1. ELECTRONIC ASSEMBLIES AND SOLDERING TECHNIQUE –PART II
NAME : MOHD ROSDAN BIN MOHAMAD
DATE : 4 MAC 2016
IPC-A-610E

2. Components are centered between their lands.
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1. Component Mounting – Orientation – Horizontal
Target - Class 1,2,3
Components are centered between their lands.
Component markings are discernible.
Nonpolarized components are oriented so that markings all read the same way (left- to-right or top-to-bottom).
Acceptable - Class 1,2,3
Polarized and multilead components are oriented correctly.
All components are as specified and terminate to correct lands.
Nonpolarized components are not oriented so that markings all read the same way (left-to-right or top-to-bottom).

3. Component is not as specified (wrong part) (A).
7 Through-Hole Technology 1.
Component Mounting – Orientation – Horizontal (cont.)
Defect - Class 1,2,3
Component is not as specified (wrong part) (A).
Component not mounted in correct holes (B).
Polarized component mounted backwards (C).

4. Nonpolarized component markings read from the top down.
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2. Component Mounting – Orientation – Vertical
Target - Class 1,2,3
Nonpolarized component markings read from the top down.
Polarized markings are located on top.
Acceptable - Class 1,2,3
Polarized marking hidden.
Nonpolarized component markings read from bottom to top.
Defect - Class 1,2,3
Polarized component is mounted backwards.

5. Radial Leads – Horizontal
7 Through-Hole Technology 3.
Radial Leads – Horizontal
Target - Class 1,2,3
The component body is in flat contact with the board’s surface.
Acceptable - Class 1,2,3
Component in contact with board on at least 1 side and/or surface.
Note: When documented on an approved assembly drawing, a component may be either side mounted or end mounted. The body may need to be bonded or otherwise secured to the board to prevent damage when vibration and shock forces are applied.
Defect - Class 1,2,3
Unbonded component body not in contact with mounting surface.

6. Process Indicator Class 2 Defect - Class 3
7 Through-Hole Technology 4.
Component Mounting – Lead Forming – Bends
Acceptable - Class 1,2,3
The inside bend radius of component leads meets requirements of Table 7-1.
Table 7-1 Lead Bend Radius
Lead Diameter (D)
or Thickness (T)
Minimum Inside
Bend Radius (R)
<0.8 mm [0.031 in]
1 D/T
0.8 mm [0.031 in] to
1.2 mm [ in]
1.5 D/T
>1.2 mm [ in]
2 D/T
Note: Rectangular leads use thickness (T).
Acceptable - Class 1
Process Indicator Class 2
Defect - Class 3
Inside bend radius does not meet
requirements of Table 7-1.
Defect - Class 1,2,3

7. Lead damaged more than 10%
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Component Mounting – Lead Forming – Bends (cont.)
Acceptable - Class 1,2,3
Leads of through-hole mounted component extend at least
1 lead diameter or thickness but not less than mm [0.031 in] from the body, solder bead, or lead weld.
Figure 7-10
Solder bead
Weld
Acceptable - Class 1
Process Indicator – Class 2
Defect - Class 3
Lead bend of through-hole mounted component is less than 1 lead diameter or 0.8 mm [0.031 in], whichever is less, from the component body, solder bead
Defect - Class 1,2,3
Lead damaged more than 10%

8. Axial Leaded – Horizontal
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Axial Leaded – Horizontal
Target - Class 1,2,3
The entire body length of the component is in contact with the board surface.
Components required to be mounted off the board are at least 1.5 mm [0.059 in] from the board surface.

9. Axial Leaded – Vertical
7 Through-Hole Technology 6.
Axial Leaded – Vertical
Target - Class 1,2,3
The clearance (C) of the component body or weld bead above the land is 1 mm [0.039 in].
The component body is perpendicular to the board.
The overall height does not exceed maximum design height requirements (H).
Acceptable - Class 1,2,3
The component or weld bead clearance (C) above the land meets the requirements of Table 7-2.
The angle of the component lead does not cause a violation of minimum electrical clearance.
Table Component to Land Clearance
Class 1
Class 2
Class 3
C (min)
0.1 mm
[ in]
0.4 mm
[0.016 in]
0.8 mm
[0.031 in]
C (max)
6 mm
[0.24 in]
3 mm
[0.12 in]
1.5 mm
[0.059 in]

10. 6. Axial Leaded – Vertical (cont.)
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6. Axial Leaded – Vertical (cont.)
Acceptable - Class 1 Process Indicator - Class 2,3
The component or weld bead clearance (C) is greater than the maximum given in Table 7-2
The component or weld bead clearance (C) is less than the minimum given in Table 7-2.
Defect - Class 1,2,3
Components violate minimum electrical clearance.

11. 7. Radial Leads – Vertical
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7. Radial Leads – Vertical
Target - Class 1,2,3
Component is perpendicular and base is parallel to board.
Clearance between base of component and board surface/ land is between 0.3 mm [0.012 in] and 2 mm [0.079 in].
Figure 7-33
Acceptable - Class 1,2,3
Component tilt does not violate minimum electrical clearance. C
Process Indicator - Class 2,3
Space between component base and board surface/land is less than 0.3 mm [0.012 in] or more than 2 mm [0.079 in]
Defect - Class 1,2,3
Violates minimum electrical clearance.
Note: Some components cannot be tilted due to mating requirements with enclosures or panels, for example toggle switches, potentiometers, LCDs, and LEDs.

12. Leads are formed to provide stress relief.
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8. Component Mounting – Lead Forming – Stress Relief
Acceptable - Class 1,2,3
Leads are formed to provide stress relief.
Component lead exiting component body is approximately parallel to major body axis.
Component lead entering hole is approximately perpendicular to board surface.
Component centering may be offset as a result of the type of stress relief bend.
Figure 7-13
Typically wire diameters
1 wire diameter minimum
2 wire diameter minimum

13. Component Mounting – Lead Forming – Stress Relief (cont.)
7 Through-Hole Technology 8.
Component Mounting – Lead Forming – Stress Relief (cont.)
Acceptable - Class 1 Process Indicator - Class 2
Defect - Class 3
Lead bends less than 1 lead diameter or 0.8 mm [ in] away from body seal.
Defect - Class 1,2,3
Damage or fracture of component body-to- lead seal.
No stress relief.

14. End is discernible in the solder.1
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9. Wire/Lead Protrusion
Table Protrusion of Wires/Leads in Supported Holes
Class 1
Class 2
Class 3
(L) min.
End is discernible in the solder.1
(L) max.2
No danger of shorts
2.5 mm [ in]
1.5 mm [0.059 in]
Acceptable - Class 1,2,3
The leads protrude beyond the land within the specified minimum and maximum (L) of Table 7- 3, provided there is no danger of violating minimum electrical clearance.
The leads meet the design length (L) requirements when specified.

15. Standoff step on all leads rests on the land.
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10. Devices and Sockets
Target - Class 1,2,3
Standoff step on all leads rests on the land.
Lead protrusion meets requirements.
Acceptable - Class 1,2,3

16. Devices and Sockets (cont.)
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10.
Devices and Sockets (cont.)
Defect - Class 1,2,3
Lead protrusion does not meet acceptance requirements

17. Component Mounting – Leads Crossing Conductors
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11.
Component Mounting – Leads Crossing Conductors
Acceptable - Class 1,2,3
Sleeve does not interfere with formation of the required solder connection (A).
Sleeve covers area of protection designated (B).
Defect - Class 2,3
Splitting and/or unraveling of sleeving (A).
Defect - Class 1,2,3
Component leads and wires required to have sleeving are not sleeved.
Damaged/insufficient sleeving does not provide protection from shorting.
Sleeving interferes with formation of the required solder connection.
A component lead crossing an electrically noncommon conductor violates minimum electrical clearance (B).

18. 12. Component Mounting – Lead Forming – Damage
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12. Component Mounting – Lead Forming – Damage
Acceptable - Class 1,2,3
No nicks or deformation exceeding 10% of the diameter, width or thickness of the lead.
Defect - Class 1,2,3
Lead is damaged more than 10% of the lead diameter or thickness.
Lead deformed from repeated or careless bending.

19. 13 Jumper Wires – Wire Routing
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13 Jumper Wires – Wire Routing
Target - Class 1,2,3
Wire routed shortest route.
Wire does not pass over or under component.
Wire does not cross component.