1. Overview and update of LHCb Upgrade
“Preamble”
Excellent performance of current detector in hadronic environment demonstrated!
excellent vertexing performance
excellent mass resolution
excellent particle identification
high selectivity and low background
very efficient trigger
world best measurements in flavour physics and rare decays
ΔACP=[-0.82± 0.21(stat)±0.11(sys)]% @HCP2011
Note: seminar today at 11:00 on
First evidence of direct CP violation in D0K+K-,π+π- charm decays
Why upgrading LHCb?
LHCC Upgrade Session Dec 2011
Andreas Schopper

2. Global reconstruction
High-Level Trigger
~3 kHz
Level -0 L0
e, g
40 MHz
≤1 MHz
had m
Global reconstruction
30 kHz
HLT1
HLT2
Inclusive selections
m, m+track, mm, topological, charm, ϕ
& Exclusive selections
Storage: “nominal” event size ~35kB
High pT track with non-zero Impact Parameter
Why upgrading LHCb?
main limitation of current detector:
bandwidth & rate limitation of L0 trigger
trigger yield for hadronic channels flattens out at L ~ 2-3∙1032 cm-2 s-1 (ET - cut!)
nominal
allows to accumulate ~1-1.5/fb per year
~5-7/fb in 5 years up to LS2
LHCC Upgrade Session Dec 2011
Andreas Schopper

3. LHC schedule LHCb upgrade Plan to continue
Not yet approved!
2022
LS3
Installation of the
HL-LHC hardware
(accelerator
and detector)
LHCb upgrade
Plan to continue
until around 2030
Shown by Steve and by DG at EPS 2011 in Grenoble!
LHCC Upgrade Session Dec 2011
Andreas Schopper

4. Upgrade of LHCb
flexible software trigger with up to 40 MHz input rate and 20 kHz output rate
run at ~ 5-10 times nominal LHCb luminosity → L ~ 1-2 ∙ 1033 cm-2 s-1
big gain in signal efficiency (up to x7 for hadron modes)
upgrade electronics & DAQ architecture
collect ≥ 5/fb per year and ~ 50/fb in 10 years
LLT custom electronics
CPU Event Filter Farm
LHCC Upgrade Session Dec 2011
Andreas Schopper

5. Sensitivities to key quark flavour channels
LHCb
Upgrade
LHCC Upgrade Session Dec 2011
Andreas Schopper

6. Common 40 MHz electronics architecture
Front-end electronics: transmit data from every 25ns BX
Current
Readout Supervisor
L0 Hardware Trigger
HLT
Upgrade
Readout Supervisor
Low-level Trigger
HLT++
LHCC Upgrade Session Dec 2011
Andreas Schopper

7. Architecture Overview
Tell40 board
LHCC Upgrade Session Dec 2011
Andreas Schopper

8. Generic TELL40 board
generic board covers all functionalities required by the timing, control, low level trigger and data acquisition
first prototype to be fully tested by end 2012
LHCC Upgrade Session Dec 2011
Andreas Schopper

9. Detector upgrade to 40 MHz R/O
VELO
Si strips
(replace all)
Silicon Tracker
Si strips
(replace all)
Outer Tracker
Straw tubes
(replace R/O)
Muon MWPC
(almost compatible)
RICH
HPDs
(replace HPD & R/O)
Calo
PMTs (reduce PMT gain, replace R/O)
LHCC Upgrade Session Dec 2011
Andreas Schopper

10. Detector upgrade to luminosity of 1-2 ∙ 1033 cm-2s-1
Main limitation: increased occupancy in Outer Tracker
2∙1032 cm-2s-1
at 25ns
 μ = 0.4
10∙1032 cm-2s-1
at 25ns
 μ = 2
Note:
have been running already at μ~2.5
current geometry limiting to L ≤ 10∙1032 cm-2s-1
no safety margin OT IT
LHCC Upgrade Session Dec 2011
Andreas Schopper

