1. N9000 Materials Coppers
July 2016

2. N9000 Coppers New generation of high frequency zinc-free treatments
Improved thermal resistance
High bond strength on proprietary resin systems
Higher treatment density drastically increasing the active surface
No change of structure at high temperature
Very significant contribution for improved integrity and PIM
Thickness from 12 to 70μm C R S N

3. N9000 Coppers - Profile comparison
Higher Rz of treated side C R S
Lower Rz of treated side N

4. N9000 R Copper Drum side treated with very low profile
High temperature elongation properties
Zinc-free treatment for superior PIM
Organic free, anti-tarnish passivation
Designed for PTFE based laminates
Availability & Designation:
RH – 18µm
R1 – 35µm
R2 – 70µm

5. N9000 R Copper Typical Properties
Measured Parameters
Units
Product Gauge
Nominal Thickness µm
oz. 18
1/2 35 1 70 2
Area weight (±5%)
g/m²
oz/ft²
154
0.50
283
0.93
576
1.89
Untreated Side Roughness (Rz)
µ.inch
≤ 6.0
≤ 236
≤ 9.0
≤ 354
≤ 10.0
≤ 394
Untreated Side Roughness (Rq)
0.9
35.4
1.2
47.2 -
Treated Side Roughness (Rz)
≤ 5.1
≤ 201
Treated Side Roughness (Rq)
≤ 1.1
≤ 43
Tensile Strength Transverse (RT)
MPa
k.Lb/in²
≥ 276
≥ 40
Tensile Strength Transverse (180°C)
≥ 138
≥ 20
Elongation Transverse (RT) %
≥ 6
≥ 9
≥ 15
Elongation Transverse (180°C)
≥ 3
Peel Strength after Thermal Stress * (20s /285°C)
Lbs/in
16.3
Insertion Loss *
dB/cm
10 GHz
20GHz
30GHz
40GHz
Solderability
Complies with IPC-4562A specifications
* Tested on NX9255 material with 35µm copper

6. N9000 S Copper Ultra flat ED copper foil extreme fine grain structure
High temperature elongation properties
Zinc-free treatment for superior PIM
Fast and precise etching behaviour
Organic-free, anti-tarnish passivation
Designed for ultra thin laminates or high speed controlled impedance boards
Availability & Designation:
SH – 18µm
S1 – 35µm

7. N9000 S Copper Typical Properties
Measured Parameters
Units
Product Gauge
Nominal Thickness µm
oz. 18
1/2 35 1
Area weight (±5%)
g/m²
oz/ft²
156
0.51
285
0.93
Untreated Side Roughness (Ra)
µ.inch
< 0.35
< 14
Untreated Side Roughness (Rq)
0.3
11.8
Treated Side Roughness (Rz)
2.0 – 3.0
79 – 118
Treated Side Roughness (Rq)
0.5
19.7
Tensile Strength Transverse (RT)
MPa
k.Lb/in²
> 207
> 30
> 276
> 40
Tensile Strength Transverse (180°C)
> 103
> 15
> 138
> 20
Elongation Transverse (RT) %
8 - 30
Elongation Transverse (180°C)
Peel Strength after Thermal Stress * (20s /285°C)
Lbs/in
14.5
Insertion Loss *
dB/cm
10GHz
20GHz
30GHz
40GHz
Solderability -
Complies with IPC-4562A specifications
* Tested on NX9255 material with 35µm copper

8. N9000 N Copper Ultra flat ED copper foil extreme fine grain structure
No profile zinc-free and arsenic free treatment
Ultra-flat profile for minimalist skin effect
Superior conductor losses and PIM performance
High temperature elongation properties
Organic-free, anti-tarnish passivation
Availability & Designation:
NH – 18µm
N1 – 35µm

9. N9000 N Copper Typical Properties
Measured Parameters
Units
Product Gauge
Nominal Thickness µm
oz. 18
1/2 35 1
Area weight (±5%)
g/m²
oz/ft²
150
0.49
283
0.93
Untreated Side Roughness (Ra)
µ.inch
< 0.35
< 14
Untreated Side Roughness (Rq)
0.3
11.8
Treated Side Roughness (Rz)
≤ 1.3
≤ 52
Treated Side Roughness (Rq)
Tensile Strength Transverse (RT)
MPa
k.Lb/in²
> 207
> 30
> 276
> 40
Tensile Strength Transverse (180°C)
> 103
> 15
> 138
> 20
Elongation Transverse (RT) %
8 - 30
Elongation Transverse (180°C)
Peel Strength after Thermal Stress * (20s /285°C)
Lbs/in
Insertion Loss *
dB/cm
10GHz
20GHz
30GHz
40GHz
Solderability -
Complies with IPC-4562A specifications
* Tested on NX9255 material with 35µm copper

10. N9000 C Copper (Old and still running applications only)
Matte side treated
High temperature elongation properties
Zinc-free treatment
Organic free, anti-tarnish passivation
Designed for PTFE based laminates
Availability & Designation:
CT – 12µm
CH – 18µm
C1 – 35µm
C2 – 70µm

11. N9000 C Copper Typical Properties
Measured Parameters
Units
Product Gauge
Nominal Thickness µm
oz. 12
1/3 18
1/2 35 1 70 2
Area weight (±5%)
g/m²
oz/ft²
106.8
0.35
154
0.50
283
0.93
586
1.92
Untreated Side Roughness (Ra)
µ.inch
0.20 – 0.40
8 – 16
Untreated Side Roughness (Rq)
< 0.6
< 25
Treated Side Roughness (Rz)
≤ 5.1
≤ 201
≤ 5.5
≤ 217
≤ 6.6
≤ 260
Treated Side Roughness (Rq)
≤ 0.9
≤ 35
≤ 1.0
≤ 39
≤ 1.2
≤ 47
Tensile Strength Transverse (RT)
MPa
k.Lb/in²
> 276
> 40
Tensile Strength Transverse (180°C)
> 138
> 20
Elongation Transverse (RT) %
≥ 3
≥ 6 ≥9
Elongation Transverse (180°C)
≥ 2
Solderability -
Complies with IPC-4562A specifications