1. Status & plan for the Tracker R&D and Construction
G.M. Bilei – INFN Perugia
On the behalf of INFN and Universities of
Bari, Catania, Firenze, Genova, Padova, Pavia, Perugia, Pisa,
Milano Bicocca, Torino, Trieste
Roma, Gruppo 1, 6 Feb. 2017

2. The status and plan of the Tracker upgrade for Phase 2
Brief recap on CMS TK Upgrade requirements for HL LHC
Increased radiation hardness to 3000 fb-1
Detector meant to survive without maintenance.
Robustness and redundancy.
Increased granularity to resolve 140 ® 200 mb/BX
Reduce material and improve tracking performance
Provide Level-1
Coverage extension up to η close to 4
CMS HL Upgrade Technical Proposal CERN-LHCC
Tracker Technical Design Reports in June 2017
Aim at delivering upgraded Tracker for data taking in
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

3. Current Phase 2 Tracker layout
Objective: Tracking acceptance up to η = 4. L1 Track Trigger down to η = 2.4
Very significant change from the present Tracker, made for η = 2.5
Acceptance increase is in the Outer Tracker endcap (TEDD) and in particular in the Pixels
Roma, Gruppo 1, 6 Feb. 2017

4. General concept – L1 Tracking Trigger
Silicon modules provide at the same time “Level-1 data” 40 MHZ), and “readout data” (upon positive Level-1 trigger decision)
The whole tracker sends out data at each BX
Level-1 data require local rejection of low-pT tracks
To reduce the data volume, and simplify track Level-1
Threshold of ~ 2 GeV ⇒ data reduction of one order of magnitude or more
Design modules with pT discrimination (“pT modules”) benefiting 4T B field
Correlate signals in two closely-spaced sensors
Exploit the strong magnetic field of CMS
Level-1 “stubs” are processed in the back-end
Form Level-1 tracks, pT above ~ 2 GeV
To be used to improve different trigger channels x y z
“stub”
G.M. Bilei
Roma, Gruppo 1, 6 Feb. 2017

5. Outer Tracker P T modules
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

6. Tracker upgrade – Outer Tracker
220 m2 area - 50/220M strips/macro pixels
modules
µm2 pitch
2.5 to 5 cm strips & 1.5 mm macro-pixels
200 µm active or physical thickness
INFN R&D contribution
FE Read-out chip for Macro Pixel-Strips modules
Silicon Sensors
L1 Track Trigger
Silicon Module and power system

7. Tracker upgrade – Pixels
4 m2 area
50x50 to 25x100 µm2
(minimum size)
200 µm thickness
INFN R&D contribution
Front-End ROC electronics
Silicon Sensors planar/3D
Serial Power system
Mechanical structure
planar 3D
RD53 ASIC 65 nm

8. Outer Tracker R&D Progress
Si-Sensors:
Float Zone n-in-p
INFINEON 200 um thick produced first 8” with good quality. Some issues need to be resolve
to meet CMS specs.
HPK 6” sensors excellent quality.
They satisfy CMS specs
Market Survey launched (common with ATLAS)
Next years formal qualification of potential venders for tender
8” INFINEON sensors 6”
Perugia
Simulation &
Process Control
Qualification 8”
Sensor production can be shared in 8” and 6” size preserving the current
Geometries (with possible cost gain)
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

9. Outer Tracker R&D progress
ASIC chips: all front-end ASIC proto-designs completed
CBC2 and MPA-light in hand. New submissions in 2017
Modules: prototypes assembled and tested in beam
29 µm hit resolution, stub efficiency close to 100%
Power chain: System studies and demonstrator set up
TrackTrigger: demonstrators operational
Initial results consistent with latency ≲ 5 µs and good track finding efficiency
Review process to compare 3 options completed in Dec. 16 PV
PG, BA FI
Full-size 2S module with CBC ASICs
PI, PG, CT, TS
MaPSA-light module
Power hybrids
New tilted barrel geometry and End cap dees

