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High field enhancement due to the surface changes
V. Zadin, S. Parviainen, K. Kuppart, K. Eimre, S. Vigonski, A. Aabloo, F. Djurabekova CLIC workshop 2015
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Mechanisms behind field emitting tips?
Field emitters with aspect ratio ~100 Voids or precipitates as possible mechanisms responsible for generating the emitters Multiplication of betas Influence of surface roughness Emitter on top of emitter …. Dynamic surface changes, thermal effects? Can low aspect ratio features lead to high field enhancement? Possible mechanism also in changing work function V. Zadin, University of Tartu
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Simulated systems Coupled electric, mechanical, thermal interactions d
Electric field deforms sample and causes emission currents Emission currents lead to current density distribution in the sample Material heating due to the electric currents Electric and thermal conductivity temperature and size dependent (Deformed) sample causes local field enhancement h d Dc El. field ramped up to MV/m Comsol Multiphysics 4.4 (and 5) Nonlinear Structural Materials Module AC/DC module HELMOD (Combined Electrodynamics, Molecular dynamics) Simulated materials: Copper V. Zadin, University of Tartu
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MD vs. FEM in nanoscale MD – exaggerated el. fields are needed
MD simulations are accurate, but time consuming FEM is computationally fast, but limited at atomistic scale Very similar protrusion shape to MD Material deformation starts in same region Maximum field enhancement is 2 times E0~ 2000 MV/m V. Zadin, University of Tartu
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Deformation at realistic electric field strength
Void formation starts at fields > 400 MV/m Material is plastic only in the vicinity of the defect Thin slit may be formed by combination of voids or by a layer of fragile impurities Field enhancement factor ~2.4 Thin material layer over the void acts like a lever, decreasing the pressure needed for protrusion formation V. Zadin, University of Tartu
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Polycrystalline Cu in high electric fields
Initial sample O.Saresoja, Advanced Engineering Materials 14, 265 (2012) Cu sample obtained from an explosive welding simulation Severe plastic deformations due to the applied stress and temperature Similar treatment and conditions as during breakdown Defect reduction methods: Conjugate-Gradient minimization scheme to relax the lattice simulated annealing to grow the grains and remove stacking faults Final sample contains several defect free grains and a number of surface intersecting grain boundaries Opportunities to study grain boundary effects and influence of surface roughness Final optimized and relaxed sample V. Zadin, University of Tartu
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The influence of surface roughness
1. Atomistic surface detection using common neighbor analysis: Imperfect surface leads to nonuniform stress distribution MD simu. must be coupled to el. field calculations Coordination analysis to find the surface atoms The surface is imported into COMSOL Multiphysics for Finite Element Analysis the electric field distribution mechanical stresses in the sample Deformation of the polycrystalline copper under el. field: Using already existing ED-MD (HELMOD) code or Coupling the FEM simulations to LAMMPS Simulations with uniform pressure over surface already demonstrated mass transport starting from surface roughness 2. Surface reconstruction in FEM using splines: 3. Calculating the surface roughness enhanced el. field: V. Zadin, University of Tartu
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Multiplication of betas
r_1 We can see different surface modifications leading to small β Large β is needed Multiplication of field enhancement factors Can explain observed high beta values Incorporates surface roughness r_1/r_2<0.1 is needed to observe significant influence r_2 Max. enhancement Reference sim. V. Zadin, University of Tartu
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Schottky conjecture – reducing the aspect ratio of emitter
How to identify the shape of the surface defect causing field enhancement? h/r= 23 β~80 FN plot is characterized by beta and emission surface area htotal=3nm d=10nm 1/E ln(I/E2) h/r=10 Compared geometries: High aspect ratio emitter Low aspect ratio emitter standing on top of a protrusion Field enhancement of protrusion β~3-4 h/r= 17 β~17 Both emitters have similar height but different „thickness“ Shape of the top part is the same - equal emission area Beta is fitted by adjusting the geometry h/r=6 d=10nm htotal=2.6nm V. Zadin, University of Tartu
