1. Advanced Material Technologies
Technology Meeting
March 5, 2005
Advanced Material Technologies

2. Park Company Profile Founded in 1954 IPO in 1960 NYSE (PKE) in 1983
Founded Modern Day Printed Circuit Laminate Industry in 1957
Invented Multi-layer Printed Circuit Materials in 1962
Global Business Operations
Only Public Independent Advanced Printed Circuit Materials Manufacturer

3. Park / Nelco Worldwide Facilities
Neltec Europe, SAS
France
(Advance FR4)
Nelco Products
Fullerton, CA
(FR4 & advance)
Nelco NY
Newburgh, NY
(FR4 & advance)
Neltec SA
France
(PTFE)
Nelco Products PTE
Singapore
(FR4 & Advance)
Neltec
Tempe, AZ
(Advance & PTFE)
Nelco Technology (Zhuahi FTZ) Ltd.
China
(Ready in Q1, 06)

4. Dielectric Property Comparison
N N N
Digital Broadband
Signal Integrity Region
N4000-2
5.0
N7000 N N
Std. Epoxy
4.0
N5000
N4500-6T
10 GHz
N SI™
N SI™
3.0
N RF
N9000
2.0
10 GHz
SI™I = Signal Integrity Reinforcement

5. Park Nelco Product Line
Designation Description Tg (DSC) Dk Df
N Multifunctional FR4 140oC 4.4* 0.027*
N High Tg Multifunctional FR4 175oC
N Low CTE Multifunctional FR4 155oC
N High thermal resistance FR4 175oC
N High speed, low-loss, lead free oC
N High Speed Low Loss Epoxy 210oC
N SI High Speed Low Loss Epoxy 210oC
N Control Dielectric -13 Epoxy 210oC*
@ 2.5 GHz
* Dk & 1MHz

6. Park Nelco Product Line
N5000 B.T. / Epoxy 185oC
N /32 Chip packaging B.T. /Epxoy 205oC*
N Non-MDA Polyimde 260oC
N7000-2HT Non-MDA Toughened Polyimide 260oC
N8000 Cyanate Ester 250oC
N RF PTFE/FR4 hybrid
N PTFE resin system
Designation Description Tg (DSC) Dk Df

7. Park / Nelco High Speed Low Loss Spectrum
2.5 GHz GHz GHz
High Performance
Digital Broadband
RF/Microwave
N9000
NextGen HSLL (X6100)
N RF
HF -13 (X6200)
N SI
N RF N N
FR4 with SI N
Auto, Wireless handsets, PCs, motherboards, under hood automotive
N4000-7
N4000-6 N
BC® SI® LD® NF®
High speed telecom infrastructure, motherboards and backplanes, WLANs, RF amplifiers, Burn-in N
N SI ® N
N SI®
Automatic tolling, Adaptive cruise control, base station antennas, embedded antennas
N RF
N RF
NH / NX / NY PTFE Series

8. Advanced Product Development
FR-4 Materials N
High Speed Materials N N
RF/Microwave Materials
N9000
N RF
N RF

9. N4000-11 CAF Resistance – Sun TV1
Testing
Coupons manufactured according to Sun Microsystems TV 1 (Rev VI) design for Park/Nelco
CAF resistance test performed per Tellabs specification GR-78-CORE PAR
85°C, 85 % RH
100V bias
Results
Passed Sun
Failure Criteria
to 1000 Hours

10. N CAF Results

11. N4000-11 CAF Testing Application :CAF test board. Layer count : 4
Test Results :
- Pass 1000 hrs CAF test
85C/85%RH
50 v DC bias, 100 v DC test
Resistance ≥ 108
- Pass 9 x 10 sec solder float
- No resin recessions
0.15 mm Line/space
0.20 mm Line/space
0.25 mm Line/space
0.30 mm Line/space
0.50 mm hole wall to hole wall

12. N4000-11 CAF Test Vehicles and Results
Conditions
Volts
Time (passing)
Notes
Sun TV1
85°C / 85 RH
100 V
1104 hrs
Most recent data approved by K Sauter
10 V
500 hrs
Internal Test
750 hrs
Published on web site
IBM IR Test
50°C / 80 RH
15 V
600 hrs
After lead free preconditioning
TRW
24 V
2000 hrs
-11 had no failures
Modified Sun ‘A1’
1008 hrs
No innerlayer processing to isolate material contribution
Mitsubishi
85°C / 95 RH
50 V
1000 hrs
No resistance below passed two separate tests
Alcatel
65°C / 85 RH
48 V
Pattern includes laser drilled microvias
Repeat of above test with planes
Cisco
888 hrs
Failure between 792 and 888 hrs with recovery at ambient
Fujitsu
75 V
>2000 hrs
No resistance below 108
Bolded tests have reports available.

