1. Thin film depositions: the Ion Plating technique
HeRe in Italy
RFS
Thin film depositions: the Ion Plating technique
Carlo Misiano
Romana Film Sottili
Anzio Italy
Frascati

2. Thin film depositions: the Ion Plating technique
Contents
Introduction to the PVD ;
Thin film formation and ADATOM phase;
Ion Plating configuration;
Ion Plating Plasma Assisted IPPA
New High Density Plasma Processes;
Conclusions.
Acknowledgments

3. Thin film depositions: the Ion Plating technique
THE FORMATION OF A THIN FILM BY TECHNICAL PVD CAN 'BE DIVIDED INTO THREE PHASES: VAPORIZATION Represents the phase through which the material to be deposited is led to the gas phase. The most characteristic elements of this phase are:
The energy with which particles are emitted from the source material and the eventual
Percentage of particles emitted in the ionized form.

4. Thin film depositions: the Ion Plating technique
TRANSFER Represents the phase during which the material to be deposited is transferred from the source to the substrates.   The most characteristic elements of this phase are the interactions with the residual gas environment, and possible effects due to interaction with plasmas and electric and / or on magnetic fields for ionized particles.

5. Thin film depositions: the Ion Plating technique
DEPOSITION 1. CONDENSATION      The vaporized particle loses energy reaching the substrate in contact, but it still maintains an average enough to move on its surface; 2. MIGRATION       The particle condensed, which at this stage is called ADATOM, migrates on the surface of the substrate gradually losing energy or possibly acquiring, in case of presence of ion bombardment, particle or photon. 3. NUCLEATION       The particle stops in a site whose binding energy is greater than the energy remaining to the ADATOM.

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9. Thin film depositions: the Ion Plating technique
The family of Ion Plating technologies is characterized by at least one of these two elements: - The depositing particles are energized, after the vaporization, before reaching the substrate; - The growing film is subjected to an
ions or particles bombardment;

10. Thin film depositions: the Ion Plating technique
EFFECTS OF IONIC BOMBARDMENT DURING THE FILM DEPOSITION - ENERGIZING OF “ADATOMS” BEFORE NUCLEATION - "MIXING" SUBSTRATE SURFACE - FILM - RI-SPUTTERING OF PARTICLES WEAKLY BONDED - FILM ‘COMPACTING” - DESORPTION OF GASEOUS INCLUSION

11. Thin film depositions: the Ion Plating technique
Ion bombardment

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19. Thin film depositions: the Ion Plating technique Ion Plating with Cathodic Arc

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Reactive Low Voltage Ion Plating

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PLAD

23. Thin film depositions: the Ion Plating techniqueB
In figure A and B are reported the energy distributions without (A) and
with a bias of 40 V (B) for various ions inside an IPPA MS Process

24. Thin film depositions: the Ion Plating technique
We selected Ion Plating Plasma Assisted (IPPA) with Magnetron Sputtering source or Thermal source, in order to achieve, higher quality, lower costs, respect to the usual vacuum processes, higher isotropy of deposited layers and the possibility to realize new treatments.

25. Thin film depositions: the Ion Plating technique
IPPA shows the following characteristics:
Sputter cleaning of the substrates
Energization of condensing particles and ionic bombardment of the growing film that increase the “Adatom” phase life,
Deposition on substrates at room temperature;
Deposition in “Dirty Vacuum Conditions”
Substrate cleaning and deposition in the same vacuum cycle
Higher deposition rate in reactive processes;

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With IPPA processes it is possible to deposit films having
a thickness up to 100 microns without delamination;
Films deposited by IPPA show higher density and compactness

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Thorton Zone Structure Model

28. A structure zone diagram including plasma based deposition and ion etching

29. Thin film depositions: the Ion Plating technique
High Power Pulsed Magnetron Sputtering, HPPMS is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely high power densities of the order of kWcm−2 in short pulses (impulses) of tens of microseconds at low duty cycle (on/off time ratio) of < 10%. A distinguishing feature of HIPIMS is its high degree of ionisation of the sputtered metal and high rate of molecular gas dissociation.

30. Thin film depositions: the Ion Plating technique
Conclusions
After the results obtained and in particular:
Dramatic cut of the costs due to the use of sputter cleaning and the possibility to deposit at room temperature;
Good mechanical and environmental properties;
Process absolutely clean and safe;
We can conclude that the IPPA processes really represent a new important step in evolution of thin film vacuum deposition

31. Thin film depositions: the Ion Plating technique
I wish to thank first of all
Donald Mattox
For the invention of Ion Plating
Acknowledgments

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And You For the kind attention