1. Status and plan for the phase 2 Tracker Construction
G.M. Bilei – INFN Perugia
On the behalf of INFN and Universities of
Bari, Catania, Firenze, Genova, Padova, Pavia, Perugia, Pisa, Milano Bicocca, Torino, Trieste
Roma Sep Meeting with referees

2. The status and plan of the Tracker upgrade for Phase 2
Brief recap on CMS TK Upgrade requirements for HL LHC
Increased radiation hardness to 3000 fb-1
Detector meant to survive without maintenance.
Robustness and redundancy.
Increased granularity to resolve 140 ® 200 mb/BX
Reduce material and improve tracking performance
Provide Level-1
Coverage extension up to η close to 4
CMS HL Upgrade Technical Proposal CERN-LHCC
Tracker Technical Design Reports in June 2017
Aim at delivering upgraded Tracker for data taking in
Roma Sep Meeting with referees
G.M. Bilei

3. Current Phase 2 Tracker layout
Objective: acceptance up to η = 4. L1 Track Trigger down to η = 2.4
Very significant change from the present Tracker, made for η = 2.5
Acceptance increase is in the Outer Tracker endcap (TEDD) and in particular in the Pixels
In the forward region the geometry of the Beam-pipe, Pixels and Outer Tracker are strongly coupled.
Roma Sep Meeting with referees

4. General concept – L1 Tracking Trigger
Silicon modules provide at the same time “Level-1 data” 40 MHZ), and “readout data” (upon positive Level-1 trigger decision)
The whole tracker sends out data at each BX
Level-1 data require local rejection of low-pT tracks
To reduce the data volume, and simplify track Level-1
Threshold of ~ 2 GeV ⇒ data reduction of one order of magnitude or more
Design modules with pT discrimination (“pT modules”) benefiting 4T B field
Correlate signals in two closely-spaced sensors
Exploit the strong magnetic field of CMS
Level-1 “stubs” are processed in the back-end
Form Level-1 tracks, pT above ~ 2 GeV
To be used to improve different trigger channels x y z
“stub”
G.M. Bilei
Roma Sep Meeting with referees

5. Tracker upgrade – Outer Tracker
220 m2 area - 50/220M strips/macro pixels
modules
µm2 pitch
2.5 to 5 cm strips & 1.5 mm macro-pixels
200 µm active or physical thickness
INFN R&D contribution
FE Read-out chip for Macro Pixel-Strips modules
Silicon Sensors
L1 Track Trigger
Silicon Module and power system started recently

6. Tracker upgrade – Pixels
4 m2 area
50x50 to 25x100 µm2
(minimum size)
200 µm thickness
INFN R&D contribution
Front-End ROC electronics
Silicon Sensors planar/3D
Serial Power system
Mechanical structure starting
planar 3D
RD53 ASIC 65 nm

7. Outer Tracker P T modules
Roma Sep Meeting with referees
G.M. Bilei

8. Outer Tracker 2S (Strip Strip) module
Roma Sep Meeting with referees
G.M. Bilei

9. Outer Tracker PS (Pixel Strips) module
Roma Sep Meeting with referees
G.M. Bilei

10. Outer Tracker R&D Progress
Si-Sensors:
Float Zone n-in-p
INFINEON 200 um thick produced first 8” with good quality. Some issues need to be resolve
to meet CMS specs.
HPK 6” sensors excellent quality.
They satisfy CMS specs
Market Survey launched (common with ATLAS)
Next years formal qualification of potential venders for tender
8” INFINEON sensors
Perugia
Simulation &
Process Control
Qualification 6” 8”
Sensor production can be shared in 8” and 6” size preserving the current
Geometries (with possible cost gain)
Roma Sep Meeting with referees
G.M. Bilei

11. Outer Tracker R&D progress
ASIC chips: all front-end ASIC proto-designs completed
CBC2 and MPA-light in hand. New submissions in 2017
Modules: prototypes assembled and tested in beam
29 µm hit resolution, stub efficiency close to 100%
Power chain: System studies and demonstrator set up
Mechanics: prototyping with improved designs started
Model includes installation and routing of services
Track-Trigger: demonstrators operational
Initial results consistent with latency ≲ 5 µs and good track finding efficiency
Review process in place to compare three options in Dec-Jan.17 PV
PG,BA FI
Full-size 2S module with CBC ASICs
PI,PG,CT,TS
MaPSA-light module
Power hybrids
New tilted barrel geometry and End cap dees