13. Samples Tested at 2.25 Gbs / sec.
N Eye Pattern Testing
N4000-6 N
Samples Tested at 2.25 Gbs / sec.

14. Samples Tested at 5.0 Gbs / sec.
N Eye Pattern Testing
N4000-6 N
Samples Tested at 5.0 Gbs / sec.

15. Lead Free Assembly
**Note – Results are for inner layers with full bare oxide Cu surface.
Resin system
TMA
N4000-6
Finished PWB N
After Cu Plating **
T245
minutes
minutes
minutes
T260
6.63 minutes
minutes
minutes
T288
Delam before 288°C
2.97 minutes
3.40 minutes
DND

16. ITRI IST Testing Lead and Lead Free Assembly
24 Layer board, OSP finish
3 Laminate suppliers, x 2 materials each
2 Mini Panels (12 IST coupons) of each material processed through SMT reflow
Tin/Lead reflow at 220 °C (428 °F) peak
Lead-Free reflow at 255 °C (490 °F) peak
Resistance read before and after each reflow process
IST test vehicles cycled to failure

17. CDF vs. Cycles to Failure for 6x220C

18. CDF vs. Cycles to Failure 6x255C

19. Nelco IST Testing Lead Free Assembly Compatibility
22 layer PTH/Post generic test vehicle
HASL final finish
0.120” (3.0 mm) thick
min ” (0.38 mm) vias
single ply 2116 construction (53% resin content)
Three resin systems compared for;
Tin/Lead reflow at 220 °C (428 °F) peak
Lead-Free reflow at 255 °C (490 °F) peak
Low mean Cu plating thickness in barrel
0.0006” ” (0.015 – mm)
IST test vehicles cycled to failure

20. IST Test Summary Coupon Design Test Condition N4000-11 N4000-6 FC
.015” vias / .040” grid
As Received
390
615
374
220 C
500
485
408
255 C
440
574
3X NEMI SMT
580
647
401

21. Resin Recession After Thermal Shock
Sample
N FC N
Comments
Production material
Treater run material
1080 with ~50% RC
Roll #
C A
B A
Resin Recession after 3x20 sec Solder Shock
>15%
0 %
Resin Recession after 5x20 sec Solder Shock
Resin Recession after 10x20 sec Solder Shock
>50%, de-lamination
<15%

22. N4000-11 Heavy Innerlayer Cu Fill Capability
12 Layer Board with 4 oz. Cu inner layers
6x Solder Float at 288oC
Dark field photos at 100X
No cracks or delamination

23. N4000-12 Product Highlights High Tg Enhanced Epoxy FR-4 Resin System
Superior Thermal Resistance/Stability
High Speed (low Dk), Low Loss (low Df)
CAF Resistant
Lead-Free Assembly Compatible
Low Z-axis CTE
Stable loss profile across frequencies
High Peel Strength and ILBS
Processing window is similar to other enhanced epoxy materials
Reduced Wicking/Crazing
More Cost-Effective than N
Meets UL 94 V-0

24. N4000-12 Property Comparison-Thermal
Tg (DSC)
175°C
190°C
210°C
Tg (TMA)
170°C
180°C
200°C
Tg (DMA)
195°C
240°C
T260
28 min.
113 min.
58 min.
T288
6 min.
15 min.
8 min.
T300
2 min.
4 min.

25. N4000-12 Property Comparison-Thermal
Degradation Temp (TGA)
360°C
370°C
350°C
Solder Float (4”x4” Cu Clad 288°C-time to failure)
>550 sec.
>400 sec.
>470 sec.
Pressure Cooker (1 hr.)
Moisture Gain
0.24%
0.13%
0.10%
Solder Dip (288°C)
>600 sec.
>300 sec.
>500 sec.