11. Detector upgrade to luminosity of 1-2 ∙ 1033 cm-2s-1
Two scenarios in LoI for new tracker geometry
10∙1032 cm-2s-1 at 25ns
20∙1032 cm-2s-1 at 25ns OT OT
“IT+20 cm”
“IT+30 cm” IT IT
 designing detector to cope with 20∙1032 cm-2s-1
LHCC Upgrade Session Dec 2011
Andreas Schopper

12. Status of LHCb Upgrade
submitted upgrade LOI to LHCC beginning of March: [CERN-LHCC ]
physics case fully endorsed, 40 MHz architecture reviewed
recommendation in June 2011 to proceed to “framework TDR” and detector TDRs
now proceeding to TDRs in time for installing the detectors & electronics in 2018
Towards a “frame work TDR” ( “Addendum to the LoI”) in 2012
review status of possible technical options and R&D activities
define sub-system milestones towards TDRs (in particular those for technical reviews to decide between options)
provide cost estimate of upgrade for different options
clarify and substantiate interest of collaborating institutes
start discussion with LHCb funding representatives  “LHCb Upgrade Resource Board”, set-up by management/CB
define splitting between common items and individual sub-system TDRs & MoUs
LHCC Upgrade Session Dec 2011
Andreas Schopper

13. Organizational aspects
LHCb Upgrade Organization
The overall coordination is provided by the Upgrade Coordinator (Andreas Schopper) with the help of a Steering Panel, covering three domains:
Tracker & Tracking – all tracking detectors: upgrade of VELO, TT, IT, OT, with two representatives, one focusing on technical issues (Massimiliano Ferro-Luzzi) and one on tracking performance (Stephanie Hansmann-Menzemer)
Particle identification – both hadronic and leptonic, involving the upgrade of RICH&Torch, the Calorimeter and Muon systems (Guy Wilkinson)
Data processing – the full chain, from detector readout to offline: upgrade of Front-End, TELL40, Trigger (LLT+HLT), data acquisition and computing (Renaud Le Gac)
nb: The upgrade activities are driven by the current subprojects (no duplication of existing projects) and involve the Technical, Physics, Electronics, Simulation, etc. Coordinators to coordinate the upgrade effort in their domains.
LHCC Upgrade Session Dec 2011
Andreas Schopper

14. Review of sub-system activities
Review baseline upgrade with following criteria:
detector is read out at 40 MHz
HLT runs at a rate of at least 10 MHz
sustain a instantaneous luminosity of L~2∙1033 cm-2s-1 with 25ns spacing
sustain an integrated luminosity ~50/fb over 10 years
detector ready for installation in 2018 (LS2)
Detailed review of R&D activities and future plans in various workshops:
15-16 Sep. Tracker (OT, IT, TT) workshop
24-25 Oct. PID (RICH, calo, muon) workshop
2 Nov. Scintillating Fiber Tracker Meeting
09-10 Nov. VELO workshop
16-17 Nov. Data Processing workshop
(FE, TELL40, DAQ, trigger, computing)
5 Dec. Simulation kick-off meeting
a lot of progress in R&D, planning, declaration of interests by institutes, costing
LHCC Upgrade Session Dec 2011
Andreas Schopper

15. Sub-System Milestones towards TDR
Agreed on overall generic milestones, to be fine-tuned to specific sub-system:
in 2018: installation
: quality control & acceptance tests
: tendering & serial production
2013: TDR & prototype validation
2012: technical review & choice of technology
: continue R&D towards technical choices
End 2011: progress towards an “Addendum to the LoI” (in 2012)
Early 2011: LoI (fully endorsed in June)
timeline
Several technical choices & decisions before TDRs
VELO: pixel vs. strips
Large IT (and shorter OT straw tubes) vs. fiber CT
Optimized tracker geometry (# u,v,x planes OT, CT, IT, TT)
Back-End R/O board (TELL40) technology (ATCA /backplane free) …
few more info on these major ones…
 identified also need for major simulation effort!
LHCC Upgrade Session Dec 2011
Andreas Schopper

