1. SVT subchapters & editors
Vertex Detector Overview (12) – G. Rizzo
Backgrounds (4) – R. Cenci
Detector Performance Studies (6) – N. Neri
Silicon Sensors (8) – L. Bosisio
Fanout Circuits (8) – L. Vitale
Electronics Readout (28)
Readout Chips (10) – V. Re
Hybrid Design (10) – M. Citterio
Data Transmission (8)– M. Citterio
Power Supplies (1??) -???
SVT DAQ (M. Villa) will be in the ETD section
Mechanical Support & Assembly (14) – S. Bettarini/F. Bosi
Layer0 pixel upgrade options (10) – G. Rizzo/L. Ratti/ + others
Services, Utilities (2) -??
Editors produced a first draft of detailed outline (next slides); first estimate of pages ~ 92 is too high.
We should try to end up with ~60 pages. Reduce by 30% !!
G. Rizzo
SVT-TDR Meeting - Oct 21st 2011

2. Next steps: Instructions on TDR writing in:
I will include in the SVN repository the SVT outline next week.
A first draft of the document is due for the Dec. Collaboration Meeting. (13 Dec.)
I would like to discuss with you the status of the document during the SVT meeting on Dec. 2nd.
Editors should insert a first draft of their chapters in the SVN repository by Nov, 30!
G. Rizzo

3. Tech. Board Meeting – Setp/13t 2011
Next Meetings Dates
Nov 4
Update on Mechanics
Update on Peripheral Electronics
Update on Striplets performance
Nov 18
Update on FE chip simulation
Update on fanout and sensor
Dec 2
Discuss first draft of TDR
Dec 13 Collaboration Meeting Frascati
G. Rizzo
Tech. Board Meeting – Setp/13t 2011

4. 1 Vertex Detector Overview (12) – G. Rizzo
Requirements (1)
SVT and Layer0 (1)
Baseline Detector Concept (4)
Technology
Layout
Electronics
Mechanical Support
Layer0 Pixel Upgrade (4)
Technology Options
Pixel module design
Mechanical support & cooling
R&D Main Activities (2)
G. Rizzo

5. SVT-TDR Meeting - Oct 21st 2011
2 Background (4) – R. Cenci
2.1 Main background sources for SVT
Pair production
Radiative Bhabhas
Touschek
Other sources
2.2 Cluster multiplicity
2.3 Energy deposited
Include summary tables with rates, doses, equivalent fluences for various layers
G. Rizzo
SVT-TDR Meeting - Oct 21st 2011

6. 3. Detector Performance Studies (6) – N. Neri
Introduction (1/2 page)
From BaBar experience to SuperB (some considerations about the main differences (luminosity, boost, beampipe, beamspot) and the idea behind the new detector design, focusing on performances).
Impact of L0 on detector performances (2 pages)
Definition of L0 requirements for physics (material budget, inner radius vs boost, outer radius, intrinsic resolution, coverage)
Vertex and proper time resolutions (vs different configurations)
Baseline solution (performances, pro and cons)
Sensitivity studies for time-dependent analyses (2 pages)
studies of benchmark channels: phiKs, pipi, etc.
impact of high bkg (QED pairs bkg)
Tracking performances (1 page)
Track parameter resolutions
Pattern recognition (Efficiency vs number of layers, reconstruction capabilities for low momentum tracks , to be understood what to present)
Particle identification (1/2 page)
dE/dx resolution (relevance for QED pairs suppression, to be studied)
G. Rizzo

7. 4. Silicon Sensors (8) – L. Bosisio
4.1 Requirements
4.1.1 Efficiency
4.1.2 Resolution
4.1.3 Radiation hardness
4.2 Sensor design
4.2.1 Technology choice
4.2.2 Optimization of strip layout
4.2.3 Wafer sizes and quantities
4.3 Prototyping and tests
G. Rizzo

8. 5. Fanouts (8) –L. Vitale + MI
5.1. Fanouts for layer0
5.1.1 Requirements
5.1.2 Technology
5.1.3 Design
5.1.4 Prototyping and tests
5.2 Fanouts for outer layers
5.2.1 Requirements
5.2.2 Technology
5.2.3 Design
5.2.4 Prototyping and tests
G. Rizzo

9. 6.1 Readout Chips for Strips (10) – V. Re
Introduction and functional overview (page 1)
Requirements of readout chips (pages 2-3)
2.1. Layers 0-3
2.2. Layers 4-5
Implementation and block diagrams of readout chips (pages 4-7)
3.1. Analog Section
3.2. Digital Section
R&D for readout chips (pages 8-10)
4.1. Analog Section
4.2. Digital Section
4.3. Auxiliary blocks, chip integration and schedule
G. Rizzo

10. 6.2 Hybrid Design (10) – M. Citterio
6.2.1 Requirements
6.2.2 Technology selection
6.2.3 Hybrid specifications
Layer 0
Outer layers
6.2.4 Design and layout
6.2.5 Prototyping and tests
G. Rizzo

11. 6.3 Data Trasmission (8) – M. Citterio
Requirements
Layer 0
Outer layers
6.3.2 Data encoding and error correction
6.3.3 Technology selection
Specifications for Layer 0
Specification for outer layers
6.3.4 Design
6.3.5 Prototyping and tests
G. Rizzo

12. 7. SVT Mechanical support and Assembly (14) S. Bettarini – F. Bosi
7.1 I.R. Constraint (1)
Description of the IR components: Be-pipe, L0, SVT, W shielding, QD0
Active region definition and clearances
Mechanical architecture (how each components is constrained to what)
Staging area assembly
Quick demounting motivations and removable support cage concept
7.2 Module Assembly (2)
L0 module baseline components and assembly procedure
L 1-->5 module components and assembly procedure
7.3 Detector assembly and installation (6)
7.3.1 Half detector assembly (1)
L0 module assembly on the cold flanges
Cold flanges descriptions, required features and jig
L 1-->5 module assembly on the Support cones
Support cones, buttons, cooling ring description, required features and jig
Space frame features
G. Rizzo

13. 7. SVT Mechanical support and Assembly (II)
7.3.2 Mount L0 to Be-pipe and L 1-5 to W shielding and displacement to IR (2)
HDMF assembly description for L0 on the be-pipe
HDMF assembly for L 1-->5 on the W shielding
Gimbal ring and support cage description
Optical modules survey
Electrical testing and connection to the transition Card
7.3.3 Installation of complete assembly into detector (1)
Constrains and scenario of mounting, stiffness and clearance required
7.3.4 Quick demounting (2)
Infrastructure required and SVT demounting/mounting procedure
7.4 Detector placement and survey (1)
7.4.1 Placement accuracy
7.4.2 Survey with tracks
7.5 Detector monitoring (in MDI section?) (2)
5.1 Position monitoring system
5.2 Radiation monitoring
7.6 R&D Program (1)
6.1 Cable 6.1 hybrid .6.1 Inner layer sextant Arch modules Cones and space frame Full scale model of IR
G. Rizzo

14. 8 Layer0 pixel upgrade (10) – G. Rizzo – L. Ratti
Requirements
Technology options
Hybrid pixels
Monolithic sensors in INMAPS technology
3D monolithic sensors
Analog front-end
Digital readout architecture
Prototype characterization
Radiation hardness
R&D activity
G. Rizzo

15. 9 Services, utilities and E.S.& H issues (2)
9.1 Service and Utilities
2.1.2 Data and control lines
2.2.2 Power
2.3 Cooling water
2.4 Dry air or nitrogen
9.2 ES&H Issue
G. Rizzo