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Rising tip in el. field σMises, max<< 1Pa σMises, max=68 MPa Field emitting tip, rising from the surface is assumed Simulation starts, when the emitter is ~40o angle Simulation ends when fast increase of field enhancement factor starts σMises, max=165 MPa Dynamic behavior of field enhancement factor Elastic deformation up to ~90MV/m Corresponding field enhancement factor ~20 Rising tip can cause significant increase of the field enhancement Elastic limit V. Zadin, University of Tartu
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Field enhancement by „dynamic tip“
Comparison of static (reference) and dynamic emitters Static emitter does not change the shape during simulation Dynamic emitter deforms elastoplastically 100 MV/m γ - slope Direct calculation from simulation From FN plot Beta from static tip 18 22 Beta from dynamic tip 18-33 11.5 The slope in dynamic case is larger, as the applied field is the same, compared to the reference case, but now, the current is higher due to locally more enhanced field. New concept – how hard it is to remove electrons from metal… If the surface loses protrusions, it becomes harder to extract the electrons to hold the emission current. Thus, we need to increase the local field. 100 MV/m ln(I/E2) Beta decreases 2-3 times during dynamic deformation of emitter Instead of growing emitters, we have decreasing emitters? Evaporation of surface protrusions? V. Zadin, University of Tartu
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General Thermal Field model
Simulations of emission currents over large surfaces Thermionic emission: high temperature, low field Field emission: low temperature, high field Combined effects : general thermal field equation: Special interest: Intermediate region where thermal contribution is significant V. Zadin, University of Tartu K. L. Jensen, J. Appl. Phys. (2007)
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Heating and emission currents
Local emission currents – connection to the experiment Field emitters as nanowires Emission current density F(Kn) Size dependence of electric and thermal conductivity Conductivity in nanoscale emitters is significantly decreased (more than 10x for sub-nanometer tip) Knudsen number to characterizes nanoscale size effects Wiedemann-Franz law for thermal conductivity Heat equation in steady state Fully coupled currents and temperature Emission currents concentrated to the top of the tip Fast, exponential temperature rise in the emitter V. Zadin, University of Tartu
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Current density in ED-MD and FEM models
Electric field HELMOD/FEM Local current density and el. field Different solutions methods for el. field using FEM and HELMOD Discretization in HELMOD tied to atomic structure FEM geometry represented by perfectly cylindrical and hemispherical structures Good comparison between obtained electric fields The current density dependence on local electric field for FEM and HELMOD. Apex el. fields are compared FEM and HELMOD implementations agree, validating the results V. Zadin, University of Tartu
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Emission currents & temperature using FEM and HELMOD
Sensitivity to numerical effects: Electric field calculations Emission current integration algorithms Difficulties at estimating material heating Both FEM and HELMOD represent surface incorrectly (smooth, continuous for FEM and discrete for HELMOD) Significant difference due to integration algorithms from fundamentally different surfaces Both approaches capture the same general behavior! V. Zadin, University of Tartu
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Influence of temperature – FN plot
Simulation of single emitter Fully coupled currents, temperature and external field Emission current is integrated over whole surface Taller emitters demonstrate smaller thermal effects high local E is reached faster Thermal effects influence lower applied fields FN equation assumes static system Thermal effects introduce a dynamic component Problem – effect remains in low current region Possible use – allows us to estimate the actual size of the emitter? V. Zadin, University of Tartu
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Some conclusions Field enhancement due to single protrusion is not sufficient Additional mechanisms are needed Multiplication of betas Thermal effects or dynamic surface changes? Emission currents are now calculated using general thermal field model Thermal effects can have significant influence over the field enhancement Dynamic surface changes can lead to modification of measured β V. Zadin, University of Tartu
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Thank you for your attention!
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