1. Summary of the D_R&D projects in 2006
Junji Haba
KEK

2. Projects
D_R&D_1:
A common R&D on the new generation detector for the ILC
D_R&D_2:
R&D and Application of TPC technology
D_R&D_3:
R&D for new photon detector
D_R&D_4:
R&D on the new generation of large area Si tracking system
D_R&D_6:
R&D on liquid xenon detector technology

3. Collaboration matrix ILC LHC T2K B others TPC O Photon PET Si LIq. Xe
Mton
others
TPC O
Double beta PET
Photon
PET Si
LIq. Xe
ASIC/electronics
HPK
Double Chooz PET

4. TPC

5. ILC – International Linear Collider
3 designs out of 4 chose a TPC as a main tracker
The R&D is carried out worldwide by the LC-TPC collaboration
P. Colas

6. Micromegas and GEM S1 P. Colas
Micromegas : a micromesh supported by mm - high insulating pillars.
Multiplication takes place between the anode and the mesh.
One stage
GEM: Two copper perforated foils separated by an insulator (50 mm)
Multiplication takes place in the holes.
Usually used in 2 or 3 stages, even 4 S1 S2
200 mm
P. Colas

7. France-Japan meeting(s) in Paris in September 2006, followed by a 3-day endplate meeting with a large Japanese attendance (K. Fujii, Y. Kato, H. Kuroiwa, T. Matsuda, A. Sugiyama)
For the first time, a french attendance at the japanese MPGD meeting in Saga, in January 2007
(D. Attié, P. Colas)
Participation of K. Fujii in a TPC analysis “Jamboree” in Aix-la-Chapelle, March 2007
P. Colas

8. The CF4 “saga” We tried to take data with Ar CF4
The detector was very unstable, very different from what we had in Saclay, with afterpulses.
We suspected Japanese CF4 to be different from European CF4
After a complicated exchange of bottles and careful gas analyses, the two gases were shown to be the same
The difference was traced to the presence of impurities in the gas system in Saclay, quenching UVs
An admixture of 2% isobutane was found to be enough to stop the UVs and stabilise the operation.
This gas Ar CF4 isobutane (fast, low diffusion) is likely to be used by T2K and is favored for the ILC. It is being tested in KEK.
P. Colas

9. Extrapolation to ILC-TPC
Conclusion: even with 1mm pitch, Micromegas with standard pads would not quite fulfill the requirement of better than 130 micron point resolution.
However with a resisitive foil and 2.3 mm pads, this goal is largerly attained (red curve).
P. Colas

10. The T2K 280m TPC First large TPC with micropattern readout P0D TPC TPC
Active target
Magnet + Side-MRD
EM calorimeter
Instrument 6 read-out planes (0.7x2.5 m**2)
Total drift distance 1 m
B=0.2 T E=200V/cm
Pad size: 0.7x0.9 cm
P0D
TPC
TPC
TPC
Pb-P0D
FGD+H2O
FGD
EM calorimeter
Muon ID hodoscope
EM calorimeter
Magnet + Side-MRD
Requirements :
σ(p)/p < 10 1 GeV/c
dE/dx capability(10%) separate e from μ
Momentum scale: 2 %
FJPPL KEK May
Marco Zito

11. Bulk Micromegas
FJPPL KEK May
Marco Zito

12. Micromegas Modules First large Micromegas module produced at CERN 36cm
FJPPL KEK May
Marco Zito

13. Photon sensor
FJPPL KEK May
Marco Zito

14. Mton Water Cherenkov Detectors under Consideration
Hyper-Kamiokande
Mton Water Cherenkov Detectors under Consideration
TRE
MEMPHYS

15. Large area photodetection requirements
Single photoelectron sensitivity
Excellent time resolution ~100 ps
High granularity
Scalability
Low cost
Profit from progress in micro-electronics and DAQ !
Many issues in common with HPD or large PMs developments by KEK

16. R&D -two direction- France Japan Photon detector R&D
Readout system R&D
Photocathode
Scint
PMT
Hybrid Photon
Detector
HybridPMT
PMT
Low noise Preamp ASIC on HPD
+ Q-T/waveform recoder ASIC
Multichannel FE ASIC, close to the PMTs
M. Tanaka

17. Calorimeter in the GLD concept (GLD-ECAL is also known as SCECAL in CALICE)
Sampling calorimeter with Pb/W - scintillator sandwich structure with WLSF readout
Particle Flow Algorithm (PFA) needs particle separation in the calorimeter
Fine granularity with strip/tile scintillator
Huge number of readout channels
~10M (ECAL) + 4M (HCAL) !
10K for muon detector
Used inside 3 Tesla solenoid
use MPPC as photon sensor (multi-pixel avalanche photodiode developed by HPK)
Problem: How to read out such huge number of MPPCs ?
K. Kawagoe

