1. Status of the CDF II silicon tracking system
Suen Hou
Academia Sinica, Taiwan
CPS 2002
THU Taichung, Feb. 4-6, ‘02

2. Tevatron Upgrades N Luminosity Original design: Upgrades: Bunches
1030 cm-2 s-1
Upgrades:
Linac (1993):
2x 1031 cm-2 s-1
Main injector
Initial goal: 1032 cm-2 s-1
Recycler (factor of ~2)
2x 1011 antiprotons/hour
3x 1012 antiprotons
Re-cool antiprotons from the Tevatron
Later
Electron cooling
Crossing angle
Bunches
Initially 36x36 at 396 ns
Ultimately 141x121 at 132ns
1033
N
100 10 1
0.1
1030
1032
1031
Luminosity
< ns between
crossings

3. CDF II upgrade WHAT’S NEW Tracking Endplug Calorimeter Muon systems
Silicon Tracker
Central Outer Tracker
Time of Flight
Endplug Calorimeter
Muon systems
Front End Electronics
Trigger/DAQ (pipelined)
PHYSICS GOALS
Higgs & SUSY
Top, W
Bottom
Lot’s more…

4. CDF Trigger Scheme

6. CDF II Silicon SVXII (SVX) ISL Layer 00 (L00)
Originally the only Silicon in the upgrade w/ Main Goals:
Extended coverage with smaller gaps in z and f
3D vertexing
Triggering at Level 2 on 2D displaced tracks
ISL
Extend b-tagging to || = 2
Help link tracks found in the Drift chamber to SVX
Layer 00 (L00)
Improve impact parameter resolution to increase B tag efficiency
In the Level 2 trigger
Outlive inner layers of SVX

7. SVX3 Chip Analog Front End (FE) and Digital Back End (BE)
FE has relatively low noise integrator and 42 cell analog pipeline with 4 buffer cells
BE has comparator, ADC, and sparse readout
Deadtimeless:
Capable of analog operations during digitization and readout
Dynamic pedestal subtraction (DPS)
Enables common mode noise suppression

8. Layer 00: Beampipe Layer
2.2 cm

9. Impact Parameter Resolution

10. Components Silicon (CMS) 25 mm pitch 50 mm readout
Breakdown > 500 V
Long Signal Cables (CERN)
Electronics separated from Silicon by Kapton cables (up to ~ 40 cm long)
Hybrids
Screened and etched Alumina
Silicon Cooled to 0 oC
Could extend lifetime of CDF

11. L00 assembly One f group of strips installed at a time.
In every case the strips were aligned to the nominal cylinder axis to better than 50 mm over the 90 cm length.
Strips are parallel to better than ~ 55 mrad

12. Inside SVX Installation clearance: 300 - 450 mm over ~ 2 m
Final alignment*: L00 parallel to SVX to ~ 25 mrad

13. CDF SVX II 3 Barrels: Very Compact design:
Electronics mounted directly on silicon to avoid longitudinal gaps.
Overlaps in f
Radial span ~8 cm for 5 layers !

14. SVXII Assembly Layer 1 Quarter Ladder Silicon Sensors Jumper
Hybrids (phi and z sides)
chips

15. SVXII Barrels

16. The Intermediate Silicon Layers (ISL)
1 meter
The ISL doubles the pseudorapidity range for b tagging and lepton id.

17. ISL Construction
1.9 m

18. ISL End View

19. Silicon Detector Installation
silicon cable bundles (to racks)
COT face
A happy ISL project leader  on January 16th, 2001.

20. CDF II
All Detector Subsystems are now complete

21. CDF II Silicon Summary

22. Detector description silicon detector is 15 times larger than in Run1!
Layer
Inner/Outer Radii [cm]
Axial
Pitch [mm]
Stereo
Angle 00
1.35/1.62 25 -
2.5/3.0 60 90
141 1
4.1/4.6 62
125.5 2
6.5/7.0
1.2 3
8.2/8.7 4
10.1/10.6 65
5 Forward
19.7/20.2
112
5 Central
22.6/23.1
6 Forward
28.6/29.0
376 modules, RO channels
silicon detector is 15 times larger than in Run1!

23. SVX Readout

24. SVX3 DAQ (2)

25. SVX DAQ

26. Portcard with DDRs and DOIMs

27. Compact Port Card
Transceiver : convert low-voltage differential signals from DAQ
Digital Data Receiver : Decode 5-bit commands into 10 SVX3D control and calibration
Analog DDR: regulates AVDD for clean frontend operation
DOIM : 8data bit + 1 data valid signal to Laser Diode Array to 9-bit parallel optical link

28. DOIM TX and RX

29. Radiation Dose Measured Run IIA
May – Oct running
Collision dominated, but losses still present
Measurements found rdial and z dependence of dose
Radial dependence fit to 1/R scaling =
Run IIA lifetime estimates assumed 1.5 ± 30%

30. DOIM Dense Optical-electrical Interface Module Transmitter
Edge-emitting ridge-waveguide
InGaAsP/InP laser =1550 nm
9 ch. array of 250 m pitch
Receiver
InGaAs/InP PIN diode
CMS Ecl drivers
Light range W
53 MHz operation, duty cycle 40-60%
62.5 m multimode fiber cable
Total application for SVX : 560
Spare : 140

31. DOIM modules TX transmitter InGaAsP/InP 1550 nm edge emitting laser
RX receiver InGaAsP/InP PIN diode

32. Silicon Tracking Status
Silicon detectors are timed in and integrate
with DAQ
After current shutdown expect:
silicon layer on beam pipe operational
> 90% of SVXII operational for tracking
~ 60% of ISL ladders operational
(cooling line blockages being investigated)
Measured hit resolution s ~ 19 mm
before final alignment corrections
Construction alignment tolerances for
level 2 impact parameter trigger have been met
Signal/noise as expected
Unbiased residual (cm)

33. Commissioning/Data

34. First Collisions

35. 2 SVX Wedges in Commissioning Run
Beam Profile
s ~ 87 mm
Ran with two test wedges made up of class B silicon installed without much effort at alignment, and without parallel beam
Worked surprisingly well!

36. First Physics applications.
J/y->mm with Silicon track

37. Top reconstruction
If you could reconstruct the hadronic top, or both tops… but difficult

38. Tevatron Expectations
SM Higgs: CDF  D
Exclude MH < 180 GeV (10 fb-1/exp)
3s : MH < 180 GeV (20 fb-1/exp)
4s : MH < 125 and 150 < MH < 170 GeV (20 fb-1/exp)
SUSY Higgs
many of the same channels as SM, enhanced association to bb at large tanb

39. Precision EWK in Run 2 Mw: CDF  D Mt: CDF or D
Precision measurements of top and W masses will severely constrain the mass of the Standard Model Higgs
Mw: CDF  D
sM ~ 35 MeV (2 fb-1/)
sM ~ 20 MeV (10 fb-1/)
Mt: CDF or D
sM  4 GeV (2 fb-1/)
sM  2 GeV (10 fb-1/)

40. SVX is well on its way to full commissioning
Repair work during Oct 2001 shutdown is successful
SVXII over 85% full functioning
DOIM problem below 2%
Integrating for Physics application