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End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007
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Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Lower Cost, High Performance and Good Looking
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Thin Film and Cell Technologies
Module Cross Section Cell n Cell n+1 Cell n+2 TCO TF-Si Glass Pattern 3 Pattern 2 Pattern 1 Back Contact Cell Structure Glass TCO TF-Si B C Lamination Thin Films Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Technology Roadmap – from Amorph to Micromorph
a-Si/µc-Si Micromorph Tandem Cell 0.3 µm a-Si Amorph Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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The Visible Difference between Amorph and Micromorph
Generation 1 Amorph Generation 2 Micromorph Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Oerlikon Solar Production Technology
Clean TCO Laser PECVD Back Contact Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Electrical Contact Layers: TCO 1200
TCO back contact TCO: Transparent Conductive Oxides Clean Laser PECVD Assembly TCO TCO Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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KAI 1200 – Proven Technology for a-Si and mc-Si
Plasma Box® for single reactor processing 40 MHz for increased deposition rates Parallel processing (20 reactors) and load lock for high throughput a-Si a-Si/µC-Si Clean TCO Laser Assembly PECVD Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Laser Scribing: LSS 1200 for Module Patterning
Only system qualified for mass production all 3 laser scribing patterns Back Contact (TCO) a-Si:H Glass TCO Pattern 1 Pattern 2 Pattern 3 Clean TCO PECVD Assembly Laser Laser Laser Pattern 1 Pattern 2 Pattern 3 Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Continuous Improvement Program Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Integrated Path to Turnkey
KAI 1200 TCO 1200 LSS 1200 Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Integrated Path to Turnkey
Glass Preparation and Cleaning Line Automation Manufacturing Execution System KAI 1200 TCO 1200 LSS 1200 Contacted Tested Device Encapsulation Lamination Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Integrated Path to Turnkey
Glass Preparation and Cleaning Line Automation Manufacturing Execution System FAB 1200 Contacted Tested Device Encapsulation Lamination Assembly Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Tailored Configuration: Fab 1200 Standard
Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Turnkey Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Standard Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Turnkey Tailored Configuration: Fab 1200 Standard Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Smallest Line: 20/30 MWp Configuration
Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey
FAB Tailored Configurations Conclusion Page June 13, 2007 End-to_End Solutions - D. Koch-Ospelt
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Customers like ersol Thin Film
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and a Strong and Highly Motivated Team
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Thank You for Your Attention
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