1. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Schematic illustration of a blister test

2. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Schematic of boundary conditions applied in axisymmetric 2D model of blister test

3. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Deflection versus pressure curve for an ideal stretching case; finite element method results and analytical solutions are compared

4. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Blister profile before and after a delamination of Δa = 75 μm obtained from the FEA analysis: the case of Fig. 3 with Pcrit = 10 psi

5. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
G versus Δa plot for numerically determined energy release rate for the case shown in Fig. 4

6. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Deflection versus pressure curve for a blister test specimen with an intermediate thickness

7. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Deflection versus pressure curve for intermediate case with several pseudomaterial property pairs to fit experimental curve

8. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Copper substrates for blister test samples (a) before and (b) after attaching the stencil

9. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Schematic of sample preparation procedure: (a) creating temporary plug, (b) creating the predefined area, (c) curing the adhesive, and (d) the final sample ready for testing

10. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Schematic diagram of the blister test setup

11. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Representative deflection versus pressure curves for an epoxy/copper interface at as-is testing conditions

12. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
A typical blister sample (a) before and (b) after critical delamination event

13. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Representative deflection versus pressure curves for an epoxy/copper sample at three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation

14. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Energy release rate comparison of three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation

15. Date of download: 10/19/2017
Copyright © ASME. All rights reserved.
From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
J. Electron. Packag. 2016;138(4): doi: /
Figure Legend:
Moduli comparison of three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation