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Tertiary Manufacturing Processes
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Tertiary Manufacturing Processes
Grinding and Abrasive Processes Grinding Honing, Lapping, Super-finishing, Polishing and Buffing Non-traditional Machining and Thermal Cutting Processes Mechanical Energy Processes Electrochemical Machining Processes Thermal Energy Processes Chemical Machining
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Grinding Grinding – material removal by an abrasive bonded grinding wheel rotating a high speed. Grinding Wheel – basic parameters: Abrasive material Grain size Bonding material Wheel grade Wheel structure
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Grinding Wheel Abrasive materials
Aluminum oxide: grinding ferrous and high-strength alloys (Knoop hardness ~ 2100) Silicon carbide: grinding aluminum, brass, and stainless steel, cast irons and certain ceramics (Knoop hardness ~ 2500) Cubic boron nitride: grinding hardened steels and aerospace alloys (Knoop hardness ~ 5000) Diamond: grinding ceramics, cemented carbides, and glass (Knoop hardness ~ 7000)
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Grinding Wheel Grain size – size of the abrasive particles
Typical grain size: (mesh size: lines/in) Grit size 8: coarse grain – for harder material Grit size 250: fine grain – for soft material, and for lapping and superfinishing
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Grinding Wheel Bonding materials – requires strength, toughness, hardness, and temperature resistance. Vitrified bond: baked clay and ceramics, most common Silicate: low heat generation, tool grinding Rubber: flexible, cutoff operation Resin: thermosets, rough grinding and cuttoff Shellac: Varnish, strong but not rigid, good finish Metallic: Usually bronze, diamond of cubic boron nitride wheels
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Grinding Wheel Wheel structure and Wheel grade
Wheel structure – relative spacing of the abrasive grains in the wheel Vg+ Vb+ Vp = 1.0 Vg - proportion of abrasive grain in the wheel Vb - proportion of bond material in the wheel Vp - proportion of pores in the wheel Wheel grade – bond strength between abrasive grits, largely depending on Vb. Grade is measured on a scale between soft (A) and hard (Z).
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Grinding Wheel Specification
Wheel specification: 30A46H6VXX 30 – Prefix (manufacturer’s symbol for abrasive, optional) A – Abrasive type (A – aluminum oxide, C – silicon carbide, etc.) 46 – Grain size (coarse = 8,10,12,14,16,20,24; medium = 30,36,46,54,60; fine = 70,80,…,180; very fine = 220,240,….,600) H – Grade (A = soft, M = medium, Z = hard) 6 – Structure (1 = very dense, 15 = very open) V – bond type (B-resinoid, E-shellac, R-rubber, S-silicate, V-vitrified) XX – Manufacturer’s record (optional)
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Grinding Wheel Specification
Wheel specification: XXD150PYYMZZ1/8 XX – Prefix (manufacturer’s symbol for abrasive, optional) D – Abrasive type (D – diamond, B – cubic boron nitride) 150 – Grain size (coarse = 8,10,12,14,16,20,24; medium = 30,36,46,54,60; fine = 70,80,…,180; very fine = 220,240,….,600) P – Grade (A = soft, M = medium, Z = hard) YY – Concentration (manufacturer’s designation) M – Bond type (B-resin, M-metal, V-vitrified) ZZ – Bond modification (manufacturer’s notation) 1/8 – Depth of abrasive (in inches or mm)
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Grinding Wheel Configurations
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Grinding Analysis Material removal rate, MRR = vwwd
vw = work speed w = cutting width d = depth of cut Specific energy = Fcv / vwwd Fc = cutting force v = wheel speed Improving surface finish: Increasing wheel speed and/or wheel surface grit density
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Grinding Process Specific energy is much greater than conventional machining Most of the energy in grinding results in high work surface temperature Workpiece temperature can be lowered by grinding fluid.
