1. IBL project for DT Science-Techno Tea
R. Vuillermet PH/ADO/PO
14/05/2012
R.Vuillermet

2. Overview Introduction to IBL project IBL project structure
IBL challenges
Focus on WG3
WG3 Partners
Scale one mock-up
Scenario and tools for beam pipe extraction and IBL insertion
14/05/2012
R.Vuillermet

3. Introduction to IBL project
IBL : Insertable B-layer
B Like “Beauty”
An additional layer of Pixel will be inserted into the Pixel detector of ATLAS
Why an additional layer ?
To be closer to interaction point and closer to the decay of the Beauty particle
To gain into track reconstruction by having a 4th point
To compensate the ineluctable degradation of the current B-Layer
To implement the most recent silicon and chips technology
14/05/2012
R.Vuillermet

4. Increased luminosity requires
Higher hit-rate capability
Higher segmentation
Higher radiation hardness
Lighter detectors
Radiation hardness improvement compared to now on pixel sensors
IBL approx. factor 5
Phase-2 approx. factor 10-30
14/05/2012
R.Vuillermet

5. IBL project structure Project leader : Giovanni Darbo (Genova, IT)
Technical coordinator : Heinz Perneger (PH/ADE)
Working group leaders :
WG1 : Module
Fabian Huegging Bonn & M. Garcia-Sciveres LBL
WG2 : Stave and Flex
E. Vigeolas CPPM & O. Rohne Oslo
WG3 : Integration and Installation,
R. Vuillermet CERN & F. Cadoux UniGe
WG4 : Off detector
T. Flick Wuppertal & S. Debieux UniGe
Each working group meet with there teams every 2 weeks
All the working group leaders with PL and TC meet once a month during a IBL Management Board
14/05/2012
R.Vuillermet

6. IBL Challenges WG1 : New technology for the module :
Planar and 3D (first time tested in experiment)
Those modules are qualify with x5 more irradiation dose (5xE15 neuton eq/cm2) than the current B-layer
New Front End Chip
x6 bigger in the surface than current Pixel (26888 /2880 channels)
Qualified for 250Mrad instead of 50Mrad,
Increase the number of included transistor 87Milliong (3.5M with current B-layer)
~2 cm
FE-I4 R/O Chip
27 k Pixels
87 M transistors
14/05/2012
R.Vuillermet

7. WG2 : Lighter structure, use of carbon foam
New cooling technology for the Pixel with Co2 instead of C3F8 (cooling pipe diameter 1.5mm)
New Stave’s flex with multilayers
2 aluminium layers sand 4 layers copper
Connection across the thickness with via (new technology)
K9 Foam bloc
K13C /RS3 parylen coated face plate
Peek end blocs
K13C/RS3 Omega
Stiffener
Flex Bus
ID 1.5mm Ti boiling pipe
14/05/2012
R.Vuillermet

8. WG3 :
Develop the scenario for Beam pipe extraction and IBL insertion, whereas this operation was never foreseen during the design of the current pixel detector.
Integration of the stave in very limited space
Tight integration of all modules services in a narrow space
Stave Handling frame
Beam Pipe
14/05/2012
R.Vuillermet

9. Optobox concept for Pixel readout upgrade and IBL
WG4 :
New electronic for read out (ROD read out driver) x4 more channel per board
Have to transmit signal of 1.60Mbytes on long cable (6-8m)
Guaranty low V drop in the power lines
Define and develop services with their connections
Optobox concept for Pixel readout upgrade and IBL
14/05/2012
R.Vuillermet

10. WG3 : Integration & Installation Partners
Several partners are collaborating in these tasks :
UniGe (Geneva) for the integration and loading tool
Loading of the stave on the beam pipe (operation to be done in SR1)
LAPP (Annecy)for the service organisation
Wrapping of the services to be able to insert IBL with their services into the Inner Support Tube (Ø86mm)
Integration and routing of services on the front face of the Inner Detector
14/05/2012
R.Vuillermet

11. LPSC (Grenoble) for the extraction/insertion supports
Brandeis (Boston) for the LGT development
Seattle for the IST fabrication
LAL (Paris) for the design of :
sealing ring (feed through and electrical shielding)
IST support
14/05/2012
R.Vuillermet