26. N4000-12 Property Comparison-Mechanical
X/Y axis CTE (-40 to +125°C)
12-14 ppm/°C
ppm/°C
10-14 ppm/°C
Z axis CTE (below Tg)
65 ppm/°C
75 ppm/°C
70 ppm/°C
Z axis CTE (above Tg)
265 ppm/°C
270 ppm/°C
283 ppm/°C
Z Expansion (50 to 260°C)
3.2%
3.6%
3.5%

27. N4000-12 Property Comparison-Miscellaneous
TESTu
N4000-6FC
N4000-7 N N N
1hr PC - Moisture
0.25%
0.23%
0.24%
0.10%
0.13%
Inner laminar Bond Strength
>6.0 lbs/in.
5.0 lbs/in.
5.0 lbs./in
6.0 lbs./in.
Volume Resistivity (96/35/90) MegWcm
1.80x108
3.9x108
7.4 x 107
5.6 x 107
8.0 x 108
Volume Resistivity (24/125) MegWcm
5.00x109
2.6x107
3.0 x 107
3.7 x 107
8.4 x 107
Surface Resistivity (96/35/90) MegW
2.00 x 107
1.00 x 109
4.9 x 106
6.2 x 107
4.4 x 107
Surface Resistivity (24/125) MegW
2.30 x 107
2.2 x 106
8.1 x 107
Dielectric Breakdown (KV)
>50
Electric Strength (V/mm)
5.1 x 104
5 x 104
4.7 x 104
5.8 x 104
Arc Resistance
67 sec.
71 sec.
124 sec.
123 sec.
65 sec.
Flexural Strength Lengthwise (psi)
81,000
85,000
75,000
78,000
Flexural Strength Crosswise (psi)
60,000
65,000
43,000
59,000
63,000
Flexural Strength Elevated Temp (125°C) Lengthwise (psi)
57,000
64,000
45,000
58,000
Modulus (Mpa) below Tg
15,600
16,000
18,000
23,000
14800
Modulus (Mpa) above Tg
2,600
2,700
6,000
4,000
6400

28. N4000-12 Copper Peel Strength Comparison
Peel Strength – 1 oz shiny Cu (lbs./in)
Condition N N N
After Solder Float
9.0
9.2
7.5
At Elevated Temperature
7.0
8.7
8.1
After Exposure to Process Chemistry
9.3

29. N4000-12 Electrical Comparison

30. N4000-12 Electrical Comparison

31. N4000-12 10 GHz Dk Comparison 10GHz 3 3.2 3.4 3.6 3.8 4 4.2 30 40 5060 70
Resin Content DK N N

32. N Dk vs. Frequency 3
3.2
3.4
3.6
3.8 4
4.2
4.4
0.001 1
1.5 5 10
GHz Dk
37.2
51.7 59
64.5
%RC

33. N4000-12 Moisture Absorption Effects

34. N4000-12 Moisture Absorption Effects

35. N , N at 2.2 Gb/s N N

36. N , N at Gb/s N N

37. N , N at 5 Gb/s N N

38. N4000-12 CAF Resistance Testing
Test Vehicle: Sun TV-1, IPC-9253
Test Conditions: 85°C/85% RH/100 Vdc
Testing complete through hours
Data confirms CAF resistance for -11, -12, -13

39. N CAF Resistance

40. Lead-Free Assembly Compatibility / IST Performance
Independent Hewlett-Packard test
N resin system on E-glass reinforcement
28 layer 0.230” (5.84 mm) thick test vehicle
Up to 6x precondition at 230°C and 260°C
After pre-conditioning, coupons exposed to IST testing under standard conditions
Results
At 6x, 230 oC, 6 of 6 coupons passed >500 cycles IST (Test terminated at 500 cycles)
At 5x, 260 oC, 6 coupons averaged 534 cycles IST
Results indicate high reliability under simulated lead free assembly conditions with a high layer count design

41. Customer Test Results 28 Layer Construction Desmear same as N4000-13
0.0025” outer and 0.004” inner cores with 106 and 1080 prepreg
193°C for 90 minutes
Desmear same as N
Light plasma followed by chemical desmear
Excellent Overall Results
Tested for Lead Free Assembly Compatibility
Tg DSC
As Is
Baked 60
197.9°C
202.5°C
Tg TMA
182.5°C
184.9°C
Z-Exp. 50°C-260°C
50°C-288°C
4.4%/4.5%
5.2%/5.1%
T-260 without innerlayer
98.4 min.
T-288 without innerlayer
13.2 min.
T-260 with innerlayer
35.7 min.
T-288 with innerlayer
3.9 min.

