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Basic Planar Processes
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Processes used to fabricate IC
Silicon Wafer (Substrate) Preparation Epitaxial Growth Oxidation Photolithography Diffusion Ion Implantation Isolation Technique Metallization Assembly Processing and Pacckaging
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Silicon Wafer Preparation Czochralski Crystal Growth
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Silicon Ingot & Ingot Slicing
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Wafer Polishing and Etching
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Epitaxial Growth
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Oxidation Si + 2H2O SiO2 + 2H2
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Photolithography
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Diffusion
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Ion Implantation
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Isolation Techniques PN Junction Isolation Dielectric Isolation
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PN Junction Isolation
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Dielectric Isolation
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Metallization Aluminium is used in metallization due to following reasons: It is a good conductor. Easy to deposit using aluminium films using vacuum deposition It makes good mechanical bonds with silicon It forms low resistance contact with p type Si and heavily doped n-type Si.
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Vacuum Evaporation
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Assembly Processing and Packaging
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Assembly Processing and Packaging
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