18. R&D on UV detector G(Gaseous)PM : 1 inch PMT :
Collaboration founded by
French Ministry for Foreign Affairs
Developed by
T.Doke et al.
for liquid xenon
TOF-PET
27mm
Gas-Avalanche
Charge induction
R AL12S-ASSY
In test inside the prototype from June 2007
HPD :
Under discussion with PHOTONIS-DEP
Amos Breskin et al., NIM A530(2004)258
→ Choice before end of 2008
D. Thers

19. Completed Low-BG Oil-Proof PMT design
F. Suekane

20. Actual “collboration” just started.
Silicon tracker
Actual “collboration” just started.

21. Role of Silicon tracking or Silicon tracking what for?
GLD
LDC
3 detector concepts & main difference:
The tracking strategy=TPC Yes or No
SiD

22. But material budget is not the ONLY reason
A. Savoy-Navaro
But material budget is not the ONLY reason

23. SilC work program for sensor R&D
Step 1 (2007)
Wafer thinning (100, 200, 300µm)
Use long strips (50 µm pitch)
Test new readout chips (DC coupling, power cycling)
Improve standardized test structures and test setups
Step 2a (2008-)
Move from pitch adapter to in-sensor-routing
Test crosstalk, capacitive load of those sensors
Step 2b (2008-)
Test 6” double sided sensors
Step 2c (2008-)
8” (12”) single sided DC wafer
A. Savoy-Navaro

24. A. Savoy-Navaro

25. Minimize material budget
Multiple scattering is crucial point for high-precision LC experiment
Minimize multiple scattering by reduction of material budget
avoid old-fashioned way (pitch adapter, FE hybrid, readout chip)
Integrate pitch adapter into sensor
Connectivity of strips to readout chip made by an additional oxide layer plus metal layer for signal routing
Readout chip bump-bonded to sensor like for pixels
OCCUPANCY

26. Synergies with (S)LHC
From F. Hartmann’s Talk in “CMS Sensor upgrade Workshop” (Feb, CERN) revised & completed (ASN)
piece
development
reason & realization ILC
reason & realization SLHC
synergy
problems
sensors
8"
large area
YES 3D
has specific applications
radiation hardness NO
no industry standard
MCz
not neeed
Thinning
multiple scattering
Vdep;power, multiple scattering, no need for thick cause CCE degradation
Signal
n-in-p, n-in-n
not needed
Depletion after SCI starts from top
double sided
save MB
not applicable, radiation damage
Not a real issue for ILC
(small areas only) 
Strixel sensor
Perhaps interesting for innermost layers (occupancy)
Occupancy
NO ??
To be discussed DC
chip must cope with switch off and GND on strip
current too high
To be studied even for ILC
edgeless sensors with 3D for edges
no need for overlap => large area
high voltage stability
electronics/
chip
small feature size 90/130/180nm
low power consumption
radiation
no issue; standard libs
special libs needed
timing
1-3µs (slow)
~10 ns FAST
electronics on chip (CMOS,bump bonding)
multiple scattering; power
Under development
Ladders with strips≥10cm
OK apart from innermost regions
not usable
Noise ~ C critical for SLHC
Mechanics
Large structure, module, new material solutions
Requested for decreasing
X/X0
New material and simplified construction
YES
YES
YES
Cooling and insulation
Insulation from outside
Strong cooling constraints 
 some feedbacks for both
Alignment 
High spatial precision 
High spatial precision  
Equally important for 2 
YES/NO
YES
 Simulation
Important in many ways 
YES
 Test bench
& beam test
Important in many ways 
YES

27. Liq. Xe detector

28. … 3 imaging L Reconstructed cone: axis , opening angle   E0 
With a Compton telescope
and a 3 emitter …
3 emitter L
Reconstructed cone:
axis , opening angle    E0 1 2
- positron range
LOR2D
- Compton Telescope
DL related to
Which emitter ?
Which Compton telescope ?
Compton Telescope
For which performances ?

29. Prototype for the proof of concept and for the R&D
Cryocooler
Internal cryostat
Cathode
PMT
Teflon
Liquid xenon
External cryostat
Micromeshes and Anode
Entrance window
Cryogenic and xenon distribution will be presented by Tom

30. Liquid Xenon Compton Telescope Principle R&D for the TPC read-out …
1 individual cell
detection of scintillation light
=> trigger time t0
Cathode
PMT
collection of e/i
=> t1, E, x, y
LXe UV
12 cm 2 1
TPC :
z = (t0-t1) x vdrift Z e- Y X
3 x 3 cm2
Micromegas
(micromesh + anode)
44Sc g-ray
R&D for the TPC read-out …