42. N Prepreg Viscosity

43. N Prepreg Aging Study

44. N4000-13 High Speed, Low Loss Epoxy SI™ Signal Integrity Technology

45. N4000-13 @ 10 GHz Dk & Df Versus RC Split post data
Note this slide and the next are split post. They differ from our data sheets which call for the IPC stripline method. Split post is a more versatile test, but which method is better is highly subjective and is up to the designer.
Split post data

46. N4000-13 SI® @ 10 GHz Dk/Df Versus RC
Split post data

47. Split-Post Cavity Measurements at 10 GHz for N4000-13

48. Lot Consistency for N4000-13 Dk Df Resin Content (%) LOT Number
26020W05-1
4.15
0.0099
40.84
28030Y01-3
4.12
0.0102
39.64
28089X12-1
4.10
0.0101
39.81
02099AB04-3
40.01
11109Y05-1
4.13
0.0098
41.13
28109X10-1
0.0096
22129X06-3
0.0097
41.03
30049AB06-2
0.0095
41.89
Sample conditioned for 2 hours at 120 °C before electrical measurement – two fluid cell method.

49. HP Dielectric Summary 2002 Transmission line measurements
Dielectric Constant
Loss Tangent
Material
Thickness
Resin
Content
10MHz
100MHz
1GHz N
0.475
55.01
3.94
3.88
3.84
0.480
3.89
3.83
3.79
3.90
3.80
3.87
3.81
3.78
IS 408
0.455
38.74
4.34
4.28
4.22
4.39
4.32
4.27
0.450
4.40
4.33
4.25
4.20
HP did not use identical resin contents. This can explain a portion of the Dk difference, but not Df. Note the difference in Df at 1GHz.
Transmission line measurements

50. N4000-13 and N4000-13 SI® Eye Pattern at 5 Gb/s
‘Jitter’ of the superimposed signals is bad, so wide, open eyes is good. N
N SI®
Data courtesy of Northrop Grumman

51. N4000-13 and N4000-13 SI® Eye Pattern at 12.5 Gb/s
Data courtesy of Northrop Grumman

52. N CAF Results

53. N4000-13 CAF Resistance – IBM Laminate X TV
Testing
IBM Laminate X via-via test vehicle
3 Assembly simulations
Spacing down to 12 mils measured hole edge to hole edge,
Includes LGA sites
50°C, 80 % RH
15 volt bias
Results
Passed >600 hours (test concluded with no failures)

54. Lead-Free Assembly Compatibility / IST Performance
Independent Hewlett-Packard test
N resin system on E-glass reinforcement
28 layer 0.230” (5.84 mm) thick test vehicle
Up to 6x precondition at 230°C and 260°C
After pre-conditioning, coupons exposed to IST testing under standard conditions
Results
At 6x, 230 oC, 6 of 6 coupons passed >500 cycles IST (Test terminated at 500 cycles)
At 5x, 260 oC, 6 coupons averaged approx. 400 cycles IST
Results indicate high reliability under simulated lead free assembly conditions with a high layer count design

55. Controlled RF Materials
N RF
N RF
Neltec’s large platen 50” x 80” PTFE press

56. Microwave Substrates PTFE/glass (woven) NY9000, NX9000
PTFE/glass (non-woven)
PTFE/glass/ceramic (woven) NH9000
PTFE/ceramic (non-woven)
Hydrocarbon/glass/ceramic (woven)
Hydrocarbon/ceramic (non-woven)
PTFE/glass/epoxy (woven) N RF
Glass/High performance epoxy N RF
Park / Nelco materials available in categories marked in red

57. N9000 Product Family NY Family Dk 2.08 to 2.33 +/-0.02
NX Family Dk 2.40 to /-0.04
NH Family Dk 2.94 to /-0.04
Dielectric loss tangent from typical
Dielectric loss tangent from typical
Dielectric loss tangent typical
Part Number system = 9 + Dk (ex: NY9208)

58. N9000 Product Classes
ST – ST - Standard meets IPC-4103 specification. Used for all normal RF and microwave circuits
IM – Inter-modulation for antenna-near circuits with passive inter-mod specifications. This material class provides passive inter-modulation typically 6-10 dBc better than competitive materials
XX-Designator for material construction developed for a specific OEM