12. Outer Tracker RD funds 2017
Contributo allo sviluppo e qualifica dei Sensori Outer Tracker
2017 verranno sottomessi 2 batch RD per qualificare i potenziali vendor.
Costo totale è circa 250 K€
Perugia che ha sssunto la responsabilità del controllo di processo
25 K€ per contributo sottomissione comune sensori Outer Tracker
3 K€ probe cards
2. Front-End Chips per PS modules MPA e SSA
Prossimo anno Marzo/Aprile sottomesso insieme a RD53 (50% costo ciascuno) run fonderia 65 nm per MPA e SSA chips. Costo Totale è circa 500 K€ (50% eng. Run)
Pavia sta contribuendo al disegno e test dei due chip MPA e SSA
50 K€ per contributo sottomissione comune Front end chips
3 K€ probe cards/setup readout
Milestone: Sottomissione readout ASIC macro pixel (MPA) e Short Strip (SSA) in 65 nm per lettura
moduli PS outer Tracker 30 Lug. 2017
Roma Sep Meeting with referees
G.M. Bilei

13. Outer Tracker RD funds 2017
3. Contributo ad assemblaggio Bum Bonding Mapsa (MacroPixel)
I Chip MPA dopo  la loro consegna (stesso Run RD53) verranno montati bumb bondati ai sensori macro pixel.
Costo totale stimato 150 K€
15 K€ Perugia
4. Sviluppo e Costruzione di jigs per assemblaggio meccanico, wire bonding dei moduli Outer Tracker (Bari e Perugia)
5 ke x ciascuna sede =Tot 10 K€
5. Acquisto Setups basati su boards FC7 per test moduli ed ibridi di Front end
Bari, Perugia, Catania, Pisa.
8 Keu per setup= Tot 32 k€
Roma Sep Meeting with referees
G.M. Bilei

14. Pixel R&D progress
Sensors: several submissions ongoing to select technologies and configurations:
Planar sensors: FBK sensors qualified. HPK design being finalized.
3D sensor: batch from IMB-CNM received, good initial test results. FBK 3D completed. Quality satisfactory
CMS: Bari, Firenze, MiBicocca, Perugia, Pisa, Torino
See M. Meschini & G. Dalla Betta
HPK wafer design
FBK Planar
FBK 3D
Roma Sep Meeting with referees
G.M. Bilei

15. 15
Pixel R&D progress
ASIC chip: 65 nm Digital ASIC submitted in Mar. (validation of radiation tolerance)
Power distribution: serial powering test setup operational (FEI4). Shunt LDO regulator block submitted in Apr (RD53)
Data Transfer: e-links simulations and laboratory tests started
Bari, Torino, Perugia, Pisa, Padova, Pavia FI
Digital RADiation chip
RD53, CMS/MPA, CERN/LP-GBT
MEASUREMENTS
SIMULATIONS
Shunt LDO regulator
Data link frequency (eye) response
Roma Sep Meeting with referees
G.M. Bilei

16. Pixel ROC R&D INFN CHIPIX65 – RD53
CHIPIX65 (INFN demonstrator call GR5)
65 nm CMOS technology for future pixel chip (smaller pixel, lower thresh. & power
CHIPIX65 project approved by GR5 (CMS-ATLAS common effort).
Resp. Naz. L. Demaria (To)
CMS: Bari, Torino, Perugia, Pisa, Padova, Pavia
ATLAS: Milano, Lecce
10 FTE participants to CHIPIX65 project in GR K€ in 3 years
Developments of several IP blocks and MPW run
CHIPX demonstrator submitted in July.
FE65P2 (LBL demonstrator)
Chip received end of 2015
Under testing
Good starting exercise
CHIPIX65
64x64 pixel matrix
FE65
64x64 pixel matrix
Roma Sep Meeting with referees
G.M. Bilei