31. R&D on ionization detector
MICROMEGAS
Y. Giomataris et al. NIMA376 (1996)
Expected Induced current on anode without amplification
cathode
Conversion t0 E2
(AU) t0
g 511 keV
12 cm E1
Micromesh t1 t2
Ampli
Spacer E1 E2
50 mm
anode t0 t1 t2
 Induced current shape mostly independent of altitude
→ First tests in liquid xenon from June with unsegmented anode to check the liquid xenon purity
Associated electronic and anode segmentation :
Adaptation of the IDEFIX chip, a low noise charge preamplifier for CdTe device
 200 e- noise on (¼ inch)2 pixel ?
→ Compton tracking in 2008

32. ASIC and electronics Design rule finer and finer
Development cost higher and higher
Necessary expertise more and more
Collaborative action more and more effective and important

33. Readout electronics of MPPC
French group in CALICE is very powerful in this field (C. de la Taille et al.)
Readout of SiW ECAL
Readout of AHCAL (SiPM)
Readout of DHCAL (GEM, RPC)
Electronics developed for the SiPM readout of CALICE AHCAL can easily be used for the MPPC readout.
cf. Electronics for the MPPC readout under development also in Japan (KEK: M.Tanaka et al.), but not yet ready.
SiPM readout of AHCAL scintillator tile

34. Front-end ASIC “AFTER”
SCA:
76x511 Cells
Technology: AMS CMOS 0.35mm
Area: 7546mm x 7139 mm
Submission: 24 April 2006
Delivery: end of July
Package:
LQFP 160 pins; Plastic
dimensions: 30mm x 30mm
thickness: 1.4mm pitch: 0.65mm
Number of transistors: 400,000
M. Zito

35. MAROC : 64 ch MAPMT chip for ATLAS lumi
Similar to OPERA ROC
Low input impedance ( Ω)
6 bits gain adjustment (G=0-4) per channel
64 discriminator outputs
100% sensitivity to 1/3 photoelectron (50fC). Counting rate up to 2 MHz
Common threshold loaded by internal 10bit DAC (step 3mV)
1 multiplexed charge output with variable shaping ns and Track & Hold.
Dynamic range : 11 bits (2fC - 5 pC)
Crosstalk < 1%
Hold signal
Photomultiplier
64 channels
Photons
Variabl
Gain
Preamp.
Variable
Slow Shaper ns
S&H
Bipolar
Fast Shaper
Unipolar
Gain correction
64*6bits
3 discri thresholds (3*12 bits)
Multiplexed
Analog charge output
LUCID
3 DACs
12 bits
80 MHz encoder
64 Wilkinson 12 bit ADC
64 trigger outputs (to FPGA)
Digital charge output
64 inputs
Christophe de LA TAILLE

36. Christophe de LA TAILLE
64 channels
Preamps
Fast shaper 15ns
Discriminators
Slow shaper
Track&Hold
12bit ADC
10bit DAC
Bangap reference
Digital formatting
Silicon Germanium
0.35µm BiCMOS
16mm2 area
Christophe de LA TAILLE

37. CONCLUSION MAROC2 fullfills most of the requirements of 2 km WC
Chip mature, used in ATLAS luminometry
To be done:
Time dizitization (100 psTDC)
Data out “on power wire”
Test on a prototype (16 PMs, 8’’) with MAROC2 foreseen shortly at IPNO
Joint activities with KEK :
Tests at KEK by Tanaka-san
Common ASIC development : TDC, ADC, DAQ,
Specific preamp for HPD
Characterization of common parts
Christophe de LA TAILLE

38. SILICON
LPNHE-PARIS
180nm 130nm
Picture
A. Savoy-Navaro

39. FRONT-END IN 130nm UMC CMOS 130nm TARGETED
LPNHE-PARIS
Waveforms
UMC CMOS 130nm
Counter
Wilkinson
ADC
Can be used for
a “trigger”
Ch #
Analog samplers, (slow)
S aiVi > th
Sparsifier
Channel n+1
Channel n-1
Time tag
Preamp +
Shapers
reset
Clock 3-96 MHz
TARGETED
Amplifier/Shaper : 20 mV/MIP
Sparsifier: threshold on analog sum
Sampler : 16-deep
ADC : 10-bit
Noise measured with 180nm CMOS : ms shaping, 120mA (preamp + shaper)
A. Savoy-Navaro

40. Collaboration matrix ILC LHC T2K B others TPC O Photon PET Si LIq. Xe
Mton
others
TPC O
Double beta PET
Photon
PET Si
LIq. Xe
ASIC/electronics
HPK
Double Chooz PET

41. Yes, we know they are excellent, but….
Silicon tracker (thinned, double metal..)
Silicon pad
APD
MPPC (SiPM)
PMT, MAPMT
MCP-PMT
HPD
We should be a clever and demanding customer in any sense under the collaboartaion.

42. To summarize
Good start of collaborations in many fields of detector R&D of FJPPL.
Several outcomes have already been achieved.
Horizontal collaboration among the projects might be more important in any field.