59. N9000-13RF PTFE/FR-4 (N4000-13) composite Available cores (mil)
5, 10, 15, 20, 30, 40, 60, 90, 125
Available copper
½, 1 and 2 oz RTF or HTE
Bonding Material
N or N SI
Master sheets
48”x36” and 48”x56”
Requires sodium or plasma hole treatment
Multiple manufacturing facilities

60. N9000-13RF NX9300-13RF NX9320-13RF NX9338-13RF NX9350-13RF
dk = 3.00
NX RF
dk= 3.20
NX RF
dk = 3.38
NX RF
dk = 3.50
Dissipation Factor
< 0.004
<
<
<

61. N9000-13RF Potential Applications
802.11(a) Antennas
LNBs
Power dividers
Imbedded RF features
Hand-held antennas
HSLL applications
Passive devices
Linear power amplifiers
Amplifiers
Filters
Couplers
Automotive Telematics

62. N4380-13RF Newest product in the controlled RF materials
Utilizes N resin system
dk = 3.80
df = < (typically <0.007)
Full range of core thickness
3 core through 250 core
Prepregs Available
Styles 2113, 2116 & 7628
Styles 106 & 1080 available but with lower dk
Master sheet
48”x36 and 48”x56”
Standard PCB processing
Multiple manufacturing facilities

63. RF Applications

64. OEM Roadmap Input
Where Are The Gaps?

65. Key Market Segments North America
Major Market Segments
Gorilla
King
Monkey
Prince
Routers
Cisco
Extreme Networks
Juniper Networks
Avici
Optical
Nortel
JDSU
Lucent
Corning
Switches
Tellabs
Tellium
Ciena
Marconi
Storage
EMC
McData
Brocade
StorageTek
Military
L3 Communications
BAE
Lockheed Martin
Raytheon
Wireless
Nokia
Siemens
Motorola
Ericsson
Semiconductor
Intel
Samsung
RFMD
Servers HP
Sun
IBM
Dell

66. OEM Trends Improved Signal Integrity More Reliability Requirements
Thermal Cycling
Br & Pb free

67. Improved Signal Integrity
Dialed-In Dk
Lower Df
Tighter thickness tolerances
Stable Dk/Df over Frequency from 500MHz to 77GHz
Stable Dk/Df over Environmental Impact

68. OEM Trends Dk/Df OEM Dk Df Frequency Motorola Anadigics 3.5 0.004
10 GHz
McData
Storage Tek EMC
3.7
0.008
5-8 GHz HP
<4
<0.009
Up to10GHz
Cisco
Avici
3.9 or less
0.007
5 GHz
2 GHz
TI, Credence
Tektronix Teradyne
<3.8
<0.006
Up to12GHz
<3.7
<0.008
5-10 GHz

69. OEM Trends Improved Signal Integrity More Reliability Requirements
Thermal Cycling
Br & Pb free

70. More Reliability Requirements
Increasing Layer counts
Increasing amount of via’s & traces
Increasing via density & traces density
HDI
CAF Resistant
Pb-free compatible !

71. Increased Reliability
Improved Thermal Performance
Cisco is the biggest driver here
160˚C Tg on field pulls
2 minute minimum T260s
Less than 20% resin recession after 3X solder shocks
Automotive OEMs (Bosch, Delphi, etc) are also looking for major improvements
42V Battery
Underhood, On Engine, On Transmission, etc.
OEMs requiring lead free products
CAF Resistant Materials
Sun is the biggest driver here
Gave test vehicle to industry a few years back
In the process of converting it’s largest programs over to CAF resistant materials
Other OEMs like Tellabs, Fujitsu, IBM, Cisco, Alcatel, etc. also have CAF requirements

72. OEM Trends CAF Resistance
Temperature
Humidity
Bias
Hours
H-H
Failure
Spacing
Criteria ˚C
%RH
(Volts)
(mils)
Sun 85
100
500
10.8, 15, 20, 25.5
1 decade drop
Tellabs
1000 35
1 decade drop 
Alcatel
 65
85 
 48
 500
 30
 1 decade drop
Intel 65 50
4(trace to hole)
TRW
 85
24 
2000 
 31
Do the materials still pass at elevated temperature?

