1. Kursus “electronic assemblies & SOLDERING Technique”
By Mohd Farizul Irni Bin Ismail

2. Acceptability of Electronic Assemblies
Introduction:
IPC -A- 610 E – 2010 Acceptability of Electronic Assemblies
CERTIFIED IPC APPLICATION SPECIALIST (CIS)
Video link

3. OBJECTIVE
Upon completion of this course, the participant will be able to:
Understand and demonstrate the procedures in electronic assemblies comply to the IPC –A-610 standard document
Understand about terms and conditions,
Handling considerations.

4. scope Terms , Condition and Handling Electronic Assemblies
Component Mounting
Soldering Acceptability Requirements

5. Classification Classification in Electronic Assemblies:
CLASS 1: GENERAL ELECTRONIC PRODUCTS
- Includes products suitable for applications where the major requirement is
function of the completed assembly.
CLASS 2: DEDICATED SERVICE ELECTRONIC PRODUCTS
-Includes products where continued performance and extended life is required. Typically the
end-use environment would not cause failures.
CLASS 3: HIGH PERFORMANCE ELECTRONIC PRODUCTS
-Includes products where continued high performance or performance-on-demand is critical,
the equipment must function when required, such as life support or other critical systems.

6. Acceptance Criteria
Acceptance Criteria - ‘‘Requirements for Soldered Electrical and Electronic Assemblies’’:
TARGET CONDITION
Close to perfect, may not be necessary to ensure reliability
ACCEPTABLE CONDITION
Not necessary perfect, maintains the reliability of the assembly
DEFECT CONDITION
May be insufficient to ensure form, fit or function
Defect Class 1 implies a defect for Class 2 & 3, defect Class 2 implies a defect for Class 3
PROCESS INDICATOR
Does not fully meet the acceptance criteria nor is defect

7. PRINTED CIRCUIT Board (pcb) Orientation
Terms and conditions:
Primary Side
Secondary Side
Solder Source Side
Solder Destination Side
Electrical Clearance

8. TERMS AND CONDITIONS Primary Side
Contains the most complex or the most number of components

9. TERMS AND CONDITIONS
Secondary Side
The side opposite the primary side

10. TERMS AND CONDITIONS Solder Source Side
The side to which solder is applied

11. TERMS AND CONDITIONS Solder Destination Side
The side of the PCB that the solder flows toward in a through hole application

12. TERMS AND CONDITIONS Electrical Clearance
the minimum spacing between non-common uninsulated conductors

13. Handling electronic assemblies
EOS/ESD PREVENTION
HANDLING CONSIDERATIONS

14. What is EOS EOS/ESD PREVENTION
EOS: Electrical Overstress (EOS) is the internal result of an unwanted application of electrical energy that results in damaged components. This damage can be from many different sources, such as electrically powered process equipment or ESD occurring during handling or processing.

15. Video link 1 Video link 2

16. EOS

17. What is ESD? EOS/ESD PREVENTION
ESD: Electrostatic Discharge (ESD) is the rapid transfer of a static electric charge from one object to another of a different potential that was created from electrostatic sources. When an electrostatic charge is allowed to come in contact with or close to a sensitive component it can cause damage to the component.

18. ESD

19. Electrostatic discharge source
Video link 1 Video link 2

20. ESD PREVENTION

21. ESD WARNING LABEL

22. HANDLING CONSIDERATIONS
Recommended Practices:

23. Handling with clean gloves and full EOS/ESD protection.
After soldering
Handling with clean gloves and full EOS/ESD protection.

24. Thank you….see you tomorrow