12. At CERN : Part time job Design and integration of the IBL Package
Christophe Bault (PH/DT) for the design and integration of PP0 area
Francois-Xavier Nuiry (PH/DT) for the design and integration of the flex + thermal mock-up
Denis Diyakov (PH/ADO) for the Services integration up to USA 15
Erik Richards (PH/ADO) for the services integration on the Calorimeter end plate and optobox design\
Sebastien Michal (PH/ADO - UniGe) for the CAD management, PP1 integration, integration with Pixel and DBM
Mock-up assembly and tests
Marco Ciapetti (PH/ADO) for the integration of the scale one mock up and its associated tooling.
Louis Rose-Dulcina and Francisco Limia-Conde (PH/ADO) for the assembly and tests of tooling in building 180.
Safety aspect for activation of the working area
Olga Beltramello (PH/ADO)
Mechanical simulation
Dimitar Mladenov (PH/ADO)
Part time job
14/05/2012
R.Vuillermet

13. Scale one mock-up (b180) Mock-up of the inner detector
Support tools for insertion/extraction
Supporting structure on side C with Mini vans
Supporting structure on side A with bridge scaffolding
15/11/2011
R. Vuillermet

14. Scenario and tooling for beam pipe extraction and IBL insertion
The removing the beam pipe in situ, is an operation that was never imagined during the design of the Pixel supporting structure.
This operation is delicate for several reasons :
The beam pipe is a long object (7.4m)
The beam pipe deforms under its own weight of about 40mm, when place on 2 supports at its extremities
The pixel modules are radially located at 8 mm from the beam pipe and are extremely fragile
The wire system that support the beam pipe is not directly accessible as it is located at 3m from any hands access
The working space to insert tools are rather small
The possibility to control visually the removing operation is limited or impossible ...
Despite what is looking like “impossible mission” we have imagined tools and procedures to perform this extraction operation
And have developed a scale one mock-up of the inner detector and its environment to test, improve, practise the tools and procedures
15/11/2011
R. Vuillermet

15. Remove the beam pipe Concept and tools
PP1 support
Beam pipe support :
A-side
C-side
Central wire support
Concept :
As their is not space out of the beam pipe to access and support it we have explored what can be done from the inside the beam pipe
The tools
The Long Guiding Tube (LGT)
The LGT was imagined and design such that it can take the load of the beam pipe and can control actively its central deflection (using muon alignment system connected to a tension mechanism). Once on the LGT, the beam pipe can slide out of the inner detector.
The collar removing tools
The collar removing tool is disassembling the collar and collecting the wires such that the beam pipe can slide through the Pixel B-Layer.
Reception tooling
For support, and handling of the different items that need to be transfer with the surface.
15/11/2011
R. Vuillermet

16. Remove the beam pipe Concept and tools
The beam pipe flange on A-side is too close to the B-layer envelope . The flange need to be cut on the aluminum section
The LGT is inserted inside the Beam Pipe and supported at both sides.
The support collar at PP0 A and C-side are disassembled and extracted with wires at PP1.
Beam pipe is extracted from the C-side and it pulls the wire at PP1
New cable supports are inserted inside Pixel volume at PP0.
A support carbon tube (Inner Support Tube IST) is pushed inside the Pixel volume along the LGT.
C-side
A-side
15/11/2011
R. Vuillermet

17. The LGT with a space frame are moved out from the IST
The IST is supported in 2 points at PP0 by the wire system and on PP1 walls on side C and A at the level of the Pixel cruciform.
The LGT with a space frame are moved out from the IST
. The new beam pipe with the IBL Package are inserted from C-side.
C-side
A-side
15/11/2011
R. Vuillermet

18. Removing the beam pipe The Long Guiding Tube (Brandeis)
An aluminium tube equipped with an optical system able to measure its deflection in the several points and equipped with a mechanical system applying a torque at both extremities pilot by a regulation soft to compensate the middle deflection.
Horizontal displacement
Vertical displacement
LGT with dummy beam pipe during calibration process
15/11/2011
R. Vuillermet

19. Deflecting under its own weight
LGT “OFF”
Deflecting under its own weight
LGT “ON”
Self compensating its natural deflecting
15/11/2011
R. Vuillermet

20. Remove the collar supporting the beam pipe
Screw driver tool
Bolt Catching tool
Collar catching tool
Extraction test with the first prototype tool
New tool
15/11/2011
R. Vuillermet

21. IBL :
A small detector (compare to ATLAS) with many challenges in all domains ...
14/05/2012
R.Vuillermet