction
XAX/EXAFS - X-ray Absorption Spectroscopy  and Extended X-Ray Absorption Fine Structure
Raman spectroscopy
TEM – Transmission Electron Microscopy
EELS – Electron Energy Loss Spectroscopy (typically combined with TEM)

20. FTIR – Fourier Transform Infrared Spectroscopy
Organic Analysis
FTIR – Fourier Transform Infrared Spectroscopy
GC/MS – Gas Chromatography with Mass Spectroscopy (detector)
HPLC – High Performance Liquid Chromatography
Raman spectroscopy (structural organic)

21. ICP – Inductively Coupled Plasma XRF – X-Ray Fluorescence
Elemental Analysis
ICP – Inductively Coupled Plasma
XRF – X-Ray Fluorescence
PIXE - Particle-Induced X-ray Emission
Optical atomic spectroscopy
CHN (Carbon / Hydrogen / Nitrogen)

22. Scope of ‘’Materials Characterization I’’ Course
Some Image Characterization Techniques:
1-Light (optical) microscopy (LM) or (OM)
2-Scanning electron microscopy (SEM)
Energy dispersive X-ray spectroscopy (EDS)
3-Transmission electron microscopy (TEM)

23. Electron Microscopes vs. Optical Microscope
Optical Microscope uses visible light (photons, m wavelength). Contrasts in the image produced result from differences in reflectivity of the various regions of the microstructure.
Transmission Electron Microscope (TEM) uses a wide beam of electrons passing through a thin sliced specimen to form an image.
Scanning Electron Microscope (SEM) uses focused beam of electrons scanning over the surface of thick or thin specimens.. Images are produced one spot at a time in a grid-like raster pattern. (will be discussed in a later lecture)

24. Electron Microscopes vs. Optical Microscope

25. Electron Microscopes vs. Optical Microscope
Transmission Electron Microscope, TEM
Optical Microscope
Scanning Electron Microscope, SEM

26. Resolution Scale of Different Methods

27. Resolution Scale of Different Methods
XRD,TEM,STM SEM OM
Grain I
Grain II
Valve
Turbo
charge
Atomic
atomic
Large defects, voids, inclusions by OM; grain and size distribution by either OM and SEM depending scale; Grain boundary and interface by TEM, Crystal structure by XRD and TEM.

28. IMAGES: OM vs SEM
Optical Microscope image of a polycrystalline material BaTiO3
Depth of field
50m
Scanning Electron Microscope image of a polycrystalline BaTiO3
5m
Optical microscopy provides 2-dimensional image whereas SEM is able to show 3-dimensional features

29. Identification of Fracture Mode by SEM
Pores
Cracks
Cracks
Grain boundary
Processing-microstructure-property relationships!
4m
20m
Intergranular fracture
Intragranular fracture

30. SEM Images
                         
Pollen
Butterfly Tongue
Fire ant head
Spider

31. SEM Images
flue virus
Snow crystals

32. Transmission Electron Microscopy
Schematic view of carbon nanotubes
TEM image of carbon nanotubes

33. Transmission Electron Microscopy
TEM imaging of graphene

34. Transmission Electron Microscopy
Dislocations
TEM image of deformed 316 stainless steel showing dislocations and dipoles on (111) planes.

35. Transmission Electron Microscopy
Close view of TEM images of some nano-catalysts.

36. Homework-I
Write a short report about;
Similarities and differences between optical (light), Scanning electron microscope (SEM) and Transmission Electron Microscopes (TEM)