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Lecture 2 Fundamentals of Multiscale Fabrication
Multiscale fabrication I: Conventional machining Kahp-Yang Suh Associate Professor SNU MAE
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Mechanical machining based on molds
Compression molding (> 1mm) Injection molding (> 1mm) Extrusion (> 1mm) Stereolithography (> 100 nm) Electrical Discharge Machining (> 50 m) LIGA process (1 mm ~ 10 m) Photolithography (> 60 nm) Imprinting (10 m ~ 10 nm) Capillary molding (100 m ~ 50 nm)
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Compression molding - Fabricating replica of a mold on a melted plastic. Platen Mold Plunger Guide Pins Mold Cavity Hydraulic Plunger Heat and Cooling Hydraulic Pressure Compound to be molded
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Injection molding - Turning plastic stock into finished products.
Hydraulic Pressure Nozzle Feed hopper, contains polymer pellets
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Cores for cooling water
Extrusion - Fabricating tubes or films from a die. Feed hopper Heaters Cores for cooling water Die Screw Drive shaft
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Stereolithography - A family of unique fabrication processes developed to make engineering prototypes in minimum lead time based on a CAD model of the item (cf. Rapid Prototyping). World’s smallest ox (10m) fabricated by femto-second laser stereolithography
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Electrical Discharge Machining (EDM)
- Using electricity to remove metal by spark erosion.
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LIGA Process (1) The LIGA process was developed at the IMT (Institute of Microstructure Technology), in the early eighties under the leadership of Dr. W. Ehrfeld. LIGA is a German acronym for Lithographie, Galvanoformung, Abformung (lithography, galvanoforming, molding) High aspect ratio > 20 High accuracy < 0.5 m High uniformity
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LIGA Process (2) Epoxy resin is selectively cured by X-ray beamed through a mask. Uncured epoxy is etched away. Subsequent masking steps produce additional features. Metal is then electroformed over the cured epoxy to form a mold half. The metal mold is ground to the correct height, and the epoxy is dissolved away, leaving a cavity and ejector holes. The tool is ready to mold parts.
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LIGA Process (3) LIGA examples
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Photolithography (1)
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Photolithography (2) Well-established technique
UV light Mask Photoresist Well-established technique Two dimensional patterning Expensive materials and equipment Limitations for feature sizes less than 50 nm Developing Etching Stripping
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(Reactive ion etching)
Nanoimprint lithography (NIL) (Prof. Steven Y. Chou, Princeton University) Mold Substrate 200nm dots Polymer Mold preparation Polymer coating Pressing Pattern transfer (Reactive ion etching)
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Capillary molding Place the mold on the polymer surface Heating
PDMS mold Polymer Place the mold on the polymer surface Substrate Heating (T > Tg) Cooling and mold removal Meniscus Thick film Thin film Patterning by temperature-directed capillarity
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Results of capillary molding
Thick and Thin polymer films Complex and Large-area patterning Film thickness: 1.5 m Polystyrene, 130ºC, 6 hrs Film thickness: 180 nm Styrene-Butadiene-Styrene copolymer 120C, 1 hr
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Ultra-Short Pulse Laser Material Processing
ns Machining Process fs Machining Process ns fs Steel foil 100 m in thickness
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Atomic Force Microscope + Near Field Optics (NSOM)
Nano-Machining Atomic Force Microscope + Near Field Optics (NSOM) Nanodots Nanocurves Nano-lithography/machining Nanogrids ~10 nm
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