1. AIDA Infrastructure for very forward calorimeters
Mechanical Design adapted to the existing electronic
Designers: In collaboration with:
Eric David François-Xavier Nuiry
Adrien Varlez

2. Tungsten commissioning
Main supplier: Cime Bocuse (Plansee)
We should try other suppliers
Proposal:
Tungsten min W 99.97%
Densimet
W min 90%
Inermet
Magnetism
Paramagnetic
ferromagnetic
Other components
Ni + Fe
Ni + Cu (0%Fe) ρ
19.3
from 17 to 18.8
from 17 to 18.0
Ability to machine
Hard
Nearly like steel
Good machinability
Cost / Kg
~770€(standard plate)
~15510 € for 30 plates
Cost after machining
At CERN
At Cime Bocuse
3500€ for 1 machined plate
45000€ for 30 machined plates
3492€ for 4 machined plates

3. Requirements Impossible with this electronic
A=3.5±0.5mm B=0.32±0.015mm C=2, 1, or 0.5 ±0.05mm D=not really important
Impossible with this electronic 60

4. What we can do: C=2mm C=1mm  We work with an offset of 5.5mm
Distance before next
tungsten
Distance before next
tungsten
BEAM
C=1
C=2
Tungsten plate 125*145
Tungsten plate 125*145
C=4.5
C=5.5

5. What we can do with C=2mm:
 We work with an offset of 5.5mm
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
A=3.5
~2.5
~2.5
~2.5
BEAM
Sensor
Sensor
Sensor
Tungsten plate 125*145
C=2
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
No sensor In this gap
No sensor In this gap
No sensor In this gap
No sensor In this gap

6. What we can do with C=2mm:
 We work with an offset of 5.5mm
Electronic board
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
A=3.5
~2.5
~2.5
~2.5
BEAM
Sensor
Sensor
Sensor
Tungsten plate 125*145
C=2
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
C=5.5
No sensor In this gap
No sensor In this gap
No sensor In this gap
No sensor In this gap

7. What we can do with C=1mm:
 We work with an offset of 4.5mm
Electronic board
Electronic board
Electronic board
~10.5
~10.5
~10.5
A=3.5
~2.5
~2.5
~2.5
BEAM
Sensor
Sensor
Sensor
C=1
Tungsten plate 125*145
C=4.5
C=4.5
C=4.5
C=4.5
C=4.5
C=4.5
C=4.5
C=4.5
C=4.5
No sensor In this gap
No sensor In this gap
No sensor In this gap
No sensor In this gap
No sensor In this gap

8. New mechanical design Multi-parts structure ST0362847
Able to work with C=2mm and 1mm
Not for the C=0.5mm version
212mm
220mm
78mm
255mm
192mm
240mm
368mm
Former design
200mm
Main structure:
New design= new dimensions

9. The existing electronic board, in the permaglass frame
PCB Board

10. The existing electronic board, in the permaglass frame

11. The holder of the tungsten
Permaglass frame

12. Tungsten holder:
Some details

13. Next Step...

14. What we’ve already realised in the past:
For the same application:
Rigid circuits
Flexible read out electronics (Kapton)
Silicon sensor
Connector for the read out
Flexible part
Top view
Rigid part (PCB)