1. CPU1 Block Specifications
Description:
Primary processing core for bus
Handles processing of RF data
Receives Inputs from UI and Setup blocks and responds appropriately
Performance Requirements:
Power Inputs:
3.3 VDC Input
Electrical Interfaces:
10 bit Digital Line Interface to RF Block
6 bit Digital input from Setup Block
8 bit Digital I/O with User Interface 1
Operator Outputs:
Digital signal to LCD display

2. CPU1 Block Specifications
Standard Requirements:
Environment:
Operating Temperature Range: -40 to 70 °C
Operating Humidity Range: 2 to 98 %
Storage Temperature Range: -30 to 80 °C
Storage Humidity Range: 2 to 98 %
Life Cycle:
Production Life: 5 Years
Full Warranty Period: 1 Year
Service Strategy: Distributor Repair
Mechanical:
Block Mass: .5 Kg
Block PCB area: 60 cm2

3. CPU1 Block Specifications
Internal Block Diagram
UI I/O 8 Data Lines
U.I.1 Block
Setup Block
6 Data Lines
Atmel Processor
RF I/O 10 Data Lines
RF Block
Power Supply
5V DC

4. CPU1 Block Specifications
CPU Pin Configurations / Prototype board details
CPU AT89S PIN DIP TYPE, RUN MHz
8 KBYTE PROGRAM MEMORY FLASH IN CPU AT89S8252
2 K BYTE EEPROM DATA IN CPU AT89S8252
32 BIT I/O PORT CPU AT89S8252 I/O 34 PIN ET BUS
A/D 12 BIT 2 CH LTC 1298 (OPTION)
REAL TIME CLOCK RTC DS1307 (OPTION)
32 KBYTE EEPROM 24LC256 (OPTION)
20 PIN BUS CPU 89C2051/1051/4051 DIP TYPE ... CPU 20 PIN (AT89C1051/2051/4051) 14 PIN LCD PORT (CHARACTER TYPE)
RS232 PORT MAX232 ON BOARD ... RS422, RS485, IC (OPTION)
7805 POWER SUPPLY ON BOARD
PCB SIZE 14.5 X 6 CM

5. CPU1 Block Specifications
CP-S8252 V1.0 Development Board Schematic

6. CPU1 Block: Signal Table
Power
Digital

7. CPU1 Block Specifications
Passive Discrete Specifications
Component
Nominal Value
Tolerance around nominal
Derated Power Capacity
Maximum Working Voltage
Composition
Q – factor (tan δ)
Package
Capacitor C1
22pF 5%
N/A
1KV
Ceramic
≥.025
Surface Mount
Capacitor C2
Capacitor C3
4.7uF
Capacitor C4
10uF
Capacitor C5
Capacitor C6
Capacitor C7
Capacitor C8
Capacitor C9
470uF
Capacitor C10
.1uF
Capacitor C11
Capacitor C12
.625uF
Resistor R1
8.2KΩ
10% 2W
Resistor R2
.33KΩ
Resistor R3
1KΩ
Resistor R4
10KΩ
Resistor R5
Resistor R6
32.768KΩ
Resistor R7
Resistor R8
Resistor R9

8. CPU1 Block Specifications
Analog DFM Analysis
Component
Fosc
Package
Crystal Oscillator
18.432MHz
Surface Mount Device

9. CPU1 Block Digital Block DFM - DC Drive Analysis Table
Device
Output
Type
Input Type
Tech Type
DC Drive Device Parameters
Vil
max
Vih
min
Iil (-)
Max
Iih
Vol
Voh
Iol
Ioh (-)
Min
Vhyst
Checked
AT89S8252
Std
CMOS
.9V
1.9V
-50uA
N/A
.5V
2.4V
1.6mA
-.8mA

10. CPU1 Block Digital Block DFM - Timing Analysis Table
Dig Signal
Output
Type
Input Type
Timing Parameters
Other
Tsu
Setup Th
Thold
Marg
Fmax F
Tpulse
Min
Checked
Digital I/O
Std
277ns
0ns
24MHz
20nS

11. CPU1 Block Specifications
Prototyping Plan:
Use Atmel ATMega chip as a microprocessor
Use the development board to prototype block
Program system incrementally, testing modular interfaces such as I/O based on temporary mock-ups on a breadboard before item is complete
Costs:
Atmel Board = $38
Maximum Block Cost = $18
Maximum Mfg Assembly / Test Cost per Block = $4

12. CPU1 Block Prototyping Plan
Name
Block Area (cm2)
Total PCB
Area (cm2)
PCB
Substrate Type
Comp
Attachment Type
Socketed
Components
Types of
Connectors
CPU 1
121
Plastic pads, no busses
Prototype board
None
0.25 headers