10. Track Trigger Review outcome and plan
Three methods under study since 2013
AM for pattern finding + track fit in FPGA (INFN, USA, Fra., Germ.)
Tracklet (road search, seed & extrapolate) in FPGA (USA)
Hough transform in FPGA for pattern finding + track fit (UK, Germ.)
Discussed and agreed at the end of 2013 to develop hardware demonstrators to establish feasibility and assess merits of the three methods (aiming at the TDR)
Outcome:
All three systems give excellent performance above 3 GeV with similar output rates and ~no pileup dependence
All three systems demonstrated and measured latencies < 4 µs (requirements)
Estimated cost for three systems within the target.
AM approach due to the special development of 28nm ASIC wrt to full FPGA approaches considered to contain higher risk.
G.M. Bilei
Roma, Gruppo 1, 6 Feb. 2017

11. Track Trigger plan
Agreed to define a common next-generation platform to continue the developments and system optimization
Modular design, possibility to implement different combinations of algorithms
Will include an AM-based pattern recognition step as an option for the first stage
Will reduce the need of resources and facilitate comparisons
Will try to converge on these discussions for the TK TDR, in any case the three methods will be documented in the TDR.
G.M. Bilei
Roma, Gruppo 1, 6 Feb. 2017

12. Pixel Phase 2 R&D upgrade
Vigorous R&D on going in several key areas since few years
Silicon Pixel sensors (planar&3D) Bari, Firenze, Mi-Bicocca, Perugia, Pisa, Torino
Few submissions processed and others planned, to select technologies and configurations
FBK Planar and 3D sensors under testing. Contributing to HPK submission
Planning future FBK Planar Active Edge batch
ROC Chip – RD53 and Chipix65 Bari, Padova, Pavia, Perugia, Pisa, Torino Developments of 2 Analog FE, IP blocks, digital architecture, verification environment and simulations, characterization of radiation hardness
CHIPIX65 INFN ROC demonstrator (64x64 pixel matrix) submission on 29th of June
Contribution to RD53A prototype, to be submitted in spring 2017
Serial Power distribution Firenze
Serial powering test setup operational (for now with FEI4). Shunt LDO
regulator IP block prototype working well (RD53). System studies will continue
Barrel Mechanics design Pisa, Torino
Activity started in Pisa few months ago
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

13. Pixel R&D progress: Sensors
INFN: Bari, Firenze, Milano Bicocca, Perugia, Pisa, Torino
Several submissions ongoing to select technologies and configurations
Full test program ongoing: Qualification, test beams, irradiation.
Excellent results from Test Beam for 3D and Planar useful for TDR
Strong activity related to simulation and modeling of silicon sensors
Planar sensors: FBK sensors qualified. Contribution to HPK development - test
3D sensor: FBK 3D Good test results and good quality
Charge Planar FBK
130 um thick
100x150 um
Charge 3D FBK
2E 100x150 um
Inner Tracker Phase 2 MB
G.M. Bilei

14. Pixel ROC R&D INFN CHIPIX65 – RD53
RD53-CHIPIX65 (INFN demonstrator call GR5)
CMS : Bari, Torino, Perugia, Pisa, Padova, Pavia – ATLAS: Milano, Lecce
F. Loddo INFN Bari : RD53 Engineering coordinator
L. Demaria INFN Torino: CHIPIX65 PI & RD53 Chair Institution Board
10 FTE participants to CHIPIX65 project in GR K€ in 3 years
65 nm CMOS technology
CHIPX demonstrator submitted last Jul. Very good preliminary results
Working hard toward the submission of RD53 demonstrator
in spring.
CHIPIX65
64x64 pixel matrix
Low Noise : <90e- noise
Low Threshold : 250e- for bare chip, with 90e- dispersion
Digital Architecture ok for <1% inefficiency at 4 GHz/cm2 pixel rate
Low power : 4 uA/pixel for analog and 4 uA/pixel for digital
Irradiation results : analog good > 600 Mrad;
first test on digital prove ok up >280 Mrad (more later)
Linear Threshold
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

