1. Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S
Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S. Callier, S. Conforti, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, N. Seguin-Moreau, V. Tocut + Xiongbo Yan from IHEP Beijing

2. Orsay Micro-Electronics Groups Associated
A strong team of 10 ASIC designers…
= 20% of in2p3 designers
= 60% of department research engineers
A team with critical mass : pole created in 2007 = OMEGA
Expertise in low noise, low power high level of integration ASICs
2 designers/ project
2 projects/designer
Regular design meetings
…Within an electronics departmt of 50
Support for tests, mesaurements, PCBs…
A steady production
A strong on-going R&D
Building blocks SiGe 0.35µm
ASPIC
MAROC 2
HARDROC
SKIROC
SPIROC
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

3. Orsay micro-electronics team
8 research engineers (1 IR0, 2 IR1, 5 IR2)
1 CDD IR2 EUDET
1 phD student
1 visitor from China IHEP Beijing
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

4. C. de La Taille - microelectronics at OMEGA-LAL
Recent chips
Several chips developped for ATLAS LAr, OPERA, LHCb, CALICE in BiCMOS 0.8µm and installed on experiments
Turn to Silicon Germanium 0.35 µm SiGe BiCMOS technology in 2005
Readout for MaPMT and ILC calorimeters
Very high level of integration : System on Chip (SoC)
Parallel activity of building blocks
ASPIC
MAROC 2
HARDROC
SKIROC
SPIROC
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

5. MAROC : 64 ch MAPMT chip for ATLAS lumi
Complete front-end chip for 64 channels multi-anode photomultipliers
Auto-trigger on 1/3 p.e. at 10 MHz, 12 bit charge output
SiGe 0.35 µm, 12 mm2, Pd = 350mW
Hold signal
64 inputs
Variable
Slow Shaper ns
S&H
Multiplexed Analog charge output
S&H
64 Wilkinson 12 bit ADC
Photons
Multiplexed Digital charge output
Variable
Gain
Preamp.
Bipolar
Fast Shaper PM
64 channels
PMF
Unipolar
Fast Shaper
80 MHz encoder
Gain correction
64*6bits
64 trigger outputs
(to FPGA)
3 discris thresholds
(3*12 bits)
3 DACs
12 bits
LUCID
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

6. C. de La Taille - microelectronics at OMEGA-LAL
Active board pictures
MAROC2 chip bounded at CERN
64 ch PMT
MAROC side
Lattice side
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

7. MAROC Efficiency curves
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

8. ILC Challenges for electronics
Requirements for electronics
Large dynamic range (15 bits)
Auto-trigger on ½ MIP
On chip zero suppress
Front-end embedded in detector
Ultra-low power : («25µW/ch)
108 channels
Compactness
« Tracker electronics with calorimetric performance »
No chip = no detector !!
Ultra-low
POWER
is the
KEY issue
ASIC
Si wafers
W layer
ILC : 25µW/ch
FLC_PHY3 18ch 10*10mm 5mW/ch
ATLAS LAr FEB 128ch 400*500mm 1 W/ch
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

9. CALICE Testbeam at DESY, CERN & FNAL
TCMT
AHCAL (9 000 ch)
W-Si ECAL (9 000 ch)
DHCAL slice test
HCAL
SiPM ASIC
Imaging calorimetry
Common DAQ ch
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

10. The front-end ASICs : the ROC chips
SPIROC
Analog HCAL
(SiPM)
36 ch. 32mm²
June 07
Technological prototypes : full scale modules (~2m)
EUDET EU funding (06-09)
ECAL, AHCAL, DHCAL
SiGe AMS 0.35µm
HARDROC
Digital HCAL
(RPC, µmegas or GEMs)
64 ch. 16mm²
Sept 06
SKIROC
ECAL
(Si PIN diode)
36 ch. 20mm²
Nov 06
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

11. Second generation chip for SiPM
SPIROC : Silicon Photomul. Integrated Readout Chip
36 channels
Charge measurement(14bits)
Time measurement (<1ns)
Autotrigger on MIP or spe
Sparsified readout compatible with EUDET 2nd generation DAQ
Chips daisy-chained
Pulsed power -> 25 µW/ch
Fabricated in SiGe AMS 0.35 µm in june 07
Collaboration with DESY Hamburg and Univ Heidelberg
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

12. Acquisition Channel 0 Conversion ADC + readout Ecriture RAM Channel 1
ValidHoldAnalogb 16
RazRangN
Chipsat 16
ReadMesureb 16
Acquisition
NoTrig
gain
Trigger discri Output
Wilkinson ADC Discri output
ExtSigmaTM (OR36)
StartAcqt
SlowClock
Hit channel register 16 x 36 x 1 bits
TM (Discri trigger) 36
BCID 16 x 8 bits
Channel 0
gain
Trigger discri Output
Wilkinson ADC Discri output
Conversion ADC +
Ecriture RAM
StartConvDAQb 36
ValGain (low gain or high Gain)
TransmitOn
readout
RamFull
OutSerie 36
EndReadOut
EndRamp (Discri ADC Wilkinson)
StartReadOut
FlagTDC
Rstb
Channel 1
Clk40MHz
..…
ADC ramp
Startrampb (wilkinson ramp)
RAM
OR36 …
StartRampTDC
TDC ramp
ChipID
Chip ID register 8 bits 8
ValDimGray
DAQ
ASIC
ValDimGray 12 bits 12
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

