1. ECE 477 Design Review Team 12  Spring 2007

2. The Portable Composer tm
Allows a musician to explore and record their musical ambitions while traveling or at home.
Utilizing a 37-key keyboard, the user will be able to play and record music.
An SD/MMC card slot will allow the user to save their composition in MIDI format for further editing via computer software.

3. Project-Specific Success Criteria
An ability to save recordings to an SD card (in MIDI file format)
An ability to translate the keys pressed on the keyboard into requested notes
An ability to play polyphonic sounds based on the user's input
An ability to display and adjust settings via an LCD with soft-keys
An ability to load and play back a previous recording

5. Component Selection Rationale
Major Components
DSP
Flash Memory
DAC
LCD
Power
Battery Charger

6. Component Selection Rationale
DSP – Analog Devices SHARC 21262
Full 32-bit IEEE Floating Point Support
Extensive C++ Library Support
High Data Throughput
Sufficient I/O
Flash Memory – ST Micro. M25P80
Compatibility With DSP
High Capacity
Easy To Reprogram Through SPI

7. Component Selection Rationale
DAC – Texas Instruments TLV320DAC23
Designed For Portable Devices
Built-In Amplifier
Low Power
Standard Interface Protocols

8. Component Selection Rationale
LCD – Matrix Orbital MOP-AL404
Wide Format
Four Rows
High Contrast
Backlight

9. Component Selection Rationale
Power Supply – MAX1774 Switch-Mode Regulator
Designed For Portable Devices
Automatic Switch To Battery Power
Dual Voltage Outputs
Over-Current And Over-Volt Detection
Battery Charger – DS2715
Charge Up To 10 NiMH Cells
Failure Detection

10. Packaging Design Commercially Manufactured Half-Size Keys
Spacious Interior
Met Overall Size Requirements for Portability

11. Power Subsystem

12. Dual Output DC-DC Converter

13. Second DC-DC Converter & Battery Charger

14. DAC & Headphone Amplifier

15. LCD Interface

16. Keyboard Interface

17. DSP

18. DSP Power Connections

19. Support Components

20. PCB Layout

21. Top View

22. Bottom View

23. Inner Layers

24. DAC / Headphone Circuit

25. MMC Card Socket

26. Flash / Debug Jumpers

27. Power Connectors

28. Battery Charge Circuit

29. Main Power Converter

30. 1.2 Volt Power Circuit

31. DSP – All Layers

32. DSP – Top Layer

33. DSP – Bottom Layer

34. DSP – Bottom Layer

35. DSP – Inner Layers

36. Octave Key Pad

37. Software Design/Development Status

38. Project Completion Timeline

39. Questions / Discussion