15. Pixel R&D progress: serial power
Serial Power system:
INFN Firenze
Status
Got experience with FEI4 based SP chains (USBPix2 and USBPix3 DAQ system) - single chip/sensor modules
Shunt LDO prototype (65nm, 0.5A) irradiation and testing (in close collaboration with RD53). Working well up to 500 Mrad.
First interactions with CAEN for the definition of a SP power supply (current source) for the back end
Plans
build FEI4 quad-modules for multi-chip modules SP chains
future Shunt LDO prototypes (65nm, 2A) irradiation and testing
characterization of SP behavior of RD53A and setup of RD53A based SP chains
characterization of full SP chains with back-end current source prototypes
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

16. CERN RD Projects with INFN CMS TK participation
RD53 - Large scale Front-End ASIC prototype for Pixel Phase-II detectors
Common development with ATLAS,CLIC and several CMS Institutes
Crucial work on 65 nm radiation tolerance validation
Important submission of RD53A full size chip spring 2017
Development of the shunt LDO for serial powering
INFN CMS TK Institutes: Bari, Pisa, Torino, Padova, Pavia, Perugia
RD50/AIDA (WP4&7) - Radiation hard semi-conductor devices
Common development with ATLAS and other experiments
CMS sensor R&D benefits from extended knowledge accumulated in RD50 and AIDA
(ex. Selection of p-type sensors) - large community of CMS experts is active in RD50.
Planar and 3D Pixel sensors (some common submissions in the latter case)
TCAD simulation and parameterization of radiation damage models
INFN CMS TK Institutes: Bari, Firenze, Perugia, Pisa, Torino
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

17. Other common developments with INFN TK participation
CMS benefits from several common R&D developments across sub-detectors
and experiments.
INFN commitment & benefit is strong. 800 K€ mainly for contracts
(≈ 33 man-year AR) from external projects in
EU INFRA Project: AIDA2020 ( )
CMS Tracker R&D activities characterization of Si-sensors and FE elec. synergies w ATLAS
Access to irradiation facilities
CMS INFN TK beneficiaries: Pavia, Torino, Perugia, Firenze K€ personnel
(silicon sensors and RO chips)
EU ITN Project : INFIERI ( ) INtelligent Fast Interconnected and Efficient
Devices for Frontier Exploitation in Research and Industry. Several partners HEP,
Astropartical, Medical, Industry
CMS TK Pisa beneficiary K€ personnel (Track Trigger) completed
PRIN 2012 : H-TEAM ( ) Higgs precision Physics at LHC with Trigger,
Electronics and advanced method
ATLAS (Pisa, Milano) and CMS (Pisa, Siena, Firenze, Perugia, Torino) collaboration
CMS TK K€ personnel (Track Trigger) completed
Regione Toscana : NEOLITE ( ) Development of new power systems for HL-LHC
CAEN and INFN-UNIV TK Firenze beneficiaries – Firenze 170 K€
Roma June Meeting with referees
G.M. Bilei
G.M. Bilei 17
Roma, Gruppo 1, 6 Feb. 2017

18. INFN proposed contribution to the TK Upgrade
Since early 2016 Tracker Management Board holding a series of meetings to define sharing of construction responsibilities and funding for the TDR. Internal review of cost and sharing contributions still ongoing.
A preliminary and internal sharing among INFN CMS Institutes is being discussed and shown in the past to the referee.
INFN Tracker proposed contribution 15 MCHF
10 MCHF Outer Tracker
5 MCHF Pixel
Several INFN internal discussions to asses
a proposal for the Tracker responsibilities,
financial contributions, commitments,
resources available and required.
Iterative process, converging but still to be
finalized among INFN and with CMS
Technical Proposal Tracker estimated cost
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