13. C. de La Taille - microelectronics at OMEGA-LAL
SPIROC performance
Good analog performance
Single photo-electron/noise = 8
Auto-trigger with good uniformity
Complex chip : many more measurements needed
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

14. C. de La Taille - microelectronics at OMEGA-LAL
3D technology
Increasing integration density, mixing technologies
Wafer thinning to <50 µm
Minimization of interconnects
Large industrial demand
Processors, image sensors…
©A. Klumpp (IZM)
No side connections
Without intervention in IC fabrication
Wafer to wafer, Chip to Wafer
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

15. C. de La Taille - microelectronics at OMEGA-LAL
Next steps
Omega will participate to march08 run
Aim at studying 3D design for low power, small area pixels
Will submit a chip with
One analog tier of low power, low noise preamp, low offset discriminator for 50x50µ pixels
One digital tier of local memory, sparsification and readout
Collaboration with
ATLAS pixel group (CPPM, LBL, Bonn)
MPI Munchen (HG Moser)
FNAL CMS SLHC (R. Yarema)
INFN SuperB (V. Re)
Sensor layer
Pad
50 mm
Analogue
AOP
Digital tier
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

16. Si-Ge calo upgrade tests
3 preamps designed with various bipolar input transistor sizes in Si-Ge 0.35 µm (AMS)
3 emitter sizes : 3, 30, 300
Super common base config (ǾT like)
test benches :
noise measurements
Monitoring
Irradiation at CERN wit 24 GeV/c protons
Doses of 0.01,0.1 ,1,10,50 ,100 Mrad
(3.7e11, 3.7e12,3.7e13, 3.7e14, 1.88e15, 3.7e15 neq/cm2)
Test carried out after each dose
Alimentation + pico-ampèremètre
Générateur de pulses + oscilloscope
Laptop,GPIB+ Labview
Chip Si-Ge
Carte Test
Câble d’alimentation
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL 16

17. C. de La Taille - microelectronics at OMEGA-LAL
SLHC
Test card designed according to CERN geometrical specifications
(M. Glaser) in fabrication 5/11/2007:
(Henry Rosenweig, Gisèle M., A.Lounis)
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

18. C. de La Taille - microelectronics at OMEGA-LAL
Si-Ge
The testboard is held on a shuttle that brings it to Irrad-1 beam
Tests are performed outside the beam
Testboard must withstand beam environments
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL 18

19. Irradiation aux neutrons thermique
results
SBC30
SBC3
SBC30
Irradiation aux neutrons thermique
1e13neq/cm2
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL 19

20. C. de La Taille - microelectronics at OMEGA-LAL
Si-Ge
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL 20

21. C. de La Taille - microelectronics at OMEGA-LAL
Conclusion
Good analog performance of SiGe technology
MAROC, HaRDROC, SKIROC, SPIROC : 4 complex ASICs prototyped in 2007 : 2nd generation chips
SoC : System on chip (ADC, TDC, DAQ…) : Long and difficult measurements…
Use on ATLAS, ILC, neutrino, space experiments
Test structures for radiation hardness
Super common base preamps (2007)
Individual transistors and preamps (2008)
Team in Orsay : A. Lounis, M. Benoit, G. Martin-Chassard, F. Wicek
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL

22. C. de La Taille - microelectronics at OMEGA-LAL
Collaborations
LSST ( ) with LPNHE
ILC Si-W ECAL ( ) with LLR & LPCClermont
ILC RPC-Fe DHCAL (2006-) with LLR, IPNL & LAPP
ILC Scintillator (SiPM)-Fe AHCAL (2003-) with DESY
ILC Scintillator (SiPM)-W ECAL(2005-) with KEK
ATLAS luminometer ALFA ( ) with CERN
ATLAS luminometer LUCID ( ) with Bologna
ATLAS tracker (2007-) with CPPM, Bonn, Munich & LBL
Double Chooz ( ) with NEVIS lab
PMm² ( ) with IPNO & LAPP
SuperNemo Front-end (2008-) with Bordeaux
SuperNemo SNATS (2008-) with LPCCaen
SymbolX (2008-) with APC
North Auger ( ) with IPNO
Medical imaging with MaPMT (2007-) with ISS Roma
Medical imaging PET with MsiPM (2007-) with INFN Pisa
Medical imaging with MaPMT ( ) with IMNC
Medical imaging with MaPMT (2008-) with CSNSM
Balloon experiment with SiPM (2008-) with Aachen
Generic detector R&D (2007-)
Space telescope for EECR measurement (2006-) with EHWA Korea
FJPPL (2006-) with KEK
FCPPL (2007-) with IHEP Beijing
Orsay, 19 jan 2009
C. de La Taille - microelectronics at OMEGA-LAL