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JRA3 Institute of Physics ASCR Prague

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Presentation on theme: "JRA3 Institute of Physics ASCR Prague"— Presentation transcript:

1 JRA3 Institute of Physics ASCR Prague
ECAL, VFCAL (V. Vrba) HCAL (J. Cvach) Exchange in NA2 (travels 8.5 k€) Munich, 18 Oct 2006 J. Cvach, annual JRA3

2 Tasks in EUDET & budget w/o overheads
Si sensor development for ECAL, VFCAL Monitoring system for HCAL Consumables k€ Si sensor development + production (34.6 k€) VME test stand (25742 €), calibration electronics (16.5 k€) computing (4.9 k€) Personnel - 13 k€ for PhD students, young postdocs Travels 4 k€ Contribution from the Institute Permanent staff – 67 ppm Travels (6.7 k€) Munich, 18 Oct 2006 J. Cvach, annual JRA3

3 Si Sensors for ECAL (V. Vrba)
DET1 DET2 DET3 DET4 DET5 DET6 DET7 DET8 DET9 Si Sensors for ECAL (V. Vrba) Sensor ECAL prototype production: 2006: in four production runs of Si pad sensors at ON Semiconductor we obtained 72 good fully tested wafers which have been integrated into ECAL prototype January-July 2006: wafers delivered to Ecole Polytechnique 7 ECAL layers equipped with ON Semiconductor wafers end of 2006: additional fabrication run at ON Semiconductor is planned to produce about 60 wafers for the full instrumentation for 2007 test beam. Václav Vrba, SI ECAL Sensor Status 2006

4 I-V curves on pad arrays
Munich, 18 Oct 2006 Václav Vrba, ECAL status

5 Reverse current long term stability
2 weeks Munich, 18 Oct 2006

6 Sensor testing @ Institute of Physics AS CR
Test laboratory for measurement of Si sensors Senzors from ON Semiconductor, Czech Republic EUDET tasks Design studies for finer granularity (5x5 mm2) of Si sensors are under way Possibility to use 6” wafers is also investigated Munich, 18 Oct 2006 V. Vrba, ECAL status

7 HCAL - Calibration + Monitoring Board system (I. Polák)
CMB provides calibrated UV flashes to the scintillator tiles optical feedback via PIN photodiode sensing of temperature at scintillator planes and on CMB connection via CANbus to the detector Slow Control monitoring of temperature, voltages, … setting enable, amplitude, pulse width of each LED Munich, 18 Oct 2006 J. Cvach, annual JRA3

8 Calibration and monitoring board II
Calibration & monitoring board – to deliver LED light dynamic range 0.5 – 100 MIP Functions LED control Amplitude (via DAQ, CANbus, standalone) Pulse width: 5 ns  Enable PIN diode readout Temp monitoring Measurement of nonlinearity LED intensity varied by DAQ Intensity measured by PIN Absolute calib from linear part 12 PIN ampli 3 pulse generators control 1V 10 ns

9 Calibrating 18 SiPM with one LED
Munich, 18 Oct 2006 J. Cvach, annual JRA3 Gain calibration for a matrix of 18 SiPM connected to the same LED

10 HCAL plane CMB boards during CERN tests Munich, 18 Oct 2006
J. Cvach, annual JRA3

11 VME stand – durable equipment financed from the EUDET project
Replacement of old CAMAC and NIM modules Measurements of signals from photodetectors (PM, APD, …) 9 pieces of APDs, Hamamatsu S 8664-s 12 bit QDC, 16 chan., V792N Controller V2718 connected by optical cable to PC Reading, control with Labview 4-channel power supply N472 GPIB, serial bus Scope TDS 5104 Munich, 18 Oct 2006 J. Cvach, annual JRA3

12 Stand is operational – a EUDET milestone
Initialisation QDC reading Input buffer decoding Stand is operational – a EUDET milestone Labview chart of signal processing LED  4 fibres read by APD +QDC Ivo pulser + V993 dual timer – 1 kHz What we gained? Larger dynamic range 10bit12bit QDC Sophisticated system (new, VME) Short term usage: long term tests of CMB Jan Smolík Linearity dependence of 4 channels (APDs) to the increase (Vcalib) of the LED light J. Zálešák Munich, 18 Oct 2006 J. Cvach, annual JRA3

13 Calibration & Monitoring Board
C M B Future stand use Long term tests and better understanding of CMB Use a CMB board with (8 LED & PIN diodes) + 8 APDs  16 QDC chan. APD APD Calibration & Monitoring Board Munich, 18 Oct 2006 J. Cvach, annual JRA3

14 Our immediate tasks in EUDET
Production of Si wafers for ECAL module successfully integrated into the prototype and operated in the test beam Design studies for finer granularity (5x5 mm2) of Si sensors are under way; Possibility of the use of 6” wafers is investigated; Students and young physicist (Petr Mikes, Michal Marcisovsky, Pavel Ruzicka, Miroslav Havranek) are involved in the project activities participating in the laboratory sensor evaluation, test beam runs at DESY and CERN, data analysis, simulation etc. They also participate in regular collaboration meetings. HCAL – calibration electronics 2006: 40 (double) boards produced, 23 installed in the prototype, one half financed from EUDET Investigations of functionality and long term stability of CMB Participation in tests and data analysis Munich, 18 Oct 2006 J. Cvach, annual JRA3

15 Resources EUDET Main contribution from EUDET - consumables
Upper table – our JRA3 spending profile by tasks Lower table – spending according to categories year HCAL ECAL VFCAL 2006 12 k€ 6 k€ 2 k€ 2007 12 6 5 2008 14 7 2009 6,55 1,9 4,15 year Perm staff Temp staff Consum ables Travel Durable equipm Over-heads Total (€) Install ment 2006 3256 4308 15 356 4742 2860 6104 36 625 36 740 2007 8581 2008 2009 5720 total 25742 Munich, 18 Oct 2006 J. Cvach, annual JRA3


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