17. CERN RD Projects with INFN CMS TK participation
RD53 - Large scale Front-End ASIC prototype for Pixel Phase-II detectors
Common development with ATLAS,CLIC and several CMS Institutes
Crucial work on 65 nm radiation tolerance validation
Important submission of RD53A full size chip spring 2017
Development of the shunt LDO for serial powering
L. De Maria chair of RD53 Institution Board & F. Loddo Responsible designing team
INFN CMS TK Institutes: Bari, Pisa, Torino, Padova, Pavia, Perugia
RD50 - Radiation hard semi-conductor devices
Common development with ATLAS and other experiments
CMS sensor R&D benefits from extended knowledge accumulated in RD50
(ex. Selection of p-type sensors) - large community of CMS experts is active in RD50.
Planar and 3D Pixel sensors (some common submissions in the latter case)
TCAD simulation and parameterization of radiation damage models
INFN CMS TK Institutes: Bari, Firenze, Perugia, Pisa, Torino
Roma Sep Meeting with referees
G.M. Bilei

18. Other common developments with INFN TK participation
CMS benefits from several other common R&D developments across sub-detectors and experiments. INFN commitment & benefit is strong 800 K€ (33 year man AR)
EU INFRA Project: AIDA2020 ( )
CMS Tracker R&D activities characterization of Si-sensors and FE elec. synergies w ATLAS
Access to irradiation facilities
CMS INFN TK beneficiaries: Firenze, Pavia, Perugia, Torino K€ personnel
(silicon sensors and RO chips)
EU ITN Project : INFIERI ( ) INtelligent Fast Interconnected and Efficient
Devices for Frontier Exploitation in Research and Industry. Several partners HEP,
Astropartical, Medical, Industry
CMS TK Pisa beneficiary K€ personnel (Track Trigger)
PRIN 2012 : H-TEAM ( ) Higgs precision Physics at LHC with Trigger,
Electronics and advanced method
ATLAS (Pisa, Milano) and CMS (Pisa, Siena, Firenze, Perugia, Torino) collaboration
CMS TK K€ personnel (Track Trigger)
Regione Toscana : NEOLITE ( ) Development of new and smart power systems for
HL-LHC
CAEN and INFN-UNIV TK Firenze beneficiaries – Firenze 170 K€
Roma June Meeting with referees
G.M. Bilei

19. INFN proposed contribution to the TK Upgrade
2015 Tracker Management Board held series of meetings to asses sharing of construction responsibilities and funding for the Technical Proposal. Started reviewing now cost and sharing contributions.
A preliminary and internal sharing among INFN CMS Institutes is being discussed and shown by Roberto at GR1 July 2015
INFN proposed contribution to CMS 25 MCHF of 265 MCHF
INFN Tracker proposed contribution 15 MCHF
10 MCHF Outer Tracker
5 MCHF Pixel
Several INFN internal discussion to asses
a proposal for the Tracker responsibilities,
financial contributions, commitments,
resources available and required.
Technical Proposal Tracker estimated cost
Roma Sep Meeting with referees
G.M. Bilei

20. Past and on going INFN contribution to TK construction
Construction of TIB/TID (Bari, Catania, Firenze, Padova, Perugia, Pisa, Torino)
2 sensor QTC (Pisa, Perugia) 1 PQC (Firenze)
2 module assembly centers (Bari, Perugia)
6 module bonding & qualification centers (Bari, Catania, Firenze, Pisa, Padova, Torino)
Mechanics construction of TIB shells and TID disks (Pisa)
Module integration on TIB (Pisa, Firenze) and TID (Torino)
Power supply system (Firenze, Torino, Catania)
Opto Hybrids qualification for TIB/TID (Perugia)
Integration and commissioning at CERN (all)
Construction of Pixel half layer 3 Bpix (Bari, Catania, Padova, Perugia, Pisa)
ROC testing (Padova)
Bare module and BB qualification (Pisa)
HDI + TBM Assembly, bonding and qualification (Catania)
Module assembly and wire bonding (Bari)
Module qualification, thermal cycle, calibration, HR tests (Perugia)
Roma Sep Meeting with referees
G.M. Bilei

21. Some INFN TK upgrade considerations
Will build our construction contribution based on past (Strip) and current (Pixel Phase 1) experience, based on the on going R&D effort and keeping into account competences and instrumentation available in the centers (part of them to be necessarily updated).
Will share effort between Pixel and Outer Tracker and identify synergies and strategic balance among the two activities.
Roma Sep Meeting with referees
G.M. Bilei