73. OEM Trends Improved Signal Integrity More Reliability Requirements
Thermal Cycling
Br & Pb free

74. OEM Trends Thermal Cycling
Air-Air
Liquid-Liquid
IST
HATS
Temp
Cycles
Sun No
Yes 
No 
Ambient to 150 ºC
400 
Alcatel
Yes
-35 ºC to +125 ºC
 1500
Cisco
 -40 to +150 ºC
1000  HP
 -45 to ºC
 500
Motorola
-40 to +110 ºC
500
IBM
-40 to +90 ºC (after reflow)
750
Bosch
 -40 to +165 ºC 
1500 

75. OEM Trends Improved Signal Integrity More Reliability Requirements
Thermal Cycling
Br & Pb free

76. Let the fabricator decide the profile (260 ºC for sure)
OEM Trends Pb Free
OEM
Pb free
Time Frame
Reflow Profile
RFMD
YES
NOW
6 270 ºC HP
260 ºC moving on to 270 ºC TI
Let the fabricator decide the profile (260 ºC for sure)
Sun ºC
IBM
240 ºC
McData
260 ºC
Nokia
Bombardier
Alcatel
0, 5X, 255 ºC
Motorola
Base Station
255 ºC

77. NEMI Profile

78. Halogen Free/Lead Free Solder Compatibility
OEMs Want To Have Qualified Products by 2006
McData – High Speed/Low Loss
Nokia (Basestation and Handsets) - High Speed/Low Loss and High Tg FR-4
Motorola Basesations – High Speed Low Loss
Anadigics – High Speed Low Loss
Not All Lead Free Qualifications Are The Same
IBM – 260˚C Lead Free Profile
IBM – Need High Speed/Low Loss and High Tg FR-4
Qualification On 22 Layer Test Vehicle
Motorola – 255˚C
Running 250˚C Profile Now But Would Like To Increase It
Have Already Converted Their Handsets to Lead Free
DND

79. Industry Status Lead Free Compatibility
Serious efforts to determine long term PWB reliability only now beginning at OEM and EMS facilities
Proliferation of test vehicles, methodologies, and reflow profiles
Max temp encountered to date is 265oC (280oC)
Max reflow cycle count is 10x
For complex, high layer count assemblies the impact of lead free assembly on the substrate is not well understood
Peel strength and delamination is a major concern for assembly repair
Technology will bifurcate path forward based on useful life of product (consumer vs. infrastructure)
Serious implications await for long life infrastructure products

80. Lead Free Compatibility Technology Assessment
Select Material Properties to Consider
Z-CTE (TMA)
Td (by TGA) at 2% wt. loss
T288 (TMA)
Via Reliability after thermal stress
5 or 6 x at 260oC followed by reliability cycling
IST Testing most prevalent
<50% failure after 400 cycles
HATS being considered as an alternative to IST
Cu Peel Strength
As fabricated and after 6x reflow
CAF Testing after reflow
IBM IR Test

81. OEM Trends Halogen FreeHF
Time Frame
Material Type
RFMD
Yes
NOW
X6100 (but looking at D1049)
Anadigics
1-2 yrs
X6100 TI
1-3 yrs
Vicor
Now
D1049
Cisco
1 yr
Only for Handsets
McData
Motorola (PA)
Motorola (Base Station)

82. OEM Trends Increasing Layer Counts
Layer Counts
Comments
Alcatel
18 and up TI
20 and up
Cisco
16 and up
They buy 25% of 24+L in the market. More HDI HP
14 and up
McData
16 to 24
Tektronix
Tyco
Lucent
22 and up

83. Other Feedback From OEMs
China Strategy
Cost is King…Standard Materials Treated as Commodities
Quality and Reliability
Materials With Increased Bandwidth Must be Process Friendly
Global Constructions That Enable Seamless Transitions
Material Availability…Expect Us to Better Anticipate Their Needs

84. Today’s RF Market
Wireless Communications Cellular, PCS, UMTS, Wireless data
TV Distribution Direct Broadcast Satellite LMDS, MVDS
Telecommunications
Intelligent Highways ACC, Tolling and Navigation
Defense Electronics

