1. Introduction
SISSI: Simulator for Integrated Structures by Simultaneous Iteration
Experimental software package on top of a particular design kit within Cadence Opus
Tools of our own development: THERMODEL, TRANS-TRAN, THERMAN
Glued by scripts in the SKILL language of Cadence Opus
Schematic entry, layout extraction, results visualization - system services of Opus
Benchmark problems simulated with success
Results reported at THERMINIC and in different papers
The package became obsolete since the design kit was abandoned

2. The complete thermal model
Each element of the matrix of thermal couplings can be described as presented
If the electronic circuit contains N thermally coupled (dissipative and/or temperature sensitive) components, N2 ladders are needed. For N=2:

3. Electro-thermal device models
A basic set of electro-thermal device model has been implemented
Need for advanced models - we are working on implementation of an electro-thermal EKV MOS model

4. The general flowchart

5. Design flows Schematic entry + draft layout:
Simultaneous editing of schematics and layout (for components relevant from thermal point of view)

6. Design flows
Schematic entry + draft layout:

7. Design flows
Layout-based electro-thermal simulation:

8. Design flows
Layout-based electro-thermal simulation: layout extractor

9. Layout extractor
Techno file editing:

10. Layout extractor Defining the include mask:
SIAL layer: for extracting Si-Al contacts to consider the Seebeck-effect if needed

11. Layout extractor
Result: layout of dissipating & temperature sensitive elements (THERMAN & CIF formats)

12. Presentation of the results
Nodal voltages, device temperatures,
Device dissipations,
Function plots:
transient,
transfer
Bode
Temperature maps
2D or axonometric
profile cross-sections

13. Presentation of the results

14. Experiences: CMOS OpAmp
DC simulation; good agreement between simulation and measurement

15. Experiences: micro-thermostat
Tight thermal coupling, effect of the encapsulation. Good agreement between simulation and measurement

16. Experiences: thermal delay line
Transient electro-thermal simulation; good agreement between simulation and measurement