1. 3-D IC Fabrication and Devices
Abstract:
3-D integrated circuits utilize z-axis allowing unique fabrications designs. This utilization allows cheaper, more compact, and efficient integrated circuits.
Thong Moua
Monday April 11th 2016

2. Outline Background information Introduction to 3D IC
Fabrication
Benefits/issues
Current technology
Applications

3. Background info How integrated circuits are made
Silicon ingot is grown
Sliced into wafers
Chip design is etched on
Wafer is diced according to chip

6. Introduction to 3-D IC’s
A Single Circuit with two or more layers of active components connected by TVS
Utilizes the z-directional axis to improve performance, reduce power, etc.

8. Four main types of Fabrication
Monolithic
Wafer-on-Wafer
Die-On-Wafer
Die-On-Die

9. Fabrication (Wafer-on-Wafer)
Components are built on two or more wafers
Wafers are aligned accordingly
Bonding of the two wafers
Thinning of wafers (can be done before or after bonding)
Wafer is diced

10. Benefits of 3D IC Lower fabrication cost Save space
Allows for miniaturization
Improved performance
Better bandwidth
Reduced power

11. Issues with 3D IC Yield Heat Design complexity Testing
Lack of standards

12. Current technology

13. SIP (system in packaging)
SiP is multiple bare dice and/or chips mounted on a common substrate, which is used to connect them all together. Packaged together.

14. 2.5D integrated Circuits
Package-on-Package (PoP)

15. 3D technology

16. Applications
True 3d IC is still in need of further research and development.
Monolithic IC 3D inc.
3D Logic
3D memory
3D electro optics
DRAM (Intel and micron hybrid memory cube)

18. Xilinx 3D IC

19. Conclusion
3-D integrated circuits is the next step in increasing performance of our technology. Its unique design in the z-axis allows for profound benefits, but at a cost of heat, complexity, etc. However further research and development can minimize the cons and allow a more commercialized product.

20. References
wide-io-hbm-and-hybrid-memory-cube
All Images provided by Google

21. 5 key concepts
3D IC is a integrated circuit by stacking wafers/dies so they behave as one single device.
Four main types of fabrication; Monolithic, Wafer-on-Wafer, Die-on- Wafer, Die-on-Die
Benefits of 3D IC
Issues of 3D IC
Applications; HMC and Vertex t