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N9000 Materials Coppers July 2016
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N9000 Coppers New generation of high frequency zinc-free treatments
Improved thermal resistance High bond strength on proprietary resin systems Higher treatment density drastically increasing the active surface No change of structure at high temperature Very significant contribution for improved integrity and PIM Thickness from 12 to 70μm C R S N
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N9000 Coppers - Profile comparison
Higher Rz of treated side C R S Lower Rz of treated side N
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N9000 R Copper Drum side treated with very low profile
High temperature elongation properties Zinc-free treatment for superior PIM Organic free, anti-tarnish passivation Designed for PTFE based laminates Availability & Designation: RH – 18µm R1 – 35µm R2 – 70µm
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N9000 R Copper Typical Properties
Measured Parameters Units Product Gauge Nominal Thickness µm oz. 18 1/2 35 1 70 2 Area weight (±5%) g/m² oz/ft² 154 0.50 283 0.93 576 1.89 Untreated Side Roughness (Rz) µ.inch ≤ 6.0 ≤ 236 ≤ 9.0 ≤ 354 ≤ 10.0 ≤ 394 Untreated Side Roughness (Rq) 0.9 35.4 1.2 47.2 - Treated Side Roughness (Rz) ≤ 5.1 ≤ 201 Treated Side Roughness (Rq) ≤ 1.1 ≤ 43 Tensile Strength Transverse (RT) MPa k.Lb/in² ≥ 276 ≥ 40 Tensile Strength Transverse (180°C) ≥ 138 ≥ 20 Elongation Transverse (RT) % ≥ 6 ≥ 9 ≥ 15 Elongation Transverse (180°C) ≥ 3 Peel Strength after Thermal Stress * (20s /285°C) Lbs/in 16.3 Insertion Loss * dB/cm 10 GHz 20GHz 30GHz 40GHz Solderability Complies with IPC-4562A specifications * Tested on NX9255 material with 35µm copper
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N9000 S Copper Ultra flat ED copper foil extreme fine grain structure
High temperature elongation properties Zinc-free treatment for superior PIM Fast and precise etching behaviour Organic-free, anti-tarnish passivation Designed for ultra thin laminates or high speed controlled impedance boards Availability & Designation: SH – 18µm S1 – 35µm
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N9000 S Copper Typical Properties
Measured Parameters Units Product Gauge Nominal Thickness µm oz. 18 1/2 35 1 Area weight (±5%) g/m² oz/ft² 156 0.51 285 0.93 Untreated Side Roughness (Ra) µ.inch < 0.35 < 14 Untreated Side Roughness (Rq) 0.3 11.8 Treated Side Roughness (Rz) 2.0 – 3.0 79 – 118 Treated Side Roughness (Rq) 0.5 19.7 Tensile Strength Transverse (RT) MPa k.Lb/in² > 207 > 30 > 276 > 40 Tensile Strength Transverse (180°C) > 103 > 15 > 138 > 20 Elongation Transverse (RT) % 8 - 30 Elongation Transverse (180°C) Peel Strength after Thermal Stress * (20s /285°C) Lbs/in 14.5 Insertion Loss * dB/cm 10GHz 20GHz 30GHz 40GHz Solderability - Complies with IPC-4562A specifications * Tested on NX9255 material with 35µm copper
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N9000 N Copper Ultra flat ED copper foil extreme fine grain structure
No profile zinc-free and arsenic free treatment Ultra-flat profile for minimalist skin effect Superior conductor losses and PIM performance High temperature elongation properties Organic-free, anti-tarnish passivation Availability & Designation: NH – 18µm N1 – 35µm
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N9000 N Copper Typical Properties
Measured Parameters Units Product Gauge Nominal Thickness µm oz. 18 1/2 35 1 Area weight (±5%) g/m² oz/ft² 150 0.49 283 0.93 Untreated Side Roughness (Ra) µ.inch < 0.35 < 14 Untreated Side Roughness (Rq) 0.3 11.8 Treated Side Roughness (Rz) ≤ 1.3 ≤ 52 Treated Side Roughness (Rq) Tensile Strength Transverse (RT) MPa k.Lb/in² > 207 > 30 > 276 > 40 Tensile Strength Transverse (180°C) > 103 > 15 > 138 > 20 Elongation Transverse (RT) % 8 - 30 Elongation Transverse (180°C) Peel Strength after Thermal Stress * (20s /285°C) Lbs/in Insertion Loss * dB/cm 10GHz 20GHz 30GHz 40GHz Solderability - Complies with IPC-4562A specifications * Tested on NX9255 material with 35µm copper
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N9000 C Copper (Old and still running applications only)
Matte side treated High temperature elongation properties Zinc-free treatment Organic free, anti-tarnish passivation Designed for PTFE based laminates Availability & Designation: CT – 12µm CH – 18µm C1 – 35µm C2 – 70µm
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N9000 C Copper Typical Properties
Measured Parameters Units Product Gauge Nominal Thickness µm oz. 12 1/3 18 1/2 35 1 70 2 Area weight (±5%) g/m² oz/ft² 106.8 0.35 154 0.50 283 0.93 586 1.92 Untreated Side Roughness (Ra) µ.inch 0.20 – 0.40 8 – 16 Untreated Side Roughness (Rq) < 0.6 < 25 Treated Side Roughness (Rz) ≤ 5.1 ≤ 201 ≤ 5.5 ≤ 217 ≤ 6.6 ≤ 260 Treated Side Roughness (Rq) ≤ 0.9 ≤ 35 ≤ 1.0 ≤ 39 ≤ 1.2 ≤ 47 Tensile Strength Transverse (RT) MPa k.Lb/in² > 276 > 40 Tensile Strength Transverse (180°C) > 138 > 20 Elongation Transverse (RT) % ≥ 3 ≥ 6 ≥9 Elongation Transverse (180°C) ≥ 2 Solderability - Complies with IPC-4562A specifications
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