1. The EMC cooling
F. Raffaelli
INFN - Pisa
06/09/2017

2. Design and construction of cooling system. Test SIPM station.
Summary
8/31/2018
Back plane SiPM:
Electronics Crate .
Design and construction of cooling
system.
Test SIPM station.
F. Raffaelli

3. Back Plane SIPM Recent activities:
8/31/2018
Back Plane SIPM
Recent activities:
Update on cooling simulation. The SIPM Holder has been reviewed recently.
Cooling tests preparation.
Back plane construction.
Ci sono due sottosistemi, entrambi hanno bisogno di un sistema di raffreddamento dedicato. Questi sono il front end che non è stato oggetto del mio studio eppoi ci sono le schede di DAQ che sono raccolte in questi 11 crate, che è il sistema di cui mi sono occupato. SPIEGARE IL LAYOUT
F. Raffaelli

4. Cooling design reminds.
8/31/2018
Cooling design reminds.
The cooling design is based on direct contact between a cold ledge and the SIPM holder
The adopted solution is a copper cooling tube brazed under vacuum to a copper ledge.
Limited thermal contact with the plate.
Gaps help air evacuation.
F. Raffaelli

5. Thermal analysis: SIPM and front-end
8/31/2018
Thermal analysis: SIPM and front-end
Thermal specification:
The max allowable SIPM temperature is 0 0C.
The max allowable temperature of the eletronic component in normal operating conditions is 125°C.
60°C is considered, at present time, as a safe temperature for the electronic components .
In the future a comprehensive tests simulating the real operating condition must be done to refine this value.
Descrizione degli obiettivi
2/16/2016
F. Raffaelli

6. Power dissipation on the front end electronics
8/31/2018
Power dissipation on the front end electronics
Total power (2 SIPM+2ampl.):
~2,1 𝑊 inner radii
~1,2 W outer radii
Component
Power [watt]
SiPM
0,69 inner radii; 0,23 outer radii
Front-end board
0,355
Front-end board
Bridge resistor
Descrizione degli obiettivi
SiPM
F. Raffaelli

7. Sulution Comparisons.

8. 8/31/2018
Actual design the SIPM holder is a thicker cup milled with short thick ears.
Boards Amp side
Board HV side
The temperature of these components are raised of 20 C still in the limits
F. Raffaelli

9. Cooling tests.
8/31/2018
Goals:
Verify the calculated fluid heat transfer coefficient.
Study the thermal contact interface.
The effect of radiation heat transfer between the SIPM and crystals.
F. Raffaelli

10. Cooling tests preparation.
8/31/2018
Above the heater we glued a 300 micron silicon
Flat heater
The two slugs of cooling pipes with
their holders that has been used to perform the test.
Resistors simulating the two FEE boards
The plastic support, that has been machined at the INFN Pisa.
F. Raffaelli

11. Cooling tests preparation.
8/31/2018
Crystal and boards
Peek support
Crystal
Average ΔT=0,9÷1K (probes)
Crystal average T=16,8÷17,1°C (probe)
Boards
No significant differences from the previous analysis.
FR-4 support
Crystal position
The emissivity values and the thermal conductivity of the crystal are not well known, an experimental validation is fundamental
F. Raffaelli

12. Cooling tests preparation.
8/31/2018
SIPM test station
Vacuum chamber
1)Tests have been delayed because we have to order some joints. We could have performed these in July.
2) A new fluid pump is necessary to increase the inlet pressure.
3)We need a better temperature sensor and more heaters to test different configurations.
Orders will be placed before end of 2017.
Chiller
Vacuum pump
F. Raffaelli

13. Back plane construction.
Module 0 experience
Plate Size is not standard.
We need to join two plates together before final machining. Different options studied for the joint. R&D on the Glued joint are foreseen.
The envisaged production steps are:
1) Machining the ends for the glue joint and references.
2) The two parts are glued in house.
3) The plate surfaces are milled to the final thickness.
4) Final machining takes place.
Tender procedure in progress (before end 2017)
Descrizione degli obiettivi
Design and preliminary tests of the cooling system of the Mu2e electromagnetic calorimeter at Fermilab

14. Design and construction of cooling system.
8/31/2018
The design and construction of the cooling system can be done in the 2018.
The back plate need to be ready before to be able to mount the cooling lines.
2/16/2016
F. Raffaelli

15. Crates cooling A crate integrate cooling channels has been manufactured and tested. We need to make a new prototype and some parts before the end of the 2017 solving problems found in the first prototype.
2/16/2016

16. Crate body Manufacturing.
8/31/2018
Welding around the elbow not easy to guarantee the gas flow protection.
Helium test sensibility 10-9
Cc atm/sec
2/16/2016
F. Raffaelli

17. Flow test Pressure losses 5.1 bar at the nominal flow.
8/31/2018
Pressure losses 5.1 bar at the nominal flow.
Some improvement are already envisaged to improve the manufacturing process and reduce the pressure losses.
We have a price estimation for the all crate production.
2/16/2016
F. Raffaelli

18. Crate Manifold support proposal
Return
Supply
G10

19. Linking proposal G10 L profile for better thermal
Insulation K= w/m2 K
2/16/2016

20. Next steps in crate construction
A new crate Design has been proven by the prototype construction.
The cooling performance are assured by the integrate cooling channels in the lateral plates.
Thermal test are still necessary to chose the right thermal interface between the top components and the aluminum cold plate.
A further revision is envisage to improve the manufacturing process in same details and the pressure losses.
A final checks need to be done with Frascati and Pisa electronics people.
2/16/2016

21. SIPM test station Minor mechanical parts to be completed: Led holder.
Quartz plates.
Cooling lines installation.