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End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007.

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Presentation on theme: "End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007."— Presentation transcript:

1 End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007

2 Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

3 Lower Cost, High Performance and Good Looking
Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

4 Thin Film and Cell Technologies
Module Cross Section Cell n Cell n+1 Cell n+2 TCO TF-Si Glass Pattern 3 Pattern 2 Pattern 1 Back Contact Cell Structure Glass TCO TF-Si B C Lamination Thin Films Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

5 Technology Roadmap – from Amorph to Micromorph
a-Si/µc-Si Micromorph Tandem Cell 0.3 µm a-Si Amorph Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

6 The Visible Difference between Amorph and Micromorph
Generation 1 Amorph Generation 2 Micromorph Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

7 Oerlikon Solar Production Technology
Clean TCO Laser PECVD Back Contact Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

8 Electrical Contact Layers: TCO 1200
TCO back contact TCO: Transparent Conductive Oxides Clean Laser PECVD Assembly TCO TCO Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

9 KAI 1200 – Proven Technology for a-Si and mc-Si
Plasma Box® for single reactor processing 40 MHz for increased deposition rates Parallel processing (20 reactors) and load lock for high throughput a-Si a-Si/µC-Si Clean TCO Laser Assembly PECVD Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

10 Laser Scribing: LSS 1200 for Module Patterning
Only system qualified for mass production all 3 laser scribing patterns Back Contact (TCO) a-Si:H Glass TCO Pattern 1 Pattern 2 Pattern 3 Clean TCO PECVD Assembly Laser Laser Laser Pattern 1 Pattern 2 Pattern 3 Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

11 Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Continuous Improvement Program Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

12 Integrated Path to Turnkey
KAI 1200 TCO 1200 LSS 1200 Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

13 Integrated Path to Turnkey
Glass Preparation and Cleaning Line Automation Manufacturing Execution System KAI 1200 TCO 1200 LSS 1200 Contacted Tested Device Encapsulation Lamination Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

14 Integrated Path to Turnkey
Glass Preparation and Cleaning Line Automation Manufacturing Execution System FAB 1200 Contacted Tested Device Encapsulation Lamination Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

15 Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

16 Tailored Configuration: Fab 1200 Standard
Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Turnkey Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Standard Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Turnkey Tailored Configuration: Fab 1200 Standard Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

17 Smallest Line: 20/30 MWp Configuration
Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

18 Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

19 Customers like ersol Thin Film
Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

20 and a Strong and Highly Motivated Team
Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

21 Thank You for Your Attention


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