16. VELO options pixel detector:
LOI pixel layout
pixel detector:
VELOPIX based on Timepix chip with 55 μm x 55 μm pixel size, advantageous for pattern recognition
L-shaped half modules with two blocks of 6 chips
several sensor options being investigated
strip detector:
based on proven design, but with reduced strip pitch and increased number of strip
prototypes in production (Hamamatsu & Micron)
same chip as other silicon strip detectors
Layout of R and Ф strip sensor prototypes
(every 5th strip plotted)
LHCC Upgrade Session Dec 2011
Andreas Schopper

17. VELO challenges @ 40 MHz & 2 x 1033
New modules and FE electronics
must be able to withstand radiation levels of ~ 370 MRad or 8 x 1015 neq/cm2
two options: pixels and strips
capable of dealing with huge data rate
Pixel: > 12 Gbit/s for hottest pixel chip
Strip: on-chip zero suppression and CM algorithms
New module cooling interface
New RF foil
All without sacrifices in material budget
Number of tracks per event
per chip
for pixels
 a lot of R&D ongoing with much progress in all areas
per sensor
for strips
Strip sensors
Pixel sensors
LHCC Upgrade Session Dec 2011
Andreas Schopper

18. VELO module building activities
R&D phase
Construction phase
Strips:
Large, thin sensors:
Handling, irradiation
ASIC design
Pixels:
Chip Production
Wafer Testing
Metal deposition
Wafer thinning and dicing
Flip Chip assembly
and probing
Strips:
Sensor QA
ASIC production
High density sensor
wire bonding
Pixels:
Finalise ASIC
Chip attachments
to diamond heat spreader
Items in common:
R/O development for testing
CVD diamond as support
Hybridisation options
Cooling within module
Cooling integration
Fast flex development
Connectors
Irradiation tests
Sensor choice
Items in common:
Bonding and assembly jigs
Common DAQ systems
Cooling plane attachment
Flex attachment
Module wire bonding
Quality Control
Burn-in
Conservative design:
55 um pixel pitch bump bonding is well established technology
sensor and wafer thinning accomplished routinely for 10M ALICE pixel system
 a lot of items in common
LHCC Upgrade Session Dec 2011
Andreas Schopper

19. Tentative VELO milestones
2018: Installation
2017: Production, integration
2016: Production readiness reviews, module production launch
2015: readout chain prototype, module prototype, final FE chip
early 2014: TDR
end 2013: 12-chip demonstrator module
2013: decision on thermal management of module
2013: FE chip prototype
pixel Chip => 2012: Timepix3, 2013: VELOpix
strip Chip => 2012: ADC submission, 2013: 1st multichannel
2012: demonstrator module 0
LHCC Upgrade Session Dec 2011
Andreas Schopper

20. “Central Tracker” with 250 μm SciFi
Tracker options
“large-area Silicon Strip Inner Tracker” (with short OT straws) or “250 μm Scintillating Fiber Central Tracker” 
OT: Straws
“Central Tracker” with 250 μm SciFi
OT: Straws
“large area” IT with
Silicon Strips
 both compatible with 2*1033 luminosity
LHCC Upgrade Session Dec 2011
Andreas Schopper

21. Light & large area IT with silicon strips
OT: Straws
light IT:
Silicon Strips
Current IT
Tape Automated Bond
Effort started
strip chip design
cooling proof of concept (air flow)
received 10 sensors for testing TAB, module assembly, HV, etc.
Light & large area IT
light: reduce X/X0 ~ 2
large: increase area by ~ : from 126x22(42)cm to 255x42(63)cm
optimise station layout: now 3x(xuvx)=12 layers in-front of T3 to 2x(xuxvx)=10 layers behind T1 & T3
LHCC Upgrade Session Dec 2011
Andreas Schopper

