1. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
Cross-sectional diagram of a superconductor-normal metal-superconductor Josephson junction. The electrodes are typically made of Nb, which become superconducting at temperatures below approximately 9K. The barrier is a normal metal.

2. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
Predicted and experimentally determined critical power of Nb-MoSi-Nb Josephson junctions. The data are from Chong . Two types of junctions with different bottom electrode-substrate interfaces are studied. The silicon substrates were maintained at 4K.

3. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
Predicted electron and phonon temperature profiles in the metal layer for three cases with different values of Lm∕δ

4. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
Predicted out-of-plane thermal resistance of Au films sandwiched between two dielectric materials at room temperature. The dashed line is obtained using the present two-fluid heat conduction model and the sold line using the conventional heat conduction model.

5. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
The thermal resistance of SiOx films near room temperature reported in the literature as a function of thickness. The y intercept is commonly interpreted as the thermal interface resistance.

6. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
Geometry and thermal boundary conditions used to analyze heat conduction across a metal layer sandwiched between two amorphous dielectric layers as part of a nanolaminate

7. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
The thermal resistance per unit thickness of W-AlOx nanolaminates at room temperature. The symbols are experimental data , the dotted line is the prediction of the conventional continuum heat conduction model, and the solid line is the prediction of the present two-fluid model. The nanolaminates were synthesized using the atomic layer deposition (ALD) technique at two different temperatures or using the magnetron sputtering technique (Magnetron) as described in .

8. From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
J. Heat Transfer. 2006;128(9): doi: /
Figure Legend:
The effective thermal conductivity of Ta∕TaOx nanolaminates plotted as a function of interface density at room temperature. The symbols are experimental data and the dotted line is the prediction of the present two-fluid model.