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Surface Grinding
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Cylindrical Grinding
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Centerless Grinding http://www.youtube.com/watch?v=k557Zoeu38s&NR=1
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Related Abrasive Processes
Honing – round hole Lapping – flat or slightly spherical surface Superfinishing – flat surface, external cylinder Polishing – Miscellaneous shapes Buffing - Miscellaneous shapes
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Surface Roughness Values
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Honing Honing speed typically 0.3 – 3 m/s Grit size typically 30 – 600
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Lapping For production of surface of extreme accuracy and smoothness
Fluid suspended abrasive particles between workpiece and lapping tool having the shape of the workpiece Grit size
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Superfinishing Similar to honing
Shorter stroke ~ 4.5 mm up to 1500 strokes / minute Lower pressure between tool and workpiece Lower work speed ~ 0.25 m/s Smaller grit size ~ up to 1000
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Polishing Polishing Removing scratches and burrs by means of abrasive grains attached to a polishing wheel rotating at high speed of around 38 m/s. Abrasive grains are glued to the outside periphery of flexible wheel. Grit size ranges from 20 to 120.
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Buffing Buffing Similar to polishing but used to form high luster surface Wheels are softer Very fine grit size mixed in buffing compound Speed – 40 to 85 m/s Perform manually
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Non-traditional Machining and Thermal Cutting Processes
Mechanical Energy Processes Electrochemical Machining Processes Thermal Energy Processes Chemical Machining
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Mechanical Energy Processes
Ultrasonic Machining Water Jet Cutting Abrasive Jet Machining
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Ultrasonic Machining Ultrasonic machining
Abrasive slurry driven over the workpiece by an ultrasonic vibration tool at about 20kHz Amplitude vibration of 0.076mm Tool materials – soft steel and stainless steel Abrasive materials – boron nitride, boron carbide, aluminum oxide, silicon carbide, diamond Grit size – 100 to 2000 Gap size – about 2 times grit size
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Ultrasonic Machining The grit size determines the surface finish
The concentration of abrasive in the water-based slurry is between 20% to 60%.
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Water Jet Cutting Uses a fine, high-pressure water jet to cut the workpiece Diameter of nozzle – 0.1~0.4 mm Water jet pressure – 400 MPa Nozzle material – sapphire, ruby or diamond Filtration system to separate swarf Process parameters – standoff distance (3.2 mm), nozzle diameter, jet pressure, and feed rate (5 mm/s – 500 mm/s) Not suitable for brittle materials
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Abrasive Jet Machining
Abrasive water jet cutting Abrasive particles, aluminum oxide, silicon oxide, added to the jet stream to facilitate cutting Grit size: Nozzle diameter: 0.25 – 0.63 mm Abrasive jet machining High velocity gas jet with abrasive materials Dry gas (air, nitrogen, carbon dioxide, and helium) at 0.2 to 1.4 MPa Nozzle diameter – to 1 mm Jet velocity – 2.5 to 5 m/s
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Electrochemical Machining Processes
Electrochemical deburring and grinding
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Electrochemical Machining (ECM)
Removes metal from an electrically conductive workpiece by anodic dissolution Workpiece (anode) is formed by electrode tool (cathode) at close proximity, setting up an electrolytic action or a deplating operation The electrolyte flows rapidly to remove the deplated material Tool material – copper, brass or stainless steel Feed rate of tool = metal removal rate
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Electrochemical Machining (ECM)
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Electrochemical Machining (ECM)
Typical electrode gap distance = to 0.75 mm Electrolyte – water plus salt (NaCl or NaSO3) Removed work material is in the form of micro particles which require separation and handling Voltage in ECM is kept relatively low to avoid arcing across the gap. Applies to hard metal or complex work geometry components for good finish Low tool wear
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Electrochemical Deburring and Grinding
Electrochemical deburring (ECD) Adapting ECM for deburring and rounding sharp corners on metal parts
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Electrochemical Deburring and Grinding
Electrochemical grinding (ECG) A rotating grinding wheel with conductive bonding material to augment anodic dissolution of metal workpiece surface Deplating 95% Grinding 5%
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Thermal Energy Processes
Electric Discharge Machining Electron Beam Machining Laser Beam Machining Arc Cutting Processes Oxyfuel Cutting Processes
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Electric Discharge Machining (EDM)
Metal removal is effected by pulsating electric arcing from a formed electrode tool acting as a cathode. The workpiece anode is separated from the tool by a small gap filled with dielectric fluid. The dielectric fluid ionized along the path of discharge.
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Electric Discharge Machining (EDM)
Material melted by the discharge and removed by the flowing dielectric. Metal removal is increased by higher frequency and higher current. Best surface finish obtained by higher frequency and low current. Overcut in EDM is produced when electrical discharges occur at the sides of the tool and at the end.
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Electric Discharge Machining (EDM)
Tool wear occurs with high spark temperature. The work material removal versus tool wear ratio is between 1 to 100 Electrode material - graphite, copper, brass, copper tungsten, etc. Hardness and strength of the work material do not affect the process, while the melting point is a governing factor. Dielectric fluids include hydrocarbon oils, kerosene, and distilled or deionized water. Used for tool fabrication and parts production.
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Electric Discharge Machining (EDM)
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Electric Discharge Wire Cutting
Special form of EDM using a small-diameter wire as the electrode to cut a narrow kerf in the work. Workpiece is fed continuously and slowly past the wire to achieve the cutting path Wire diameter – to 0.3 mm Wire material – brass, copper, tungsten, and molybdenum.
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Electric Discharge Wire Cutting
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Electron Beam Machining
High velocity stream of electrons focused on the workpiece surface to weld, cut or heat-treat it Conducted in vacuum Beam diameter down to mm Hole depth-to-diameter – 100:1 Thicknees: 0.25 to 6.3 mm No tool wear
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Laser Beam Machining Laser to remove material by vaporization and ablation Types of lasers – carbon dioxide gas lasers and YAG lasers Drilling, slitting, slotting, scribing, and marking Hole size down to mm Unlimited workpiece material
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Arc Cutting Processes Electric arcing between an electrode and the workpiece to generate intense heat for welding or cutting metal Plasma arc cutting – Plasma is a superheated, electrically ionized gas (nitrogen, argon-hydrogen, or mixture) Secondary gas to confine the arc and clean the kerf Temperature – 10,000 to 14,000C Nozzle is water cooled CNC operation possible
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Arc Cutting Processes Plasma arc cutting –
Maximum workpiece thickness – 150 mm Maximum feed rate – m/s Rough cutting surface and metallurgical damage
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Oxyfuel Cutting Processes
Flame cutting using energy from exothermic reaction of the metal with oxygen Fuels include acetylene, propylene, and propane.
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Chemical Machining Chemical Milling Chemical Blanking
Chemical Engraving Photochemical Machining Tolerance as close as mm
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Chemical Milling Sequence of processing steps in chemical milling (1) clean raw part, (2) apply maskant, (3) scribe, cut, and peel the maskant from areas to be etched, (4) etch, and (5) remove maskant and clean to yield finished part.
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Chemical Blanking Sequence of processing steps in chemical blanking (1) clean raw part, (2) apply resist (maskant) by painting through screen, (3) etch (shown partially etched), (4) etch (completed), and (5) remove resist and clean to yield finished part.
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Chemical blanking
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Chemical Engraving Process similar to the other chemical processes except: Filling to apply paint or other coating into the recessed area Panel immersed in a solution to dissolves the resist but not the coating material Resist is removed highlighting the coating pattern
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Photochemical Machining (PCM)
Sequence of processing steps in photochemical machining (1) clean raw part, (2) apply resist (maskant) by dipping, spraying, or painting, (3) place negative to resist, (4) expose to ultraviolet light, (5) develop to remove resist from areas to be etched, (6) etch (shown partially etched), (7) etch (completed), (8) remove resist and clean to yield finished part.
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Application Considerations
Very small holes below mm diameter. (Laser beam machining, LBM) Holes with large depth-to-diameter ratio, d/D>20. (ECM or EDM) Holes that are not round (ECM or EDM) Narrow slots in slabs or plates (ECM, LBM, EDM, water jet, abrasive jet) Micromachining (PCM, LBM, EBM) Shallow pockets and surface details in flat parts (Chemical machining) Special contoured shapes for mold and die applications (EDM or ECM)
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Application Considerations
Special shapes for which the non traditional processes are appropriate (a) very small diameter holes, (b) holes with large depth-to-diameter ratios, (c) nonround holes, (d) narrow, non-straight slots, (e) pockets, and (f) die sinking
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Materials Consideration
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Machining Characteristics
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Design for Manufacturing
Part Drawing Select stock Process Plan Check tolerances and datum Select process Set up Fixture Process conditions Measurement Packaging Maintenance
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