22. FTE breakdown INFN TK activities in 2017
INFN Tracker strong, motivated, well organized
community
As today about 100 FTE associated to INFN
Tracker (about 20% of CMS TK collaboration)
Carefully balancing TK concurrent activities
making sure we are not unbalanced
50 FTE in Operations, DPG, POG, Physics..
17 FTE in Pixel Phase 1
33 FTE in total for R&D for HL-Tracker
including
EU Projects: AIDA2020, INFIERI
PRIN MIUR Projects: H-Team
GR5 R&D Projects: CHIPIX65
POR Toscana: Monolite
We will require as in the past to hire Technical
support for the construction of the Tracker.
Compiled on July 2016 for 2017 activities
Roma Sep Meeting with referees
G.M. Bilei

23. Tilted TBPS Outer Tracker & Inner Pixel Layers
INFN proposed contribution to the development & construction of
systems :
Tilted Tracker Barrel PS (TBPS)
Two Inner layers Pixel detector
Tilted TBPS
L1 & L2 Pixel detector
Roma Sep Meeting with referees
G.M. Bilei

24. Proposed Pixel Contribution
Deliver Layers 1-2 BPix, mounted, integrated and tested with ultra rad-hard Pix modules (≈ 0.4 m2 surface detector)
Contribution to development, qualification, ROC, Sensors, Hybrids
ROC testing
Sensors testing
Hybrids testing
Construction and integration of Modules (324 installed) in Pixel Layer 1-2
bare module testing
module assembly and bonding
module burn in and calibration
module mechanical integration and qualification
Bpix Mechanics development and construction
Contribution to development, qualification of common systems
Serial power system and Power Supply
DAQ and Control Systems
Safety system
Financial contribution ≈ 5 MCHF
About 20% Total Pixel Cost
(23 MCHF)
Roma Sep Meeting with referees
G.M. Bilei

25. Proposed Pixel WPs contribution
Draft INFN Sharing of responsibilities
Roma Sep Meeting with referees
G.M. Bilei

26. Proposed Outer Tracker Contribution
Deliver Tilted Inner Tracker (36x2 rings per side) mounted, integrated and tested with 1956 PS modules (≈ 40 m2 surface detector) and contribute to Track Trigger
Development and Qualification
Service Hybrid testing
FE Hybrids testing
Sensors Process Qualification
Construction and integration of PS Modules (1956 installed)
module assembly, wire bonding and testing
module burn in
module mechanical integration and testing in 72 rings
Contribution to development, qualification of commons systems
Track Trigger electronics system (to be confirmed after Dec Review)
Power supply system
DAQ and Control Systems
Safety System
Total ≈ 10 MCHF
About 10% Total Outer TK Cost
(89 MCHF)
Roma Sep Meeting with referees
G.M. Bilei

27. Proposed Outer Tracker WPs Contribution
Draft INFN Sharing of responsibilities
Roma Sep Meeting with referees
G.M. Bilei

28. Project Timeline 2018-2020 R&D_Fase2 Funds Construction Funds
Developments Funds?
Construction Funds
Roma Sep Meeting with referees
G.M. Bilei

29. Summary 2017 CMS Tracker R&D Phase 2
Missioni
Roma Sep Meeting with referees
G.M. Bilei

30. R&D and Construction funds considerations
The TDR is expected in June 2017
The construction (and related CORE budget) will start at EDRs in
Several developments, pre-prototyping and prototyping need to be carry out for preparing EDR.
These developments are not covered by construction funds
In foreseen INFN TK investments of ≈ K€
Roma Sep Meeting with referees
G.M. Bilei

31. Back up
G.M. Bilei
Roma Sep Meeting with referees

32. G.M. Bilei
Roma Sep Meeting with referees

33. First module prototyping with dummy parts in Perugia
G.M. Bilei
Roma Sep Meeting with referees

34. Tracker upgrade Material budget
Data reduction  stub turn-on for full efficiency at 2 GeV
Roma Sep Meeting with referees

35. Mechanics Actually developing the tilted version of TBPS TB2S TEDD
Flat version is based on the same concept as the central part of the tilted version

36. Tilted TBPS Three layers as individual units
Each layer: Central flat section + 2 tilted sections
Central section: 2 end rings and module support plates
Tilted sections: module support rings
Longitudinal profiles join the sections and provide for services routing paths m
0.4 – 0.8 m
0.4 – 1.1 m m

37. Ring with modules

38. G.M. Bilei
Roma Sep Meeting with referees