22. Central Tracker (CT) made from 250μ fibers
(Evolution of scintillating fiber Inner Tracker to Central Tracker)
OT: Straws
“Central Tracker”
CT:
Scintillating Fibers
5 layers of densely packed 250μm diameter fibers
readout with 128-channel Silicon Photomultipliers (SiPM)
2×2.5m long fibers, readout on top and at bottom of stations
Advantages:
only sensitive material in acceptance (no cables, no cooling, ...)
uniformity in material distribution
50-60 μm resolution (to be demonstrated with test beam data)
LHCC Upgrade Session Dec 2011
Andreas Schopper

23. Central Tracker (CT) Challenges:
long fibers => multiple hits per channel (occupancy)
 in principle not a problem with existing tracking strategy (to be demonstrated with simulation data)
building and alignment of 2.5m-long modules
develop, test, and produce front-end electronics in tight schedule
SiPM radiation hardness => shielding & cooling needed
a lot of R&D ongoing in all areas
SiPM investigations:
integrated neutron flux at the level of ~1012/cm2
various studies showed significant deterioration at ~1011/cm2
radiation tolerance is actively studied:
in situ SiPM samples with and without shielding
irradiation with neutrons and with protons
testing effect of shielding (Polyethylene, Cd, Pb)
testing effect of cooling
solution is taking shape, as a combination of:
improved technology (with manufacturer)
shielding (factor ~2)
active cooling of SiPM (factor 2 every 8-10°C)
...and S/N performance as function of accumulated dose
LHCC Upgrade Session Dec 2011
Andreas Schopper

24. Tentative milestones Central Tracker (CT)
LHCC Upgrade Session Dec 2011
Andreas Schopper

25. Declaration of Interests, Common Projects and Cost
Interests for participation to sub-systems, as declared at the upgrade workshops:
Common Projects
(still evolving!)
Baseline upgrade:
detector R/O at 40 MHz
L ~ 2∙1033 cm-2 s-1 ; 25ns
HLT at ≥ 10 MHz rate
Total re-estimated investment cost  ~ 52 MCHF
(does not include R&D and MP)
Common Fund part  ~ 30%
(= investment to Common Projects)
First “LHCb Upgrade Resources Board” took place to discuss manpower and funding situation
For the R&D phase manpower is an issue in particular for simulation and Common Projects
New Collaborators welcome to join LHCb upgrade effort!
LHCC Upgrade Session Dec 2011
Andreas Schopper

26. Conclusions
LHCb is planning to upgrade to 40 MHz R/O and for a luminosity of up to L ~ 2∙1033 cm-2 s-1 for installation in LS2 (2018)
LoI endorsed  aiming at
addendum to LoI in 2012
detector TDRs in ~2013
reviewing and monitoring progress in the various R&D activities, simulation efforts, planning and cost
clarifying interests by collaborating institutes and funding
Requirements to the LHC
IP8 to be compatible with HL-LHC after LS3 (shielding!?)
25 ns bunch spacing essential (pile-up!)
keep possibility of swapping B-field (systematic errors!)
LHCC Upgrade Session Dec 2011
Andreas Schopper

27. Spare slides
LHCC Upgrade Session Dec 2011
Andreas Schopper

28. LHCC Upgrade Session Dec 2011
Andreas Schopper

29. LHCC Upgrade Session Dec 2011
Andreas Schopper

30. LHCC Upgrade Session Dec 2011
Andreas Schopper

31. LHCC Upgrade Session Dec 2011
Andreas Schopper

32. TORCH Time Of internally Reflected CHerenkov light
TORCH could provide positive identification of kaons up to p ~ 10 GeV/c and beyond
Cherenkov light production is prompt → use quartz as source of fast signal ~ 70 ps resolution required per detected photon
Focusing element currently designed around commercial micro-channel plate (MCP) device: the Planacon [Burle/Photonis] available in 1024-channel (32×32) version
R&D on photodetector performance progressing well
Excellent timing resolution achieved for single photons using Planacon: σ(t) = 47 ps (single-channel readout)
LHCC Upgrade Session Dec 2011
Andreas Schopper

33. LHCC Upgrade Session Dec 2011
Andreas Schopper