1. ITER 2004
ITER 2004
presents

2. Sliding Mechanism in Copper Grain Boudaries Effect of vacancy
Peter Ballo
Department of Physics
Faculty of Electrical Engineering and Information Technology
Slovak University of Technology, Ilkovičova 3, Bratislava
Slovak Republic

3. Relaxed geometry of the 160-atom supercell
ITER 2004
Relaxed geometry of the 160-atom supercell
for the S5 tilt grain boundary in copper

4. Evolution of the atomic structure of the pure grain boundary
during the sliding process using SA simulation.

5. The variation of the relative grain boundary energy
during sliding as a function of the sliding distance

7. Vacancy formation energy as a function of the layer number
from the interface.

11. Charge density distribution for GB in aluminum (a) and
copper (b) computed by LDA approximation – right panel
The left panel shows the grain boundary atomic structure.

13. That’s all folks