1. Status Report on Bonding at Catania
Salvatore Costa
University and INFN – Catania

2. Machine Fix, Upgrade,Tune-up
…Wire breaking problem…
Help from colleague with extensive past experience with Hughes, Enrico Scarlini of Florence (thanks!)
Adjusted bonding parameters [e.g. a much lower ”Z speed”: 10 vs. 100, default is 231, do not exceed 20]
Replaced tool
Mounted wire despooler
Disabled upper wire clamp
Lubricated head travel shafts (it would not reach full rest position or it would jam onto piece)
Cleared axis initialization failures

3. Bonding Test # 2 (1)
Pre-Bonding visual inspection under microscope showed same damaged pads (scratches across rows of pads) in PAs. [Piece was no longer sticking to ESD box when I opened the box].
Used Hughes loop mode “5”, a simple 1-parameter (loop height) arch.
Set loop height=150 (mm or .1 mil ?)
…measure ?…
for all bonds (SEN-SEN and PA-SEN)

4. Test bonds on Test Areas…
Bonding Test # 2 (2)
Test bonds on Test Areas…
(Destructive) Pull Tests with automatic Puller:
8-12 g break force
mid-span break

5. Bonding Test # 2 (3) HPK - ST SEN bonds
Used following bond parameters (for both ends):
Force: 20
Time: 40
U/S: 55
No problems during bond program execution
Post-Bonding visual inspection: All bonds OK

6. Bonding Test # 2 (4) PA - HPK SEN bonds
Used same bond parameters as for HPK - ST SEN bonds
Some problems during bond program execution:
Wire would not hold onto scratched spots of pads manually bonded choosing a different spot on pad
3 funny loops pulled out and redone
1 wire almost touching neighbor gently pushed aside with pliers
At last bond, PA seemed short of 1 pad: First one missing!

7. Bonding Test # 2 (5) PA - ST SEN bonds
Using same bond parameters as for HPK - ST SEN or PA - HPK SEN bonds, wire would not stick to PA pads
Increased some parameters:
Time: from 40 to 50
U/S: from 55 to 65
At visual inspection first few SEN pads will show traces of pulled wires from SEN pad
Except for this, all bonds should be OK.

8. Bonding Jig Being distribued by Filippo Bosi, Pisa
Got “Type 1” jig for (single sided) TIB modules
Should get “Type 2” jig for (double sided) TIB modules sometime
He said he is currently designing jigs for stereo TIB and for TID modules

9. Bonding Tool
From Saneco, n. 4284
Concave…

10. Test System We have identified a person in charge of this
ARC has been installed and is going to be tested

11. Bonding Lab Upgrade
Purchased (for a nominal price) a second (used) Hughes, being dismissed by CERN
Will transport to Catania tomorrow
Might be operational in September (after we move to new building)

12. Next Step Bonding a dummy module
Bari has promised they will assemble a dummy module for us to bond ad soon as HPK sensors arrive

13. …break…

14. DataBase Interface Update
Salvatore Costa
University and INFN – Catania

15. Interface Releases (1) Version 0.1 was released on 13 March 2002
Non-working evaluation version:
See interface look
Stimulate communication of center-specific input data from Center DB responsibles to me.
Version 0.2 to be released soon
Working evaluation version:
Exercise all functions
Will include User’s Manual
Includes people’s comments to v. 0.1
Center specific defaults and lists (where available)
All data stored in Catania…will eventually be deleted!

16. Interface Releases (2) Version 1.0 will follow shortly
Production version:
Available for download from Web site in Catania
Will include installation instructions
Installation will create Center-specific version (same look, different default and list values)
Initially for Unix only, will make version for Windows if requested
Data will be stored locally to Center and will be broadcast to TrackerDB when “VALIDATED”

17. Center “DB Readiness” Center DB Responsible Input Data Aachen
Wolfgang Braunschweig
MISSING
Bari
Valeria Radicci OK
Catania
Salvatore Costa
CERN
Alan Honma
FNAL
Bill Kahl
Florence
Simone Paoletti
Karlsruhe
Hans-Jürgen Simonis
Padova
Maurizio Loreti
TOO EARLY
Pisa
Andrey Starodoumov
Santa Barbara
Strasbourg
Pierre Juillot
Torino
Ernesto Migliore
Vienna
Thomas Bergauer
Zurigo
Klaus Freudenreich

18. Data Recording In TrackerDB
Do we all agree that, as it is currently foreseen in the Interface v. 0.1, PRE-BONDING, BONDING, POST-BONDING and BONDING REPAIR data are independently recorded in the central TrackerDB as soon as they are individually VALIDATED?
Of course the Interface will have itself checks so that you cannot VALIDATE, say, POST-BONDING data until BONDING data have been.