19. INFN proposed contribution to construction
INFN proposed contribution to the development & construction of
systems :
Tilted Tracker Barrel PS (TBPS)
Inner barrel layers/endcap disks Pixel detector
Tilted Barrel PS detector
Inner Barrel Pixel detector
Inner Endcap Pixel detector
G.M. Bilei
Roma, Gruppo 1, 6 Feb. 2017

20. Proposed INFN Pixel Phase 2 contribution
Deliver inner modules for inner layers/inner disks mounted, integrated and tested with ultra rad-hard Pixel modules
Contribution to development, qualification, RD53 ROC, Sensors, Hybrids
ROC qualification and testing (Torino, Pavia)
sensors testing (Pisa)
hybrids testing (Bari)
Construction and integration of Inner Modules for Inner layers/disks
bare module testing (Pisa)
module assembly and bonding (Firenze)
module burn in and calibration (Torino)
module mechanical integration and qualification (Torino)
Bpix Mechanics development and construction (Pisa, Torino)
Contribution to development, qualification of common systems
Serial power system and Power Supply (Firenze)
DAQ and Control Systems (Milano, Torino, Firenze)
Safety system (Pisa)
DRAFT
Financial contribution ≈ 5 MCHF
About 20% of total Pixel Cost (to be
Update for TDR)
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

21. Proposed INFN TK Pixel sharing of responsibilities/funds
Sharing of responsibilities and funding among agencies still ongoing
DRAFT
Total INFN proposed contribution KCHF
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

22. Proposed INFN Outer Tracker Phase 2 Contribution
Deliver Tilted Inner Tracker (36x2 rings per side) mounted, integrated and tested with 1956 PS modules (≈ 40 m2 surface detector) and contribute to Track Trigger
Development and Qualification
Service Hybrid testing (Genova)
FE Hybrids testing (Catania)
Silicon Sensors Process Qualification (Perugia)
Construction and integration of PS Modules (1956 installed)
module assembly, wire bonding and testing (Bari, Perugia)
module burn in (Pisa)
module mechanical integration and testing in 72 rings (Pisa + all)
Contribution to development, qualification of commons systems
Track Trigger electronics system (to be confirmed) (Pisa, Perugia, Trieste, Catania)
Power supply system (Firenze, Perugia)
DAQ and Control Systems (Pisa, Catania, Bari)
Safety System (Pisa)
Total ≈ 10 MCHF
About 10% Total Outer TK Cost
DRAFT
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

23. Proposed INFN Outer TK sharing of responsibilities/funds
Sharing of responsibilities and funding among agencies still ongoing
DRAFT
Total INFN proposed contribution KCHF
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

24. FTE breakdown INFN TK activities in 2017
Compiled on July 2016 for 2017 activities
As today about 100 FTE associated to INFN
Tracker (about 20% of CMS TK collaboration)
Carefully balancing TK concurrent activities
making sure we are not unbalanced
- 50 FTE in Operations, DPG, POG, Physics..
- 17 FTE in Pixel Phase 1 installation end of Feb.
- 33 FTE in total for R&D for HL-Tracker
Including :
EU Projects: AIDA2020, INFIERI
PRIN MIUR Projects: H-Team
GR5 R&D Projects: CHIPIX65
POR Toscana: Neolite
We will require as in the past to hire Technical
support for the construction of the Tracker.
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

25. Hired temporary manpower for construction
Past Tracker construction relied much on hired temporary manpower (mostly fondi FAI + AR) Estimated cost of M€ in the 6 TK construction centers for the 4 years ( ) In the meanwhile several INFN Technicians and Engineers permanent staff retired It will be needed a strong support for the Tracker construction at the least as much as in the past Scarce possibility to use R&D external funds to hire manpower for construction
G.M. Bilei
Roma, Gruppo 1, 6 Feb. 2017

