1. Rev:A ( check-->19 pages document)
NSW Read-out spec
Rev:A
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2. Rev:A ( check-->19 pages document)
Modification history
Rev: A date: 4 December 2013
Rui : Creation of the document (19 pages)
Document under the responsibility of Rui De Oliveira , no modification is allowed.
Any request for modification should be sent to Rui De Oliveira .
The active document and all the previous revisions are stored in TE/DEM/EM/PMT data base.
If you use this document for production purpose please contact Rui de Oliveira to know the active version.
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Chapters
1/Process description 2/PCB detailed description 3/Flex description 4/Gluing description 5/Pillar creation 6/files
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4. Chapter1: Process description
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5. Rev:A ( check-->19 pages document)
50um Kapton + resistive strips
PCB + readout strips
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Crete june Rui De Oliveira

6. Rev:A ( check-->19 pages document)
50um Kapton + resistive strips
PCB + readout strips
25um Glue
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Crete june Rui De Oliveira

7. Rev:A ( check-->19 pages document)
50um Kapton + resistive strips
PCB + readout strips
25um Glue
Isostatic Gluing
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Crete june Rui De Oliveira

8. Rev:A ( check-->19 pages document)
50um Kapton + resistive strips
PCB + readout strips
25um solid Glue
High temp Gluing
Pillars creation
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Crete june Rui De Oliveira

9. Chapter 2: PCB detailed description
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10. Rev:A ( check-->19 pages document)
PCB:
-2250mmx 500mm ????
-single side
-0.5mm thick +/- 10%
-17um thick copper
-120um min line and space
-NI/Au or Ag plating on connector fingers
PCB + readout strips
Base material, when used, shall be flame retardant rated UL 94V-0 laminate glass fiber epoxy and conform to L94
according to IPC-4101/94. Copper shall be type H with pits and dent, class B. When procuring base material the
following are required: minimum TG 170°C, minimum TD(5%) 350°C, minimum T min, maximum Z-axis
thermal expansion coefficient above TG 280PPM/°C (alternatively Z-axis thermal expansion coefficient between
50-260°C of 3.5% maximum is acceptable)
Acceptance of finished printed boards shall be in accordance with IPC-A-600, class 2
Fabrication and inspection shall be according to IPC and IPC-6012, class 2
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11. Chapter 3: Flex description
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12. Rev:A ( check-->19 pages document)
Flex:
-2250mmx 550mm ?????
-single side
-50um thick +/- 1um
-silk screen printed or deposited resistor on top
-Kapton HN substrate
-400um min line
-100um min space
- Visual inspection IPC-A-600 Class 2
50um Kapton + resistive strips
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13. Chapter 4: Gluing description
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Gluing Stack up
SS main spacer 2mm mini
Pacopad
Aluminium 0.3mm
Pacothane
Flex
25um glue (Krempel Akaflex CDF 25)
PCB
Pacothane
Aluminium 0.3mm
Pacopad
SS main spacer 2mm mini
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Gluing parameters
Pressure: 30kg/cm2
Ramp up temp: max 10deg/min
Polymerization time and temp: deg
Ramp down temp: max 10deg/min
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16. Chapter 5: Pillar creation
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17. Rev:A ( check-->19 pages document)
Pillars:
-300um pillars diameter
-128um +/- 2um height
-2 layers of Pyralux PC 1025
-Final curing min 160deg 1 Hour
-Ramp up curing : max 50 deg / hour
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18. Rev:A ( check-->19 pages document)
Chapter 6: Files
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19. Rev:A ( check-->19 pages document)
Files
Top copper strips:
Xxxx
Kapton area:
xxxx
Resistive layer:
Pillar layer:
Cutting file:
Drilling file:
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