85. RF Market

86. Current Markets Cellular Base Station Antennas
CSA Wireless
Andrew/Decebel
EMS Wireless
Powerwave/Allgon

87. Current Markets Flat Panel Antennas
General Dynamics/Prodelin
Maxrad
Centurion
Radiowaves
Cushcraft

88. Current Markets Telematics
Centurion
↑ Receptec ↓
ISG Broadband
Clarion

89. Current Markets RFID
Centurion

90. Current Markets 802.11a,b,g antennas
Andrew Antenna
Centurion
Cushcraft
Maxrad
SkyCross

91. Current Markets Internet on Demand
Navini Networks

92. Current Markets Home Security
Honeywell/Ademco

93. Current Markets Microwave Components
↓ Chelton Control Systems→

94. Current Markets Base Station Power Amplifiers
Powerwave

95. Current Markets LNB’s California Amplifier
Current volume of 2 room LNB is 120k units/month

96. Technical Data Most data available on line www.parknelco.com
Users can register as a “web customer”
Web customers have a unique password
Web customers can access all data such as MSDS, processing guidelines and technical data as it becomes available
Resource library

97. FiberCote Industries, Inc. Introduction

98. Profile
US Polymeric founded 1950
FiberCote since 1987
50-60 Employees
Waterbury, Connecticut USA
Subsidiary of Park Electrochemical (NYSE-PKE) (D&B-5A1)

99. Markets Served Insulation/Ablatives (20%) Aerospace (55%)
Exhaust Gas Management
Rocket Motors
Heat Shields
Friction
Aerospace (55%)
Aircraft Primary & Secondary Structures
Interior
MRO
Industrial (10%)
Specialty Markets
R/F Microwave (15%)
Ground & Aircraft Radomes
Low Observable Structures

100. Resin Chemistries Epoxies Phenolics Polyesters RF High Temp
Structural, Self-adhesive, High Temp, Quick Cure, Electrical, Fire Retardant Grades, Vacuum Bag, and Autoclave Grades
180°F (90°C)  350°F (180°C) cure, Up to 500°F (340°C) service
Phenolics
Interior, Albative, and High Temperature Grades
Polyesters
Structural, High Temp, Quick Cure, Electrical Grades, Fire Retardant Grades RF
Cyanate Ester, Polybutadiene, i.e., Low Dielectric Loss
High Temp
i.e, Polyimide, BMI, Polysiloxane

101. Electromagnetic & Thermal Properties of Selected RF/Microwave Prepreg Systems
                                  
                                   
                                               
                                      
                     
V-341 Polybutadiene/Quartz
350
3.1
.001
to 200
V-376 Cyanate Ester/Quartz
3.2
.005
to 400
V-376 Cyanate Ester/ Fiberglass
4.0
.011
SuperVue™/Spectra®
225
2.4
.006
160
E-761 Epoxy/Quartz
250
3.4
.009
E-761 Epoxy/Spectra®
2.7
.004
to 180
E-761 Epoxy/Fiberglass
4.2
.013
E-746 Hi-Temp. Epoxy/Quartz
3.6
.012
to 500
E-746 Hi-Temp. Epoxy/Fiberglass
.016
E-765 Epoxy/Quartz
.015
275
E-765 Epoxy/Fiberglass
4.5
.020
Polyesters/Fiberglass
.014
to 350
S-860 Silicone/Fiberglass
500
Resin/Fiber Cure Dielectric Constant Loss Tangent Service
Temp (F) X Band X Band Temp (F)

102. Fibers and Fabrics Carbon Graphite Aramid Fiberglass Quartz Silica
Carbonized Rayon
Polyester
Teflon

103. Product Forms Broadgoods Unidirectional Tape Precision Slit Broadgoods
to 60” (1.5M)
Unidirectional Tape
to 24” (0.6M)
Precision Slit Broadgoods
Precision Slit Tape (Fiber Placement)
Sewn Bias Tape
Chopped Molding Compound

104. Laboratory Capabilities
Physiochemical
Flow, Gel-time, Resin Content, Resin Solids, Volatile Content
Mechanical
2 Load Test Frames, Thermal Test Chambers, Expert Laminate/Coupon Preparation, Strain Gauge Capability
Chemical
HPLC, FTIR
Thermal
TMA, DSC, DMA, Rheology
Environmental
Temperature/Humidity Conditioning, Thermal Oxidative Stability

105. Summary Strong Performance Record Responsive, Customer Driven
Aerospace “Resume”
Responsive, Customer Driven
Proven Products and Technologies
Innovative
Substantial Resources/Balance Sheet
Efficient Producer