1. Introduce PCB Products of KC

2. Content 1.Introduction 2.Thin board PCB 3. FPCB board 4. Tab PCB
5.High frequency PCB
6.HDI PCB
7.BIB PCB
8. POV PCB
9. Metal Core PCB
10.Technology Roadmap
改成立體層次的感覺

3. Introduction Establishment August,1990 Capital US$ 5,000,000 Estate
2,500 sq meter
Plant Area
3,600 sq meter
Employees
250

4. Thin Board PCB Material : FR-4 Mid Tg Layer : 2 L
Board Thickness : /-0.01mm
Line: Width/Space : 3/3.5 mil
Surface Finish ﹕Ni/120u” ,Au 5u”
Application: Memory card

5. FPCB Material : FCCL Layer : 2L PNL size:11.85 X 19.8 MM
Cu thickness: 1oz
Board Thickness : 0.16 mm
Impedance control: 100+/-5ohm
Surface Finish ﹕ENIG
Application: High Speed Connector
C side
S side

6. FPCB Material : FCCL Layer : 3L PNL size:1.6X 3.9 MM Cu thickness: 1oz
Board Thickness : 0.22 mm
SF-PC5000 paste x2
G/F Stiffener x2
Surface Finish ﹕ENIG
Application: Communication
C side
S side

7. Tab PCB Material : FPC or FR-4 halogen free material Layer : 1 L
Board Thickness : 0.05~0.127 mm
Pcs Size: about 1.11x 1.5 mm
Surface Finish ﹕Ni/100u” ,Au 2u”
Application: Hearing instrument , Audiphones

8. Hi Frequency PCB Material : Nelco N4000-13 si Layer : 6 L
Board Thickness : 1 +/-0.1mm
Line: Width/Space : 5/5 mil
Surface Finish ﹕Ni/120u” ,Au 2u”
G/F : Selective Au plating 30u”
Blind via for L12 and L56,
Buried via for L13 and L46
Impedance control: 100+/-5ohm
Application: Hi frequency connector

9. Hi Frequency PCB Material : Rogers 4350 & FR4
Rogers material 4350 L12 and L23
Layer : 6L
Board Thickness : 2.0+/-0.15mm
Surface Finish ﹕Ni/120u” ,Au 2u”
Blind via for L12
Impedance control: 50+/-2.5ohm
Application: Hi frequency test board

10. HDI PCB Material : FR-4 Hi Tg Layer : 4 L
Board Thickness : 0.7 +/-0.01mm
Line: Width/Space : 7.87/7.87 mil
Surface Finish ﹕Ni/120u” ,Au 2u”
Blind via for L12 and L34, Buried via for L23
Application: DC Power supply

11. Burn In Board PCB Material : FR5 Layer : 10L
Board Thickness : 1.6 +/-0.16mm
Line: Width/Space : 5/5 mil
Surface Finish ﹕Ni/120u” ,Au 2u”
G/F : Au plating 35u”
Drill pitch:0.65 mm
Application: Burn In Board

12. Burn In Board PCB Material : NP175 Layer : 8 L
Board Thickness : 1.6 +/-0.16mm
Line: Width/Space : 5/5 mil
Surface Finish ﹕Ni/120u” ,Au 2u”
G/F : Au plating 35u”
Drill pitch:0.5 mm
Application: Burn In Board

13. POV (Pad On Via) PCB Material : FR4 Layer : 4 L
Board Thickness : 0.8 +/-0.08mm
Line: Width/Space : 4/4mil
Surface Finish ﹕Ni/120u” ,Au 3u”
Application: GPS

14. Metal Core PCB Material : Metal Core PCB Layer : 1L
PNL size:18.11 x inch
Cu thickness: 1oz
Board Thickness : 3.2 mm
Thermal conductivity:3 W / mk
Surface Finish ﹕Ni/120u” ,Au 2u”
Application: Lighting

15. Metal Core PCB Material : Metal Core PCB Layer : 1L
PNL size:3.38 x 4.40 inch
Cu thickness: 1oz
Board Thickness : 1.0 mm
Thermal conductivity:3 W / mk
Surface Finish ﹕OSP
Application: Lighting