1. Status on INTT bus extender R&D
Takashi HACHIYA
RIKEN/RBRC
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

2. Radiation Lab meeting, Takashi HACHIYA
FVTX
Introduction
Bus extender is a cable connecting Silicon ladder and the read out card (ROC)
FVTX has the extender (orange cable)
27cm long
7 layer flexible PC board (F-PCB)
INTT Requirement :
Extender should be 1m extender long (more)
ROC is placed at outside of the TPC cage
Comparing with FVTX
Same signal lines : 62 LVDS pairs (26 FPIX chips)
Idea is basically to make the FVTX extender but with 1m long
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

3. Radiation Lab meeting, Takashi HACHIYA
R & D plan
Technology today
Very Long + Multi-layer FPC is not available in commercial
Single layer FPC can extend very long (~10m)
Multi-layer FPC is limited with 40cm because of the manufacturing machine
Long & multi-layer FPC is challenging
Very long, Many signal lines (digital)
High speed (200MHz clock)
R&D plan
R & D of extender including F-PCB simulations and proto-type is necessary
Need good partners
Need to develop the multi-pressing technique to extend the F-PCB to 1m
1 press = 40cm at the maximum, repeat pressing
We collaborate with TIRI lab. and REPIC corporation
TIRI: Tokyo Metropolitan Industrial Technology Research Institute
Engineering lab. to help small businesses and start-up companies
They has good skill for PCB simulation
Kohei Fujiwara is working at the lab, who made the VTX-PIXEL bus
REPIC
They are working on INTT HDI
We applied for the public offer of the collaborating R&D by TIRI
Interview at last week
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

4. Radiation Lab meeting, Takashi HACHIYA
Role and Schedule
Roles
RIKEN:
Make the spec. (thickness & width of F-PCB, width of signal line, layer arrangement)
Test the prototype
TIRI:
PCB simulation
REPIC:
Make prototype F-PCB
Develop the new technique to make 1m FPC w/ multi-layer
R & D procedure : 3 step development
Long distance transfer
Single layer w/ some LVDS pairs
Multi layer with Long distance transfer
multi layer w/ some LVDS pairs (probably 2-3 layers)
Full model prototype (for production )
total verification
Schedule
Plan to finish by 2018 March
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

5. Radiation Lab meeting, Takashi HACHIYA
Plan B
Could be useful to think about
F-PCB extender is very challenging.
Plan B
Connect some 40cm F-PCB’s to make 1m
Use a single layer FFC (flexible flat cable) which is available in commercial
This sample cable is held by ZIF connector (Zero Insertion Force)
Good accessibility and easy mentenance, and cheap
Usually use in note PC (connection between keyboard and mother board)
Design should be changed.
Enough long but less dense.
Need the attachment to convert the connector type( line width…)
There is almost no open space around the ladder connector.
ROC
Commercial F-PC
Ladder
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

6. Radiation Lab meeting, Takashi HACHIYA
backup
2017/4/28
Radiation Lab meeting, Takashi HACHIYA

7. Radiation Lab meeting, Takashi HACHIYA
Some numbers for F-PCB
Some numbers for the extenders by REPIC
Base PCB thickness : 12.5μm, 25μm, 50μm
Cu layer : 9μm, 18μm, 35μm
Bonding sheet thickness : 40μm
Line width / space width : 150μm/150μm
Through-hole/land radius : 0.3mm/  0.5mm
These numbers are given by the company REPIC contacted
The company had made FPC with these numbers before
HDI case (for comparison)
Base Polyimide : 12.5μm, 25μm, 50μm
Cu layer : 9μm, 18μm (cover)
Bonding sheet thickness : 25μm
Line width / space width : 60μm/120μm
Through-hole/land radius : 0.1mm/ 0.3mm
FVTX extender (for comparison)
Base PCB thickness : 20μm, 50μm
Cu layer : 12.5μm, 38μm(cover)
Line width / space width : 40, 60μm/150μm
based on gerber data
2017/4/28
Radiation Lab meeting, Takashi HACHIYA