26. Instrumentation for construction

27. Project Timeline and funding
R&D_Fase2 Funds
Developments Funds?
Construction Funds
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

28. R&D and Construction funds considerations
The TDR is expected in June 2017
The construction (and related CORE budget) will start at EDRs in
Several developments, pre-prototyping and prototyping need to be carry out for preparing EDR
These developments are not considered to be CORE funds
In foreseen INFN TK investments of ≈ K€
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

29. Back up
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

30. Outer Tracker 2S (Strip Strip) module
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

31. Outer Tracker PS (Pixel Strips) module
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

32. First module prototyping with dummy parts in Perugia
G.M. Bilei
Roma Sep Meeting with referees

33. Main CHIPIX65-FE0 Results : 64x64 matrix of 50x50 um2 pixel
Linear Threshold
32 counts=100ns
Charge res= 200e-
DAC counts
DAC counts
Low Noise : <90e- noise
Low Threshold : 250e- for bare chip, with 90e- dispersion
Signal digitisation: linear 5-bit ToT, achieved in very short time of 100ns
Digital Architecture ok for <1% inefficiency at 4 GHz/cm2 pixel rate (inner PU)
Low power : 4 uA/pixel for analog and 4 uA/pixel for digital
Full digital I/O, 320 MHz readout with 8b10b encoding
Irradiation results : analog good > 600 Mrad; first test on digital prove ok up >280 Mrad (more later)

34. Summary 2017 CMS Tracker R&D Phase 2
Missioni
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

35. Outer Tracker RD funds 2017
3. Contributo ad assemblaggio Bum Bonding Mapsa (MacroPixel)
I Chip MPA dopo  la loro consegna (stesso Run RD53) verranno montati bumb bondati ai sensori macro pixel.
Costo totale stimato 150 K€
15 K€ Perugia
4. Sviluppo e Costruzione di jigs per assemblaggio meccanico, wire bonding dei moduli Outer Tracker (Bari e Perugia)
5 ke x ciascuna sede =Tot 10 K€
5. Acquisto Setups basati su boards FC7 per test moduli ed ibridi di Front end
Bari, Perugia, Catania, Pisa.
8 Keu per setup= Tot 32 k€
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

36. Outer Tracker RD funds 2017
Contributo allo sviluppo e qualifica dei Sensori Outer Tracker
2017 verranno sottomessi 2 batch RD per qualificare i potenziali vendor.
Costo totale è circa 250 K€
Perugia che ha sssunto la responsabilità del controllo di processo
25 K€ per contributo sottomissione comune sensori Outer Tracker
3 K€ probe cards
2. Front-End Chips per PS modules MPA e SSA
Prossimo anno Marzo/Aprile sottomesso insieme a RD53 (50% costo ciascuno) run fonderia 65 nm per MPA e SSA chips. Costo Totale è circa 500 K€ (50% eng. Run)
Pavia sta contribuendo al disegno e test dei due chip MPA e SSA
50 K€ per contributo sottomissione comune Front end chips
3 K€ probe cards/setup readout
Milestone: Sottomissione readout ASIC macro pixel (MPA) e Short Strip (SSA) in 65 nm per lettura
moduli PS outer Tracker 30 Lug. 2017
Roma, Gruppo 1, 6 Feb. 2017
G.M. Bilei

37. G.M. Bilei
Roma Sep Meeting with referees

38. Tracker upgrade Material budget
Data reduction  stub turn-on for full efficiency at 2 GeV
Roma, Gruppo 1, 6 Feb. 2017

39. Mechanics Actually developing the tilted version of TBPS TB2S TEDD
Flat version is based on the same concept as the central part of the tilted version

40. Tilted TBPS Three layers as individual units
Each layer: Central flat section + 2 tilted sections
Central section: 2 end rings and module support plates
Tilted sections: module support rings
Longitudinal profiles join the sections and provide for services routing paths m
0.4 – 0.8 m
0.4 – 1.1 m m

41. Ring with modules