1. Current activities in Kyushu for Silicon-ECAL
Taikan Suehara (Kyushu University, Japan)
H. Hirai, H. Sumida, S. Takada, T. Tomita, Y. Miyazaki, H. Ueno, Y. Sudo, T. Yoshioka, K. Kawagoe

2. Topics Sensor study Mass production
Optimization (stopped: will resume soon)
DAQ
Misc

3. Laser injection I/V dependence on temperature/humidity Production plan
Sensor study
Laser injection
I/V dependence on temperature/humidity
Production plan

4. Sensors
4 x 4 pixels
5.5 x 5.5 mm pixel, 320 mm thick 16 x 16 pix (full, not used) 3x3/4x4 (baby)
65 V full depletion voltage
Made by Hamamatsu
3 x 3 pixels
Guard ring (GR):
To raise breakdown voltage
Cause ring events, dead region
Baby chips
0GR (4x4)
1GR (3x3)
2GR (split, 4x4)
4GR (split, 3x3)

5. Laser Injection chip laser system microscope Camera XY stage ←BOX
response of pixel close to laser point
chip
laser system
microscope
Camera
XY stage
←BOX
preamplifier
laser point
BOX
pixel
edge

6. Laser response
no GR
No.10-1
1GR
2 GR (split)
No.2-2
1GR

7. Temperature and Humidity dependence Setup
Si-pad
insulation sheet
copper sheet
Voltage generator
and
Ammeter
Thermohygrostat
BOX

8. results
Error bars: RMS of several meas. (shows reproducibility) (devided by sqrt(N))
No clear difference seen on GR types
Fit to the temperature dependence differs from theoretical

9. Sensor study summary & plan
We’re studying guard ring effects
Crosstalk at edge seen on 1-GR no-split and not seen in split and no GR
I/V on Temperature and Humidity consistent
Breakdown voltage: 0 GR OK up to V (slightly lower BR in 0GR seen)
Crosstalk in pixels will be investigated using meshed electrodes

10. Mass production

11. Comments on mass production
Hamamatsu said:
8 inch is possible, but not desired for HPK standard thickness is mm extra cost for thinner (due to grinding) resistivity is smaller ( more bias voltage) simple patterns only
6 inch: sensors of 320 and 500 mm thickness cost almost the same 650 mm, 10-15% raise on cost < 300 mm, 70% raise on cost 70,000 chips/year (ILD DBD: ~ 5 years)
500 mm, 6 inch currently seems the best

12. A procedure for mass production
Chips from Hamamatsu
IV/CV tested in Hamamatsu
Laser scan on every pixel on bare chips
Dead pixels (no reply, strange reply)
Connecting pixels (crosstalk)
Glued to PCB/SKIROC, making slabs
Test with RI source (57Co or 90Sr)
Gain calibration
Noise

13. Springs or conductor sheet
Plan of laser scan
readout (SKIROC?)
Laser beam
Put the IR laser beam at every gap between the pixels using XYZ stage
Check gain (roughly) and leakage (connecting) pixel on each pixel before gluing Should be short time eg. 2 sec/gap, 300 pad/day (can be loosen if we have multiple stations)
PCB with many holes
Springs or conductor sheet
Si sensor
Electrode
XYZ stage
Laser beam

14. Slab test with RI source
slabs
Calibration of gain and noise with electronics
90Sr (2.28 MeV (Max) e-)
MIP-like signals (non-monochromatic)
Dependence on angle to source
57Co (122 & 136 keV (10%) g) life: 0.7 yr
quasi-Monochromatic gamma, easy to calibrate
only ~2% stops at 500 mm silicon: scattering background
< 1 hour of accumulation time required

15. Plan to assemble a test station
57Co will arrive in Oct. 90Sr already available
XYZ automated stage: order soon
PCB with holes: should design
DAQ: firstly CAMAC with non-full channel (eg. 16 channels)
Plan to establish them within this fiscal year (~Mar. 2015)
DAQ with SKIROC: next fiscal year

16. Optimization

17. Optimization: plan
We’d like to quantize the effect of different detector sizes/number of layers/etc.
Low energy: intrinsic resolution of calorimeters  layer configuration
High energy: confusion  overall size, cell size
Investigating effects to physics is critical
We’ll resume the effort soon

18. Injection study Online monitor Integration to EUDAQ

19. Injection study A quick theme for DAQ performance analysis
We imported LLR setup at this spring with a FEV8 slab with the calicoes software at that time
“Injection” is a function of SKIROC to put “charge” from outside (eg. FG) to each input channel before preamp
Injection channel can be specified in SKIROC configuration

22. Injection summary & plan
In the injection study,
Crosstalk at neighbor pixel seen
Baseline shift is also seen
We’ll move to
Cosmic and RI for getting energy calibration
S-scan for determine noise level
Analysis help to identify DAQ issues
Testboard for BGA SKIROC under design

23. Online monitor

25. DAQ development plans in Kyushu
Ongoing
Online monitor
Connection to external framework (EUDAQ or others)
Planned after looking at new calicoes
Flexible logging system
C++ support module
Enforce analysis/debugging

26. Topics about EUDAQ connection
Structure
Data format (LCIO)
Schedule/Plan

27. EUDAQ structure
Calice Producer
TCP connection
calicoes / others

28. Data format in LCIO Store ‘hit’-like objects
We have ‘CalorimeterHit’ class in LCIO
Need threshold – not always suitable for low-level analysis (cross talk etc.)
Store simple array of raw data  planned
More flexibility; hit-like data can be created from the raw array
Need more steps for high-level analysis
No specific LCIO structure, use LCGenericObject with attachment class

29. LCIO: GenericObject LCIO Event  1 RC
- LCIO collections  1 types of data (SiADC, ScADC, ScTDC etc.)
LCIO objects LCGenericObject
 1 chip of data
LCGenericObject can save one array (int, float, double)
dataDescription
in every object can be used for tags, eg. “LDA=1;DIF=2;BX=10;”

30. Current status
Succeeded to run EUDAQ with CaliceProducer producing dummy data encoded to LCIO object and save to LCIO file using DataCollector Ready to attach to calicoes/others

31. Things to do EUDAQ part Writing TCP adapter
Converter from raw to LCIO (if needed)
calicoes part
Attachment of calicoes to output data to TCP
Integration and test
Testbeam at CERN: 26 Nov. – 8 Dec.

32. ILC in Japan Next CALICE meeting
Misc
ILC in Japan
Next CALICE meeting

33. MEXT Y. Okada, 7 Sep. 2014 Task Force Review by
Science Council of Japan
MEXT
Task Force
Particle・Nuclear Physics WG
Academic Experts Committee
TDR Validation WG
February 6, 2014
May 8, 2014
TDR Validation
Value Estimation for Quake-Proof
Value Estimation for Environmental Improvement
Total Value Estimation
Clarification of
ILC Physics
Review Issues
2013
2014
2015
2016
Y. Okada, 7 Sep. 2014

34. Summary Action Plan before Construction Y. Okada, 7 Sep. 2014 ① ② ③ ④⑤ ⑥ ⑦ ⑧ ⑨
Site-Dependent Value
(LCC-PreLab)
Y. Okada, 7 Sep. 2014

35. Next CALICE meeting 16-18 March 2015 @ Kyushu University
2.5 Million population
1000 km west from Tokyo

36. Summary Sensor – 1GR non-split disfavored our baseline – 0GR
Mass production – laser & RI test scheme will be checked later in this FY (-Mar. 2015)
Optimization – will resume
DAQ – should be rapidly developed towards combined TB Nov.-Dec. this year
We look forward to see you in Kyushu!